High-performance ultralow dielectric constant carbon-bridged mesoporous organosilica films for advanced interconnects

2014 ◽  
Vol 2 (32) ◽  
pp. 6502-6510 ◽  
Author(s):  
Tao Jiang ◽  
Bao Zhu ◽  
Shi-Jin Ding ◽  
Zhongyong Fan ◽  
David Wei Zhang

Mesoporous organosilica (MO) films are prepared using precursor 1,2-bis(triethoxysilyl)ethane (BTEE) and porogen template poly(ethylene oxide)–poly(propylene oxide)–poly(ethylene oxide) (P123).

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