Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

2015 ◽  
Vol 51 (9) ◽  
pp. 1587-1590 ◽  
Author(s):  
Yousef Farraj ◽  
Michael Grouchko ◽  
Shlomo Magdassi
Keyword(s):  
Metal Complex ◽  
Copper Complex ◽  
Inkjet Printing ◽  
Low Cost ◽  
Flexible Substrates

Highly conductive copper patterns on low-cost flexible substrates are obtained by inkjet printing a metal complex based ink.

Design Printable Pressure Sensor Based on 3DP Fabrication

2014 ◽  
Vol 915-916 ◽  
pp. 1135-1139
Author(s):  
Na Li ◽  
Ji Quan Yang ◽  
Hou Yuan Zhou
Keyword(s):  
Pressure Sensor ◽  
Inkjet Printing ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Low Cost ◽  
Power Level ◽  
Dynamic Performance ◽  
Flexible Substrates ◽  
Experimental Measurements ◽  
Pressure Sensitivity

In this paper, a low cost, printable pressure sensor is presented. The pressure sensor will be used in personal navigation system which was designed based on micro jet fabrication structure. Inkjet printing and line patterning methods have been used to fabricate polymer resistors and field effect transistors on flexible substrates. A prototype sensor was designed, and the models of mechnical structure and ditital fabrication was also given, fabricated and tested with standard experimental measurements. Results verify that the pressure sensitivity can be measured for both requency and minimum power level difference in good perforamance. The dynamic performance of pressure sensor was also tested by inkjet printing on to flexible substrates including paper, with high resolution in just seconds.

scholarly journals Shear-Force Sensors on Flexible Substrates Using Inkjet Printing

2019 ◽  
Vol 2019 ◽  
pp. 1-11 ◽  
Author(s):  
Andreas Albrecht ◽  
Mauriz Trautmann ◽  
Markus Becherer ◽  
Paolo Lugli ◽  
Almudena Rivadeneyra
Keyword(s):  
Inkjet Printing ◽  
Shear Force ◽  
Low Cost ◽  
Force Sensor ◽  
Flexible Substrates ◽  
Large Area ◽  
Force Sensitivity ◽  
Sensing Systems ◽  
Force Range ◽  
Printing Techniques

Printing techniques are a promising way of fabricating low-cost electronics without the need for masking and etching. In recent years, additive printing techniques, such as inkjet and screen printing, have been adopted to fabricate low-cost and large-area electronics on flexible substrates. In this work, a three-axial normal and shear force sensor was designed and printed that consists of four miniaturized, printed capacitors. The partially overlapping electrodes are arranged in a manner, so that force sensitivity in orthogonal directions is achieved. A silicone rubber is used as an elastic dielectric and spacer between the two electrodes. The base unit of this sensor has been fabricated using inkjet printing and characterized for normal and shear forces. The force response was investigated in a force range from 0.1 N to 8 N, the normal-force sensitivity was determined to be Sz=5.2 fF/N, and the shear-force sensitivity was Sy=13.1 fF/N. Due to its sensing range, this sensor could be applicable in tactile sensing systems like wearables and artificial electronic skins.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Printing ultrathin graphene oxide nanofiltration membranes for water purification

2017 ◽  
Vol 5 (39) ◽  
pp. 20860-20866 ◽  
Author(s):  
Mahdi Fathizadeh ◽  
Huynh Ngoc Tien ◽  
Konstantin Khivantsev ◽  
Jung-Tsai Chen ◽  
Miao Yu
Keyword(s):  
Graphene Oxide ◽  
Water Purification ◽  
Inkjet Printing ◽  
Low Cost ◽  
Nanofiltration Membranes ◽  
Highly Effective ◽  
First Time ◽  
Polymeric Supports ◽  
Effective Water

We demonstrated for the first time that inkjet printing can be a low-cost, easy, fast, and scalable method for depositing ultrathin (7.5–60 nm) uniform graphene oxide (GO) nanofiltration membranes on polymeric supports for highly effective water purification.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

scholarly journals Circular polarised antenna fabricated with low‐cost 3D and inkjet printing equipment

2017 ◽  
Vol 53 (6) ◽  
pp. 370-371 ◽  
Author(s):  
S. Jun ◽  
B. Sanz‐Izquierdo ◽  
J. Heirons ◽  
C.X. Mao ◽  
S. Gao ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Low Cost

Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages

2019 ◽  
Vol 2019 (1) ◽  
pp. 000163-000168 ◽  
Author(s):  
Sk Yeahia Been Sayeed ◽  
Daniel Wilding ◽  
Jose Solis Camara ◽  
Dieff Vital ◽  
Shubhendu Bhardwaj ◽  
...  
Keyword(s):  
Elastic Deformation ◽  
Low Cost ◽  
Mechanical Deformation ◽  
Flexible Substrates ◽  
Embedded Devices ◽  
Active Device ◽  
Process Flow ◽  
New Class ◽  
Elastomer Composites ◽  
Interconnect Technology

Abstract A new class of interconnects that exhibit resilience to mechanical deformation are demonstrated with flexible fan-out or embedded-die packages. Active device embedding in flexible substrates is accomplished with direct printed interconnects onto die pads. Such a planar fan-out interconnect technology with a low-cost manufacturable process-flow results in the lowest electrical parasitics compared to flipchip with adhesives or printed-ramp interconnections with surface-assembled devices. The interconnects are made with conductive flexible silver-elastomer composites to sustain elastic deformation. The process is also modified to realize flexible backside-assembled fan-out interconnections where the backside of the die is accessible.

scholarly journals Dielectric Properties of Substrates for InkJet Technology in GHz Area

2019 ◽  
Vol 63 (1) ◽  
pp. 9-15
Author(s):  
Tibor Rovensky ◽  
Peter Lukacs ◽  
Alena Pietrikova
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Inkjet Printing ◽  
Measuring Method ◽  
Flexible Substrates ◽  
Network Analyzer ◽  
Dielectric Constant And Loss ◽  
Inkjet Printing Technology ◽  
Specific Material ◽  
Frequency Area

This paper is focused on investigation of dielectric properties of various substrates for InkJet printing technology. In addition this paper included investigation of dielectric properties' homogeneity. Dielectric constant and loss tangent of polymeric flexible substrates (Polyimide DuPont Kapton HN, PET Mylar A, PEN Teonex Q51) and insulation paper (Nomex 410) were measured in GHz frequency area. Measurements were done by combination of vector network analyzer and split cylinder resonator. This measuring method provides dielectric properties at frequency around 10 GHz, the exact value of frequency may vary depends on specific material and its resonant frequency. Experiments included two types of samples, 6 x 6 cm which is recommended area for measurements of dielectric properties by split cylinder resonator and 12 x 12 cm for measurements of dielectric properties' homogeneity (one sheet contains 9 overlapping measuring areas 6 x 6 cm). All measured values of dielectric constant and dielectric losses were statistically processed and depicted by SigmaPlot software. The paper shows values of dielectric properties at GHz frequency area as they are lacking in datasheets from manufacturers and evaluate homogeneity of measured substrates.

scholarly journals One-pot synthesis of a stable and cost-effective silver particle-free ink for inkjet-printed flexible electronics

2020 ◽  
Vol 8 (46) ◽  
pp. 16443-16451
Author(s):  
Wendong Yang ◽  
Florian Mathies ◽  
Eva L. Unger ◽  
Felix Hermerschmidt ◽  
Emil J. W. List-Kratochvil
Keyword(s):  
Flexible Electronics ◽  
Silver Particle ◽  
Low Cost ◽  
Cost Effective ◽  
Good Stability ◽  
Flexible Substrates ◽  
One Pot ◽  
One Pot Synthesis ◽  
Do It Yourself

A do-it-yourself silver particle-free ink is presented, which shows good stability, low cost and excellent printability. The ink is formulated in selected alcohols. Highly conductive silver patterns were printed on both glass and flexible substrates.

Flexible, Monolithically Integrated Cu(In,Ga)Se2 Thin-Film Solar Modules

2005 ◽  
Vol 865 ◽  
Author(s):  
Dirk Herrmann ◽  
Friedrich Kessler ◽  
Ulf Klemm ◽  
Robert Kniese ◽  
Theresa Magorian Friedlmeier ◽  
...  
Keyword(s):  
Thin Film ◽  
Production Process ◽  
Low Cost ◽  
Single Cells ◽  
Production Method ◽  
Flexible Substrates ◽  
Metal Foil ◽  
Monolithically Integrated ◽  
Glass Substrates ◽  
Roll To Roll

AbstractCIGS (Cu(In,Ga)Se2) thin-film solar modules on glass substrates are currently on the verge of commercialization. Entirely new application areas could be accessed with CIGS modules fabricated on thin and flexible non-glass substrates. Additionally, the roll-to-roll manufacturing of such flexible CIGS modules promises to be a low-cost production method. Different external Na supply methods and a vacuum-deposited buffer were investigated in this contribution, a sample of the challenges we face when modifying the standard, industrial CIGS module production process to the particular requirements of flexible substrates. Both metal foil substrates and polymer films are considered. Our excellent best results of above 14 % for single cells on titanium, more than 11% on polyimide, and around 7 % for modules on both substrates indicate our progress in developing flexible CIGS.

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