The influence of the interface between mica and epoxy matrix on properties of epoxy-based dielectric materials with high thermal conductivity and low dielectric loss

RSC Advances ◽  
2016 ◽  
Vol 6 (86) ◽  
pp. 83163-83174 ◽  
Author(s):  
Hailin Mo ◽  
Genlin Wang ◽  
Fei Liu ◽  
Pingkai Jiang
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
Epoxy Matrix ◽  
Polymer Coating ◽  
Dielectric Materials ◽  
Epoxy Composites ◽  
Low Dielectric ◽  
Overall Performance ◽  
Strategy I

Two strategies, including in situ grafting chemicals and polymer coating micas, were used to improve the interface between mica and epoxy matrix. The epoxy composites prepared by strategy I exhibited better overall performance.

scholarly journals Preparation and properties of MWCNTs-BNNSs/epoxy composites with high thermal conductivity and low dielectric loss

2020 ◽  
Vol 24 ◽  
pp. 100985 ◽  
Author(s):  
Rui Wang ◽  
Congzhen Xie ◽  
Shoukang Luo ◽  
Huasong Xu ◽  
Bin Gou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Low Dielectric

An in situ (K0.5Na0.5)NbO3-doped barium titanate foam framework and its cyanate ester resin composites with temperature-stable dielectric properties and low dielectric loss

2019 ◽  
Vol 3 (4) ◽  
pp. 726-736 ◽  
Author(s):  
Longhui Zheng ◽  
Li Yuan ◽  
Guozheng Liang ◽  
Aijuan Gu
Keyword(s):  
Dielectric Properties ◽  
Dielectric Loss ◽  
Barium Titanate ◽  
Cyanate Ester ◽  
Resin Composites ◽  
Cyanate Ester Resin ◽  
Low Dielectric ◽  
Doped Barium Titanate

High-k composites with temperature-stable dielectric properties and low dielectric loss obtained through building a network with in situ-doped barium titanate foam.

Thermal conductivity study of porous low K dielectric materials

1999 ◽  
Vol 565 ◽  
Author(s):  
Chuan Hu ◽  
Michael Morgen ◽  
Paul S. Ho ◽  
Anurag Jain ◽  
William. N. Gill ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Materials ◽  
Porous Films ◽  
Low Dielectric ◽  
Omega Method ◽  
3 Omega ◽  
Low Dielectric Constant Materials ◽  
Low K ◽  
Method Analysis

AbstractA quantitative characterization of the thermal properties is required to assess the thermal performance of low dielectric constant materials. Recently we have developed a technique based on the 3-omega method for measuring the thermal conductivity of porous dielectric thin films. In this paper we present the results on the measurements of thermal conductivity of thin porous films using this method. A finite element method analysis is used to evaluate the approximations used in the measurement. Two porosity-weighted thermal resistor models are proposed to interpret the results. By studying the dependence of the thermal conductivity on porosity, we are able to discuss the scaling rule of thermal conductivity. Additionally, a steady state layered heater model is used for evaluating the significance of introducing porous ILDs into an interconnect structure.

scholarly journals Thermal Conductivity of Carbon Nanoreinforced Epoxy Composites

2016 ◽  
Vol 2016 ◽  
pp. 1-12 ◽  
Author(s):  
C. Kostagiannakopoulou ◽  
E. Fiamegkou ◽  
G. Sotiriadis ◽  
V. Kostopoulos
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Carbon Fiber ◽  
Multiwalled Carbon Nanotubes ◽  
Epoxy Matrix ◽  
Epoxy Composites ◽  
Graphite Nanoplatelets ◽  
Multiwalled Carbon ◽  
Micromechanical Models ◽  
Carbon Fiber Epoxy

The present study attempts to investigate the influence of multiwalled carbon nanotubes (MWCNTs) and graphite nanoplatelets (GNPs) on thermal conductivity (TC) of nanoreinforced polymers and nanomodified carbon fiber epoxy composites (CFRPs). Loading levels from 1 to 3% wt. of MWCNTs and from 1 to 15% wt. of GNPs were used. The results indicate that TC of nanofilled epoxy composites increased with the increase of GNP content. Quantitatively, 176% and 48% increase of TC were achieved in nanoreinforced polymers and nanomodified CFRPs, respectively, with the addition of 15% wt. GNPs into the epoxy matrix. Finally, micromechanical models were applied in order to predict analytically the TC of polymers and CFRPs. Lewis-Nielsen model with optimized parameters provides results very close to the experimental ones in the case of polymers. As far as the composites are concerned, the Hashin and Clayton models proved to be sufficiently accurate for the prediction at lower filler contents.

A High Throughput Search of Dielectric Thin Films for Tunable Devices

2006 ◽  
Vol 45 ◽  
pp. 2351-2354
Author(s):  
Ji Won Choi ◽  
Chong Yun Kang ◽  
Jin Sang Kim ◽  
Seok Jin Yoon ◽  
Hyun Jai Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Rf Magnetron Sputtering ◽  
Dielectric Materials ◽  
Si Substrate ◽  
Dielectric Thin Films ◽  
Low Dielectric ◽  
Film Dielectric

The dielectric properties of (Ba,Sr)TiO3 (BSTO) and Zr doped BSTO thin films have been investigated to identify candidate thin film dielectric materials having low dielectric loss without degradation of the tunability by continuous composition spread (CCS) technique using off-axis rf magnetron sputtering. The optimized properties of BSTO thin films deposited on Pt/SiO2/Si substrate by CCS were dielectric loss 0.031, tunability 31.5, respectively. The optimized properties of Zr doped BSTO thin films deposited on Pt/SiO2/Si substrate by CCS were improved by dielectric loss 42%, FOM 68% at the same BSTO composition, respectively. To confirm the dielectric properties and compositions by CCS technique, Zr doped BSTO bulk ceramics were evaluated.

scholarly journals Preparation and characterization of isotactic polypropylene/MgO composites as dielectric materials with low dielectric loss

2013 ◽  
Vol 121 (1416) ◽  
pp. 606-610 ◽  
Author(s):  
Susumu TAKAHASHI ◽  
Yusuke IMAI ◽  
Akinori KAN ◽  
Yuji HOTTA ◽  
Hirotaka OGAWA
Keyword(s):  
Dielectric Loss ◽  
Isotactic Polypropylene ◽  
Dielectric Materials ◽  
Low Dielectric

Hot-pressing sintered AlN-BN ceramics with high thermal conductivity and low dielectric loss

2020 ◽  
Vol 46 (6) ◽  
pp. 8431-8437
Author(s):  
Pei Yang ◽  
Lixiang Wang ◽  
Weihua Zhao ◽  
Laixin Cai ◽  
Yongbao Feng
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
Hot Pressing ◽  
High Thermal Conductivity ◽  
Low Dielectric
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