Chelation as a strategy to reinforce cationic copper surface protection in acidic solutions

RSC Advances ◽  
2016 ◽  
Vol 6 (72) ◽  
pp. 68351-68356 ◽  
Author(s):  
Liang Cai ◽  
Xue-Qing Feng ◽  
Xin Hua ◽  
Xiao-Peng He ◽  
Yi-Tao Long ◽  
...  
Keyword(s):  
Corrosion Inhibitors ◽  
Copper Surface ◽  
Copper Surfaces ◽  
Surface Protection ◽  
Acidic Solutions ◽  
Promising Strategy

Surface chelation has been demonstrated to be a promising strategy to address repulsion between protonated corrosion inhibitors and ionized copper surfaces in acids.

Effect of Tetrazolic Corrosion Inhibitors on the Corrosion and Electrochemical Behavior of Steel in Phosphoric Acidic Solutions

2014 ◽  
Vol 14 (2) ◽  
pp. 32-39
Author(s):  
Dmitrii Nikolaevich Komov ◽  
◽  
A. Machmmod Adiba ◽  
Asel Askarovna Matikenova ◽  
Lyudmila Anatolievna Isaicheva ◽  
...  
Keyword(s):  
Electrochemical Behavior ◽  
Corrosion Inhibitors ◽  
Acidic Solutions

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Denglin Fu ◽  
Yanan Wen ◽  
Jida Chen ◽  
Lansi Lu ◽  
Ting Yan ◽  
...  
Keyword(s):  
Corrosion Inhibitor ◽  
Corrosion Inhibitors ◽  
Printed Circuit Board ◽  
Copper Surface ◽  
Etching Process ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Etching Method ◽  
Electrolytic Etching

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

Pool Boiling Heat Transfer of Water on Hydrophilic Surfaces With Different Wettability

2016 ◽  
Author(s):  
Adam R. Girard ◽  
Jinsub Kim ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Copper Surface ◽  
Contact Angles ◽  
Copper Surfaces ◽  
Nanoscale Structures ◽  
Flat Surfaces ◽  
Hydrophilic Surfaces ◽  
Alkali Solutions

The effect of wettability on boiling heat transfer (BHT) coefficient and critical heat flux (CHF) in pool boiling of water on hydrophilic surfaces having different contact angles was investigated. Hot alkali solutions were utilized to promote cupric and cuprous oxide growth which exhibited micro and nanoscale structures on copper surfaces, with thicknesses on the order of a couple of micrometers. These structure and surface energy variations result in different levels of wettability and roughness while maintaining the effusivity of the bare copper surface. The study showed that the BHT coefficient has an inverse relationship to wettability; the BHT coefficient decreases as wettability increases. Furthermore, it was shown that this dependency between BHT coefficient and wettability is more significant than the relationship between BHT coefficient and surface roughness. The CHF was also found to increase with increases in wettability and roughness. For the most hydrophilic surface tested in this study, CHF values were recorded near the 2,000 kW/m2 mark. This value is compared with maximum values reported in literature for water on non-structured flat surfaces without area enhancements. Based on these results it is postulated that there exists a true hydrodynamic CHF limit for pool boiling with water on flat surfaces, very near 2,000 kW/m2, independent of heater material, representing an 80% increase in the limit suggested by Zuber [1].

Studies of Copper Surfaces modified by Thermal and Plasma Treatments

2000 ◽  
Vol 612 ◽  
Author(s):  
G.P. Beyer ◽  
M. Baklanov ◽  
T. Conard ◽  
K. Maex
Keyword(s):  
Chemical Composition ◽  
Thermal Treatment ◽  
Photoelectron Spectroscopy ◽  
Hydrogen Plasma ◽  
Copper Film ◽  
Copper Surface ◽  
Ex Situ ◽  
Clean Room ◽  
Copper Surfaces ◽  
The Difference

AbstractIt was found that copper surfaces, which had been exposed to a clean room atmosphere, were covered by a layer, whose chemical composition can be described by Cu(OH)2·CuCO3. This layer can effectively be removed by either a short thermal treatment in vacuum at 350°C, a hydrogen plasma treatment, or a combination of both. Ex-situ photoelectron spectroscopy measurements show little difference of the chemical composition of the surface after the respective treatments. The thermal treatment, however, gives rise to re-crystallisation of the copper film due to the difference in temperature of deposition and the anneal. Ex-situ ellipsometry measurements indicate that the hydrogen plasma not only removes Cu(OH)2·CuCO3 but also passivates the copper surface.

scholarly journals Recent Natural Corrosion Inhibitors for Mild Steel: An Overview

2016 ◽  
Vol 2016 ◽  
pp. 1-7 ◽  
Author(s):  
Marko Chigondo ◽  
Fidelis Chigondo
Keyword(s):  
Mild Steel ◽  
Corrosion Inhibitors ◽  
Impurity Content ◽  
Environmentally Benign ◽  
Acidic Solutions ◽  
Treatment Techniques ◽  
Organic Inhibitors ◽  
Prevention Methods ◽  
Metallic Corrosion ◽  
Work Done

Traditionally, reduction of corrosion has been managed by various methods including cathodic protection, process control, reduction of the metal impurity content, and application of surface treatment techniques, as well as incorporation of suitable alloys. However, the use of corrosion inhibitors has proven to be the easiest and cheapest method for corrosion protection and prevention in acidic media. These inhibitors slow down the corrosion rate and thus prevent monetary losses due to metallic corrosion on industrial vessels, equipment, or surfaces. Inorganic and organic inhibitors are toxic and costly and thus recent focus has been turned to develop environmentally benign methods for corrosion retardation. Many researchers have recently focused on corrosion prevention methods using green inhibitors for mild steel in acidic solutions to mimic industrial processes. This paper provides an overview of types of corrosion, corrosion process, and mainly recent work done on the application of natural plant extracts as corrosion inhibitors for mild steel.

Enabling Low Temperature Copper Bonding with an Organic Monolayer

2009 ◽  
Vol 74 ◽  
pp. 133-136 ◽  
Author(s):  
Ang Xiao Fang ◽  
Jun Wei ◽  
Chen Zhong ◽  
Wong Chee Cheong
Keyword(s):  
Bonding Temperature ◽  
Copper Surface ◽  
Mems Devices ◽  
Ambient Conditions ◽  
Copper Surfaces ◽  
Organic Monolayer ◽  
Metallurgical Bonding ◽  
Alternative Approach ◽  
Copper Material ◽  
Joint Integrity

Typically, copper material is used as a bonding material in MEMs devices for its excellent mechanical, electrical and hermetic properties. Direct copper bonding, however, requires high temperature (>300°C) to forge a bond due to the oxidative nature of copper. In this study, using an alternative approach based on an organic monolayer coating, we demonstrate metallurgical bonding between two copper surfaces under ambient condition at low bonding temperature below 140°C, while maintaining reliable mechanical joint integrity of 50MPa. This monolayer is believed to behave as a passivation layer, protecting the copper surface against oxidation under ambient conditions. In contrast to a bulk oxide layer, this layer can be easily displaced during mechanical deformation at the bonding interface.

Enhanced Copper Surface Protection in Aqueous Solutions Containing Short-Chain Alkanoic Acid Potassium Salts

Langmuir ◽  
2007 ◽  
Vol 23 (22) ◽  
pp. 11281-11288 ◽  
Author(s):  
Esta Abelev ◽  
David Starosvetsky ◽  
Yair Ein-Eli
Keyword(s):  
Aqueous Solutions ◽  
Copper Surface ◽  
Short Chain ◽  
Potassium Salts ◽  
Alkanoic Acid ◽  
Surface Protection

TERTIARY KETONIC MANNICH BASES AS CORROSION INHIBITORS FOR ALUMINUM DISSOLUTION IN ACIDIC SOLUTIONS

2009 ◽  
Vol 197 (3) ◽  
pp. 366-376 ◽  
Author(s):  
A. S. Fouda ◽  
G. Y. El Ewady ◽  
H. A. Mostafa ◽  
Y. M. El-Toukhee
Keyword(s):  
Corrosion Inhibitors ◽  
Mannich Bases ◽  
Acidic Solutions

Evaporation of Silver-Graphene Hybrid Nanofluid Droplet on its Nanostructured Residue and Plain Copper Surfaces at Elevated Temperatures

2020 ◽  
Author(s):  
Farooq Riaz Siddiqui ◽  
Chi Yan Tso ◽  
Sau Chung Fu ◽  
Huihe Qiu ◽  
Christopher Yu Hang Chao
Keyword(s):  
Substrate Temperature ◽  
Evaporation Rate ◽  
Elevated Temperatures ◽  
Droplet Evaporation ◽  
Copper Surface ◽  
Copper Plate ◽  
Hybrid Nanofluid ◽  
Copper Surfaces ◽  
Latent Energy ◽  
Droplet Sizes

Abstract Droplet evaporation is an efficient process as it removes a large amount of heat by using the latent energy, making it suitable for heat transfer applications. In this research, evaporation of the silver-graphene hybrid nanofluid (SGHF) droplet, because of its synergistic thermal conductivity, is investigated for substrate temperature in a range of 25–100 °C. The experiments for droplet evaporation were performed in an environmental facility for two droplet sizes, 3 μL and 30 μL volume, on a copper plate. A 100 W silicone heater mat was used to heat the copper plate from the underside, while two T-type thermocouples were used to monitor its surface temperature. As droplet evaporation ended, a porous residue was formed on the copper surface. Subsequently, a 3 μL volume of the SGHF droplet was dispensed on the porous residue surface. The results showed a tremendous rise in the evaporation rate (up to 160%) for the subsequent SGHF droplet sitting on the porous residue as compared to the non-wetted copper surface. Moreover, the evaporation rate of the SGHF droplet on the copper surface increased up to 56% as compared to the water droplet for a substrate temperature range of 25–100 °C.

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