How microstructures affect air film dynamics prior to drop impact

Soft Matter ◽  
2014 ◽  
Vol 10 (21) ◽  
pp. 3703 ◽  
Author(s):  
Roeland C. A. van der Veen ◽  
Maurice H. W. Hendrix ◽  
Tuan Tran ◽  
Chao Sun ◽  
Peichun Amy Tsai ◽  
...  
Keyword(s):  
Drop Impact ◽  
Air Film

scholarly journals How Does an Air Film Evolve into a Bubble During Drop Impact?

2012 ◽  
Vol 109 (20) ◽  
Author(s):  
Ji San Lee ◽  
Byung Mook Weon ◽  
Jung Ho Je ◽  
Kamel Fezzaa
Keyword(s):  
Drop Impact ◽  
Air Film

Air film contact modes of drop impact on lubricated surfaces under reduced pressures

2021 ◽  
Vol 33 (9) ◽  
pp. 092110
Author(s):  
Lige Zhang ◽  
Tejaswi Soori ◽  
Arif Rokoni ◽  
Allison Kaminski ◽  
Ying Sun
Keyword(s):  
Drop Impact ◽  
Air Film ◽  
Reduced Pressures

Thin film instability driven dimple mode of air film failure during drop impact on smooth surfaces

2021 ◽  
Vol 6 (4) ◽  
Author(s):  
Lige Zhang ◽  
Tejaswi Soori ◽  
Arif Rokoni ◽  
Allison Kaminski ◽  
Ying Sun
Keyword(s):  
Thin Film ◽  
Drop Impact ◽  
Smooth Surfaces ◽  
Film Instability ◽  
Air Film ◽  
Film Failure

Reply to “Comments on ‘Energy Dissipation During Water Drop Impact In Shallow Pools’”

1986 ◽  
Vol 50 (6) ◽  
pp. 1644-1645
Author(s):  
Alfredo G. Ferreira ◽  
Bruce E. Larock ◽  
Michael J. Singer
Keyword(s):  
Energy Dissipation ◽  
Water Drop ◽  
Drop Impact

Drop impact on solids: contact-angle hysteresis filters impact energy into modal vibrations

2021 ◽  
Vol 923 ◽  
Author(s):  
Vanessa R. Kern ◽  
Joshua B. Bostwick ◽  
Paul H. Steen
Keyword(s):  
Contact Angle ◽  
Impact Energy ◽  
Contact Angle Hysteresis ◽  
Drop Impact

Abstract

scholarly journals The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 503
Author(s):  
Jaehyun Lee ◽  
Ehsan Esmaili ◽  
Giho Kang ◽  
Baekhoon Seong ◽  
Hosung Kang ◽  
...  
Keyword(s):  
Solid Phase ◽  
Critical Factor ◽  
Air Pressure ◽  
Conical Shape ◽  
Electric Stress ◽  
Bottom Interface ◽  
Electric Pressure ◽  
Pressure Stress ◽  
Air Film

The dimple occurs by sudden pressure inversion at the droplet’s bottom interface when a droplet collides with the same liquid-phase or different solid-phase. The air film entrapped inside the dimple is a critical factor affecting the sequential dynamics after coalescence and causing defects like the pinhole. Meanwhile, in the coalescence dynamics of an electrified droplet, the droplet’s bottom interfaces change to a conical shape, and droplet contact the substrate directly without dimple formation. In this work, the mechanism for the dimple’s suppression (interfacial change to conical shape) was studied investigating the effect of electric pressure. The electric stress acting on a droplet interface shows the nonlinear electric pressure adding to the uniform droplet pressure. This electric stress locally deforms the droplet’s bottom interface to a conical shape and consequentially enables it to overcome the air pressure beneath the droplet. The electric pressure, calculated from numerical tracking for interface and electrostatic simulation, was at least 108 times bigger than the air pressure at the center of the coalescence. This work helps toward understanding the effect of electric stress on droplet coalescence and in the optimization of conditions in solution-based techniques like printing and coating.

scholarly journals Thixotropy in viscoplastic drop impact on thin films

2021 ◽  
Vol 6 (4) ◽  
Author(s):  
Samya Sen ◽  
Anthony G. Morales ◽  
Randy H. Ewoldt
Keyword(s):  
Thin Films ◽  
Drop Impact

Drop impact reliability testing for lead-free and lead-based soldered IC packages

2006 ◽  
Vol 46 (7) ◽  
pp. 1160-1171 ◽  
Author(s):  
Desmond Y.R. Chong ◽  
F.X. Che ◽  
John H.L. Pang ◽  
Kellin Ng ◽  
Jane Y.N. Tan ◽  
...  
Keyword(s):  
Drop Impact ◽  
Lead Free ◽  
Reliability Testing ◽  
Impact Reliability
Sign in / Sign up

Export Citation Format

Share Document