Tuning thermal contact conductance at graphene–copper interfaceviasurface nanoengineering
Keyword(s):
By introducing a surface nanoengineering design at sub-nm level, the thermal contact resistance between graphene and copper is reduced by 17% due to enhanced phonon couplings across the interface.
1999 ◽
2010 ◽
Vol 64
(1)
◽
pp. 1-24
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