Improvement of interfacial strength and thermal stability of carbon fiber composites by directly grafting unique particles: functionalized mesoporous silicas

RSC Advances ◽  
2016 ◽  
Vol 6 (84) ◽  
pp. 80485-80492 ◽  
Author(s):  
Lin Jin ◽  
Mengjie Zhang ◽  
Honglong Li ◽  
Ming Li ◽  
Lei Shang ◽  
...  

A facile process was used to introduce vinyl functionalized mesoporous silicas onto a carbon fiber to improve the interfacial strength of composites.

2019 ◽  
Author(s):  
Seyed Hossein Mamanpush ◽  
Azadeh Tavousi Tabatabaei

Isothermal Thermogravimetric Analysis (TGA) is a technique in which the mass of a substance is monitored as a function of time as the sample specimen is subjected to a controlled temperature program in a controlled atmosphere. In this research, isothermal TGA was carried out to determine the thermal stability of the recycled epoxy-based and vinyl ester-based carbon fiber composite (CFC). The specimens were heated at constant temperature under nitrogen and air. We evaluate the influence of different temperature on the degradation of recycled CFCs. Results indicate that different temperature has significant influence on the degradation of the recycled CFC under nitrogen.


2019 ◽  
Vol 40 (S2) ◽  
pp. E1831-E1839 ◽  
Author(s):  
Xiangtian Cheng ◽  
Zhuojian He ◽  
Yuancong Luo ◽  
Xiaoqing Zhang ◽  
Caihong Lei

2020 ◽  
Vol 41 (12) ◽  
pp. 5072-5081
Author(s):  
Meiling Yan ◽  
Weicheng Jiao ◽  
Jun Li ◽  
Yifan Huang ◽  
Zhenming Chu ◽  
...  

2020 ◽  
Vol 18 (47) ◽  
pp. 55-61
Author(s):  
Reem Y. Mahmood ◽  
Aseel Alobaedy

    This research study the effect of surface modification and copper (Cu) plating carbon fiber (CF) surface on the thermal stability and wettability of carbon fiber (CF)/epoxy (EP) composites. The TGA result indicates that the thermal-stability of carbon fiber may be enhanced after Cu coating CF. TGA curve showed that the treatment temperature was enhanced thermal stability of Ep/CF, this is due to the oxidation during heating. The Cu plating increased the thermal conductivity, this increase might be due to reduce in contact resistance at the interface due to chemical modification and copper plating and tunneling resistance.    The increase of surface polarity after coating cause decrease in  the value of contact angle. As well as the increase of CuO as a function of the heat temperature cause the rapid contact angle decrease and can strongly enhance the wettability.  


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