A long-term oxidation barrier for copper nanowires: graphene says yes

2015 ◽  
Vol 17 (6) ◽  
pp. 4231-4236 ◽  
Author(s):  
Liangjing Shi ◽  
Ranran Wang ◽  
Haitao Zhai ◽  
Yangqiao Liu ◽  
Lian Gao ◽  
...  
Keyword(s):  
Oxidation Kinetics ◽  
Copper Nanowires ◽  
Cu Nanowires ◽  
Stability Investigation

Cu nanowire oxidation kinetics is proposed, and the protecting mechanism of transferred graphene on Cu nanowires is proved by stability investigation.

Cost-effective aqueous-phase synthesis of long copper nanowires

RSC Advances ◽  
2015 ◽  
Vol 5 (102) ◽  
pp. 83880-83884 ◽  
Author(s):  
Zengmin Tang ◽  
Aasim Shahzad ◽  
Woo-Sik Kim ◽  
Taekyung Yu
Keyword(s):  
Aqueous Phase ◽  
Cost Effective ◽  
Chloride Ions ◽  
Copper Nanowires ◽  
Phase Synthesis ◽  
Cu Nanowires ◽  
Term Stability ◽  
Long Term Stability

This work describes a simple and cost-effective aqueous-phase synthesis of Cu nanowires with long-term stability. Chloride ions and branched polyethyleneimine (BPEI) were found to be of great importance to the formation and stabilization of Cu nanowires.

Electrochemical Degradation of p-Nitrophenol on Cu Nanowires and Nanocubes

2019 ◽  
Vol 814 ◽  
pp. 76-82 ◽  
Author(s):  
Wen Ming Zhang ◽  
Mu Wei Ji ◽  
Jin Wang
Keyword(s):  
Catalytic Activity ◽  
Copper Nanowires ◽  
Electrochemical Degradation ◽  
One Pot ◽  
Cu Nanowires ◽  
First Order ◽  
Cu Catalysts ◽  
Nitrophenol Degradation

{100}-faceted copper nanostructures with different morphology of nanowires and nanocubes have been prepared by one-pot method. The electroactivity of Cu nanowires and nanocubes was evaluated by degradation of p-nitrophenol. As-prepared copper nanowires exhibit higher catalytic activity for p-nitrophenol degradation than copper nanocubes, and outperform most of Cu catalysts reported in literature. Electrochemical reductive reaction of p-nitrophenol is shown to be kinetically first-order.

Promising wet chemical strategies to synthesize Cu nanowires for emerging electronic applications

Nanoscale ◽  
2015 ◽  
Vol 7 (41) ◽  
pp. 17195-17210 ◽  
Author(s):  
D. V. Ravi Kumar ◽  
Kyoohee Woo ◽  
Jooho Moon
Keyword(s):  
Chemical Synthesis ◽  
Copper Nanowires ◽  
Cu Nanowires ◽  
Wet Chemical Synthesis ◽  
Wet Chemical ◽  
Chemical Strategies

This review summarizes the wet chemical synthesis strategies, properties, and applications of copper nanowires.

Nonlinear Optical Properties of Controlled Fabrication of Copper Nanowires by a Shadow Deposition

2012 ◽  
Vol 622-623 ◽  
pp. 777-780
Author(s):  
Kitsakorn Locharoenrat
Keyword(s):  
Optical Properties ◽  
Cross Section ◽  
Nonlinear Optical ◽  
Second Harmonic ◽  
Geometrical Shape ◽  
Copper Nanowires ◽  
Cu Nanowires ◽  
Aspect Ratios ◽  
Materials Used ◽  
New Applications

The strongly geometrical shape, high aspect ratios, and nanoscale cross-section of nanowires is expected to affect optical properties through confinement effects. Herein we have investigated optical properties of Cu nanowires with studies of second harmonic generation (SHG) spectra. These optical properties of Cu nanowires will be one of the most important issues when considering the types of materials used in current applications and development of new applications.

scholarly journals HIGH TEMPERATURE OXIDATION OF TI-6AL-4V ALLOY FABRICATED BY ADDITIVE MANUFACTURING. INFLUENCE ON MECHANICAL PROPERTIES

2020 ◽  
Vol 321 ◽  
pp. 03006
Author(s):  
Antoine CASADEBAIGT ◽  
Daniel MONCEAU ◽  
Jonathan HUGUES
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Additive Manufacturing ◽  
Titanium Alloys ◽  
Oxidation Kinetics ◽  
High Temperature Oxidation ◽  
Effect Of Temperature ◽  
Premature Failure ◽  
Temperature Oxidation

Titanium alloys, such as Ti-6Al-4V alloy, fabricated by additive manufacturing processes is a winning combination in the aeronautic field. Indeed, the high specific mechanical properties of titanium alloys with the optimized design of parts allowed by additive manufacturing should allow aircraft weight reduction. But, the long term use of Ti-6Al-4V alloy is limited to 315 °C due to high oxidation kinetics above this temperature [1]. The formation of an oxygen diffusion zone in the metal and an oxide layer above it may reduce the durability of titanium parts leading to premature failure [2, 3]. In this study, Ti-6Al-4V alloy was fabricated by Electron Beam Melting (EBM). As built microstructure evolutions after Hot Isostatic Pressure (HIP) treatment at 920 °C and 1000 bar for 2h were investigated. As built microstructure of Ti-6Al-4V fabricated by EBM was composed of Ti-α laths in a Ti-β matrix. High temperature oxidation of Ti-6Al-4V alloy at 600 °C of as-built and HIP-ed microstructures was studied. This temperature was chosen to increase oxidation kinetics and to study the influence of oxidation on tensile mechanical properties. In parallel, two other oxidation temperatures, i.e. 500 °C and 550°C allowed to access to the effect of temperature on long-term oxidation.

Stirring revealed new functions of ethylenediamine and hydrazine in the morphology control of copper nanowires

Nanoscale ◽  
2019 ◽  
Vol 11 (24) ◽  
pp. 11902-11909 ◽  
Author(s):  
Juan Zhang ◽  
Xiaona Li ◽  
Dongmei Liu ◽  
Shuai Wang ◽  
Jiaxu Yan ◽  
...  
Keyword(s):  
Morphology Control ◽  
Copper Nanowires ◽  
Cu Nanowires

New roles of ethylenediamine and hydrazine in synthesizing Cu nanowires are identified under the inspiration of stirring-based morphology control.

Effect of Template Materials on the Top Morphologies of Cu Nanowires

2004 ◽  
Vol 818 ◽  
Author(s):  
Ran-Jin Lin ◽  
Luh-Huei Wu ◽  
Ching-Hsiang Tsai ◽  
Chien-Min Sung
Keyword(s):  
Interface Energy ◽  
Aluminum Film ◽  
Copper Nanowires ◽  
Alumina Film ◽  
Alumina Template ◽  
Polycarbonate Membrane ◽  
Cu Nanowires ◽  
The Difference ◽  
Nano Wires ◽  
Dc Current

AbstractAn array of copper nanowires (50-110 nm in diameters) was deposited by the electrolysis of CuSO4-H2SO4 solution at room temperature using DC current. The array was created by forcing deposited copper to follow a pattern of nano tunnels. These nano tunnels were formed with two different methods: anodizing an aluminum film that coated on a silicon wafer to form nano holes within oxidized alumina, and etching the ion-tracked polycarbonate membrane.The difference in top morphologies of the Cu nanowires in these templates is very marked. The copper nano wires deposited in anodized alumina template form the separate spherical balls with diameter of about 10 νμ on the surface of the alumina film, in spite of the template thickness of only 0.5 νm. In contrast, no such Cu agglomeration was formed with copper nano wires deposited in holes of polycarbonate. This variance in copper morphologies is likely due to the difference of the interface energy between Cu and anodic alumina and that of Cu and polycarbonate.

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