A new concept for electroless nickel plating: aluminium as reducing agent

RSC Advances ◽  
2016 ◽  
Vol 6 (36) ◽  
pp. 30695-30698 ◽  
Author(s):  
Xingkai Zhang ◽  
Junyan Zhang
Keyword(s):  
Corrosion Resistance ◽  
Electroless Plating ◽  
Electroless Nickel ◽  
Reducing Agents ◽  
Reducing Agent ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Nickel Coatings ◽  
Excellent Corrosion Resistance

Aluminum was used as a reducing agent for preparing nickel coatings with excellent corrosion resistance from electroless plating baths containing no reducing agents.

scholarly journals 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2015 ◽  
Vol 2015 ◽  
pp. 1-11
Author(s):  
Ahmet Ozan Gezerman ◽  
Burcu Didem Çorbacıoğlu
Keyword(s):  
Waste Water ◽  
Electroless Plating ◽  
Thioglycolic Acid ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Bath ◽  
Bath Solution ◽  
Microscope Images

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

A ZERO-EMISSION ELECTROLESS NICKEL PLATING BATH

2019 ◽  
Vol 26 (01) ◽  
pp. 1850130
Author(s):  
WANMIN LIU ◽  
QILONG LIU ◽  
LV XU ◽  
MULAN QIN ◽  
JIYONG DENG
Keyword(s):  
Phosphorus Content ◽  
Electroless Nickel ◽  
Raw Material ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Hypophosphorous Acid ◽  
Plating Bath ◽  
Excellent Corrosion Resistance ◽  
Zero Emission ◽  
Better Than

A zero-emission electroless nickel plating bath was investigated, which consisted of nickel hypophosphite, hypophosphorous acid, lithium acetate, citric acid and maleic acid. The bath stability, bath life and plating rate were 68.0[Formula: see text]min, 8 cycles and 13.39[Formula: see text][Formula: see text]m/h, respectively. The Ni–P plating layer showed smooth appearance with lots of small continuous nodules, with 12.23[Formula: see text]wt.% phosphorus content. The electrochemical measurements showed that the deposit exhibited excellent corrosion resistance. All of these properties of the zero-emission plating bath and its deposit were better than those of the popular plating solution and its layer. It is most significant that the spent plating bath can be used directly as a raw material to prepare LiFePO4/C materials, which conforms to the concept of circular economy.

Electroless Nickel Plating on Copper Foil

2014 ◽  
Vol 926-930 ◽  
pp. 103-107
Author(s):  
Zuo Qin Tang ◽  
Su Rong Hu ◽  
Yin Chun Chao
Keyword(s):  
Corrosion Resistance ◽  
Potentiodynamic Polarization ◽  
Copper Foil ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Nacl Solution ◽  
Tribological Behaviour ◽  
Microhardness Tester

A pre-cleaning and an electroless nickel plating (EN-HP) were applied to copper foil to improve its tribological behaviour and corrosion resistance. The coating porosity was measured by the corrodkote, tribological behaviour was measured with microhardness tester and a CSM ball-on-disk tribometer, corrosion resistance was measured by potentiodynamic polarization in 3.5 wt.% NaCl solution. Matte nickel plating (mNi) and moderate compact Ni–P coating (EN-MP) were made as comparisons to EN-HP in those tests. By deposition of EN-HP, both coating porosity and tribological behaviour are greatly improved compared to mNi, and the corrosion resistance is distinctly ameliorated to the comparisons. Above research demonstrates that the copper foil with EN-HP coating is good underlay in assemblage of machine.

A Novel Method for Preparing Electroconductive Cotton Fabric

2011 ◽  
Vol 287-290 ◽  
pp. 2713-2716 ◽  
Author(s):  
Feng Wang ◽  
Bao Ran Li ◽  
Yue Qi ◽  
Sheng Dong Liu ◽  
Li Juan Wang
Keyword(s):  
Cotton Fabric ◽  
Electroless Plating ◽  
Electroless Nickel ◽  
Cotton Fabrics ◽  
The Novel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Cotton Fibres ◽  
Naoh Solution ◽  
Novel Method

Cotton fabrics were used as substrate to develop an electroconductive textile. Due to hydrophilia and porosity of cellulose, a novel electroless nickel plating process was attempted, in which activation and electroless plating were combined. In order to improve the wettability of cotton fibres, specimens were treated by NaOH solution and were bleached in NaClO solution. Then, the treated fabric was plated by using the novel process. The surface resistivity of the plated specimens reached to 15.34 mΩ·cm, which indicated the plated cotton fabrics have good conductivity.

On Reducing Agents in Electroless Nickel Plating Solution

1961 ◽  
Vol 12 (6) ◽  
pp. 222-225
Author(s):  
Satoru ISHIBASHI ◽  
Hiroharu YOKOYAMA ◽  
Yasutoshi NAGASE
Keyword(s):  
Electroless Nickel ◽  
Reducing Agents ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Solution
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