Electro-conductively deposited carbon fibers for power controllable heating elements

RSC Advances ◽  
2015 ◽  
Vol 5 (34) ◽  
pp. 26998-27002 ◽  
Author(s):  
Chang Hyo Kim ◽  
Moo Sung Kim ◽  
Yoong Ahm Kim ◽  
Kap Seung Yang ◽  
Seung Jo Baek ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Electrical Conductivity ◽  
Carbon Fibers ◽  
Industrial Applications ◽  
Excellent Thermal Stability

Carbon fibers are considered as one of the promising heating elements in various industrial applications because of their excellent thermal stability and electrical conductivity.

Surface modification of PE/PET by two-step method with graphene and silver nanoparticles for enhanced electrical conductivity

2021 ◽  
pp. 152808372098589
Author(s):  
Tingting Zhuo ◽  
Zhuoming Chen ◽  
Binjie Xin ◽  
Yingqi Xu ◽  
Yingjie Song ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Electrical Conductivity ◽  
Silver Nanoparticles ◽  
Surface Modification ◽  
Wearable Electronics ◽  
Step Method ◽  
Excellent Thermal Stability ◽  
Nonwoven Fabrics ◽  
Dipping Process ◽  
Composite Fabrics

Polyethylene/polyethylene terephthalate (PE/PET) nonwoven fabrics were first modified with a continuous graphene layer by using a dipping process, and then deposited with silver nanoparticles (AgNPs) by using magnetron sputtering, and that is a novel method called two-step method. Graphene/PE/PET (GPP) and AgNPs sputtered GPP (AGPP) were prepared to investigate the modification processes on the electrical conductivity of the nonwoven fabrics. The influence of the surface modification by silane coupling agent (KH-560) on the durability of conductive PE/PET composited fabrics is also studied. Surface morphology, chemical structure, thermal stability, electrical conductive and ultraviolet protection properties of the composite fabrics were investigated. The results indicated KH-560 treatment can obviously improve the interfacial adhesion between the graphene and PE/PET then contributes to the enhanced conductive durability of the composite fabrics. The combination of graphene and AgNPs provided more opportunities for the charge transfer paths of AGPP, leading to an improved conductive network and an increased electrical conductivity. In addition, graphene and AgNPs gave GPP and AGPP excellent thermal stability. The research exhibited the advantages of the two-step method, and also indicated AGPP has a promising application for the preparation of wearable electronics.

scholarly journals Stable, Ductile and Strong Ultrafine HT-9 Steels via Large Strain Machining

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2538 ◽  
Author(s):  
Osman El-Atwani ◽  
Hyosim Kim ◽  
Jonathan G. Gigax ◽  
Cayla Harvey ◽  
Berk Aytuna ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Large Strain ◽  
Cost Effective ◽  
Industrial Applications ◽  
Excellent Thermal Stability ◽  
Transmission Electron ◽  
Cost Effective Method ◽  
Dislocation Densities ◽  
Thermal Stability Of

Beyond the current commercial materials, refining the grain size is among the proposed strategies to manufacture resilient materials for industrial applications demanding high resistance to severe environments. Here, large strain machining (LSM) was used to manufacture nanostructured HT-9 steel with enhanced thermal stability, mechanical properties, and ductility. Nanocrystalline HT-9 steels with different aspect rations are achieved. In-situ transmission electron microscopy annealing experiments demonstrated that the nanocrystalline grains have excellent thermal stability up to 700 °C with no additional elemental segregation on the grain boundaries other than the initial carbides, attributing the thermal stability of the LSM materials to the low dislocation densities and strains in the final microstructure. Nano-indentation and micro-tensile testing performed on the LSM material pre- and post-annealing demonstrated the possibility of tuning the material’s strength and ductility. The results expound on the possibility of manufacturing controlled nanocrystalline materials via a scalable and cost-effective method, albeit with additional fundamental understanding of the resultant morphology dependence on the LSM conditions.

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

scholarly journals Boosted piezoelectricity with excellent thermal stability in tetragonal NaNbO3-based ceramics

2020 ◽  
Author(s):  
Lu Wang ◽  
Shengdong Sun ◽  
Huajie Luo ◽  
Yang Ren ◽  
Hui Liu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Temperature Stability ◽  
Lead Free ◽  
Excellent Thermal Stability ◽  
Lead Free Ceramics ◽  
Piezoelectric Performance

The realization of high piezoelectric performance and excellent temperature stability simultaneously in lead-free ceramics is the key for replacing Pb-containing perovskites in industry. In this study, large piezoelectric performance (d33...

scholarly journals Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Qingzhong Mao ◽  
Yusheng Zhang ◽  
Yazhou Guo ◽  
Yonghao Zhao
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Electrical Conductivity ◽  
Yield Strength ◽  
High Speed ◽  
Copper Wire ◽  
Rapid Development ◽  
Dislocation Slip ◽  
Ultrafine Grains ◽  
The Wire

AbstractThe rapid development of high-speed rail requires copper contact wire that simultaneously possesses excellent electrical conductivity, thermal stability and mechanical properties. Unfortunately, these are generally mutually exclusive properties. Here, we demonstrate directional optimization of microstructure and overcome the strength-conductivity tradeoff in copper wire. We use rotary swaging to prepare copper wire with a fiber texture and long ultrafine grains aligned along the wire axis. The wire exhibits a high electrical conductivity of 97% of the international annealed copper standard (IACS), a yield strength of over 450 MPa, high impact and wear resistances, and thermal stability of up to 573 K for 1 h. Subsequent annealing enhances the conductivity to 103 % of IACS while maintaining a yield strength above 380 MPa. The long grains provide a channel for free electrons, while the low-angle grain boundaries between ultrafine grains block dislocation slip and crack propagation, and lower the ability for boundary migration.

scholarly journals The influence of an ultra-high resistivity Ta underlayer on perpendicular magnetic anisotropy in Ta/Pt/Co/Pt heterostructures

RSC Advances ◽  
2020 ◽  
Vol 10 (19) ◽  
pp. 11219-11224
Author(s):  
Wei Zhang ◽  
Xiaoxiong Jia ◽  
Rui Wang ◽  
Huihui Liu ◽  
Zhengyu Xiao ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Magnetic Anisotropy ◽  
High Stability ◽  
Essential Role ◽  
Perpendicular Magnetic Anisotropy ◽  
Low Energy ◽  
High Resistivity ◽  
Excellent Thermal Stability ◽  
Low Energy Consumption

Thin films with perpendicular magnetic anisotropy (PMA) play an essential role in the development of technologies due to their excellent thermal stability and potential application in devices with high density, high stability, and low energy consumption.

Preparation of polyetheretherketone composites with nanohydroxyapatite rods and carbon nanofibers having high strength, good biocompatibility and excellent thermal stability

RSC Advances ◽  
2016 ◽  
Vol 6 (23) ◽  
pp. 19417-19429 ◽  
Author(s):  
Kai Wang Chan ◽  
Cheng Zhu Liao ◽  
Hoi Man Wong ◽  
Kelvin Wai Kwok Yeung ◽  
Sie Chin Tjong
Keyword(s):  
Thermal Stability ◽  
Carbon Nanofibers ◽  
Hybrid Composite ◽  
High Strength ◽  
Excellent Thermal Stability ◽  
Good Biocompatibility

The WST-1 assay shows that the PEEK/15 vol% nHA–1.9 vol% CNF hybrid composite has excellent biocompatibility.

Sign in / Sign up

Export Citation Format

Share Document