A low-cost, highly-conductive polyvinyl alcohol flexible film with Ag-microsheets and AgNWs as fillers

RSC Advances ◽  
2016 ◽  
Vol 6 (84) ◽  
pp. 80905-80909 ◽  
Author(s):  
Yongyun Mao ◽  
Junmei Guo ◽  
Changyi Hu ◽  
Hongwei Yang ◽  
Yuwen Yang ◽  
...  
Keyword(s):  
Polyvinyl Alcohol ◽  
Low Cost ◽  
High Conductivity ◽  
Conductive Films ◽  
Flexible Film ◽  
Conductive Film ◽  
Ag Nanowires

Low-cost, high-conductivity flexible conductive films were fabricated using Ag-microsheets, Ag-nanowires (AgNWs) and polyvinyl alcohol (PVA) as conducting agents. The flexible conductive film shows good conductivity under stretching.

scholarly journals Flexible, Transparent, and Conductive Film Based on Random Networks of Ag Nanowires

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Shunhua Wang ◽  
Xu Zhang ◽  
Weiwei Zhao
Keyword(s):  
Sheet Resistance ◽  
Optical Transmittance ◽  
Surface Resistivity ◽  
Random Networks ◽  
Transparent Electronics ◽  
Heating Systems ◽  
Conductive Films ◽  
Conductive Film ◽  
Ag Nanowires ◽  
Resistance Decrease

Flexible, transparent, and conductive films based on random networks of Ag nanowires were prepared by vacuum-filtrating method. The size of Ag nanowires prepared by hydrothermal method is uniform, with a relatively smaller diameter and a longer length, thereby achieving a high aspect ratio (>1000). The films fabricated by Ag nanowires exhibit the excellent transparency with a 92% optical transmittance and a low surface resistivity of 11 Ωsq−1. Importantly, both the transmittance and sheet resistance decrease with the increasing of the Ag nanowires contents. When the contents of Ag nanowires are up to 200 mg/m2especially, the surface resistivity quickly falls below 5 Ωsq−1. Also, these films are robust, which have almost no change in sheet resistance after the repeating bends over 200 cycles. These encouraging results may have a potential application in flexible and transparent electronics and other heating systems.

Improvement of Ti/RuO2–IrO2 Anode Lifetime and Electrocatalytical Properties by Using an Eco-Friendly Thermal Decomposition Method Using Polyvinyl Alcohol as Solvent

2019 ◽  
Author(s):  
Charlys Bezerra ◽  
Géssica Santos ◽  
Marilia Pupo ◽  
Maria Gomes ◽  
Ronaldo Silva ◽  
...  
Keyword(s):  
Thermal Decomposition ◽  
Polyvinyl Alcohol ◽  
High Efficiency ◽  
Electrochemical Impedance ◽  
Pechini Method ◽  
Low Cost ◽  
Charge Transfer Resistance ◽  
Transfer Resistance ◽  
Calcination Temperatures ◽  
Service Lifetime

<p>Electrochemical oxidation processes are promising solutions for wastewater treatment due to their high efficiency, easy control and versatility. Mixed metal oxides (MMO) anodes are particularly attractive due to their low cost and specific catalytic properties. Here, we propose an innovative thermal decomposition methodology using <a>polyvinyl alcohol (PVA)</a> as a solvent to prepare Ti/RuO<sub>2</sub>–IrO<sub>2</sub> anodes. Comparative anodes were prepared by conventional method employing a polymeric precursor solvent (Pechini method). The calcination temperatures studied were 300, 400 and 500 °C. The physical characterisation of all materials was performed by X-ray diffraction and scanning electron microscopy coupled with energy dispersive spectroscopy, while electrochemical characterisation was done by cyclic voltammetry, accelerated service lifetime and electrochemical impedance spectroscopy. Both RuO<sub>2</sub> and IrO<sub>2</sub> have rutile-type structures for all anodes. Rougher and more compact surfaces are formed for the anodes prepared using PVA. Amongst temperatures studied, 300 °C using PVA as solvent is the most suitable one to produce anodes with expressive increase in voltammetric charge (250%) and accelerated service lifetime (4.3 times longer) besides reducing charge-transfer resistance (8 times lower). Moreover, the electrocatalytic activity of the anodes synthesised with PVA toward the Reactive Blue 21 dye removal in chloride medium (100 % in 30 min) is higher than that prepared by Pechini method (60 min). Additionally, the removal total organic carbon point out improved mineralisation potential of PVA anodes. Finally, this study reports a novel methodology using PVA as solvent to synthesise Ti/RuO<sub>2</sub>–IrO<sub>2</sub> anodes with improved properties that can be further extended to synthesise other MMO compositions.</p>

scholarly journals Microstructure and Thermoelectric Properties of (Bi0.48Sb1.52)Te3 Thick Films Prepared with Tape Casting Method

Electronics ◽  
2021 ◽  
Vol 10 (2) ◽  
pp. 140
Author(s):  
Lichen Liu ◽  
Ziping Cao ◽  
Min Chen ◽  
Jun Jiang
Keyword(s):  
Thermoelectric Properties ◽  
Low Cost ◽  
Thick Films ◽  
Tape Casting ◽  
Casting Process ◽  
Casting Method ◽  
Glass Substrates ◽  
Conductive Films ◽  
Casting Technology

This paper reports the fabrication and characterization of (Bi0.48Sb1.52)Te3 thick films using a tape casting process on glass substrates. A slurry of thermoelectric (Bi0.48Sb1.52)Te3 was developed and cured thick films were annealed in a vacuum chamber at 500–600 °C. The microstructure of these films was analyzed, and the Seebeck coefficient and electric conductivity were tested. It was found that the subsequent annealing process must be carefully designed to achieve good thermoelectric properties of these samples. Conductive films were obtained after annealing and led to acceptable thermoelectric performance. While the properties of these initial materials are not at the level of bulk materials, this work demonstrates that the low-cost tape casting technology is promising for fabricating thermoelectric modules for energy conversion.

Polymer Ligand Design and Surface Modification of Ag Nanowires toward Color-Tone-Tunable Transparent Conductive Films

2021 ◽  
Vol 13 (11) ◽  
pp. 13705-13713
Author(s):  
Shoma Kitamura ◽  
Motoyuki Iijima ◽  
Junichi Tatami ◽  
Tsubasa Fuke ◽  
Takashi Hinotsu ◽  
...  
Keyword(s):  
Surface Modification ◽  
Ligand Design ◽  
Color Tone ◽  
Transparent Conductive Films ◽  
Conductive Films ◽  
Ag Nanowires ◽  
Polymer Ligand

Packaging Materials for 2.5/3D Technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000276-000284 ◽  
Author(s):  
Brian Schmaltz
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Yield ◽  
Wafer Level ◽  
Reflow Process ◽  
Thermal Compression ◽  
Conductive Films ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

Flexible film-based thermoelectric generators

MRS Advances ◽  
2019 ◽  
Vol 4 (30) ◽  
pp. 1691-1697
Author(s):  
Shuping Lin ◽  
Wei Zeng ◽  
Lisha Zhang ◽  
Xiaoming Tao
Keyword(s):  
Seebeck Coefficient ◽  
Thermoelectric Generator ◽  
Low Cost ◽  
Thermoelectric Generators ◽  
Polystyrene Sulfonate ◽  
Paper Substrate ◽  
Thermoelectric Element ◽  
Flexible Film ◽  
P Type ◽  
Flexible Thermoelectric

ABSTRACT:The present work highlights the progress in the field of flexible thermoelectric generator (f-TEGs) fabricated by 3-D printing strategy on the typing paper substrate. In this study, printable thermoelectric paste was developed. The dimension of each planer thermoelectric element is 30mm*4mm with a thickness of 50 μm for P-type Bismuth Tellurium (Bi2Te3)-based/ poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) leg. A single thermoleg with this dimension can generate a voltage of 5.38 mV at a temperature difference of 70 K. The calculated Seebeck Coefficient of a single thermoleg is 76.86 μV/K. This work demonstrates that low-cost printing technology is promising for the fabrication of f-TEGs.

Optical and electrical properties and simulation curves of NiO/Al/NiO transparent conductive film

2019 ◽  
Vol 33 (01) ◽  
pp. 1850417 ◽  
Author(s):  
Shuyun Wang ◽  
Kailin Wen ◽  
Yang Sun ◽  
Xianwu Xiu ◽  
Shuyun Teng ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Metal Film ◽  
Room Temperature ◽  
Optical And Electrical Properties ◽  
Light Wavelength ◽  
Conductive Films ◽  
Conductive Film ◽  
Average Transmittance ◽  
Interface Characteristics ◽  
Experimental Data Analysis

In this paper, NiO/Al/NiO transparent conductive films were prepared by magnetron sputtering at the room temperature. Effects of the NiO and Al layers thicknesses on the optical and electrical properties of the NiO/Al/NiO laminated films were analyzed. When the light wavelength falls in range 300–900 nm, with the increase of the NiO and Al layers thicknesses, the transmittance of the laminated film first increases significantly and then decreases slightly, finally tends to be stable. The laminated film obtained the best optical and electrical properties when the NiO layer is 40 nm and the Al layer is 12 nm. The maximum transmittance is 83%, the average transmittance is 77.3%, the film resistivity is [Formula: see text] and the carrier concentration is [Formula: see text]. At the same time, the transmittance of laminated film is simulated by FDTD software. But the simulation curve is different from the experimental data. Analysis results show that, with the NiO dielectric is added on both sides of the metal Al film, the light reflection characteristic of laminated film has been completely different from that of the single Al metal film because of the change of interface characteristics between Al film and NiO film, and the actual luminous transmittance greatly increases.

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