Current transport mechanism at metal–semiconductor nanoscale interfaces based on ultrahigh density arrays of p-type NiO nano-pillars

Nanoscale ◽  
2013 ◽  
Vol 5 (23) ◽  
pp. 11699 ◽  
Author(s):  
Suman Nandy ◽  
Gonçalo Gonçalves ◽  
Joana Vaz Pinto ◽  
Tito Busani ◽  
Vitor Figueiredo ◽  
...  
Keyword(s):  
Transport Mechanism ◽  
Current Transport ◽  
Current Transport Mechanism ◽  
Nanoscale Interfaces ◽  
Ultrahigh Density ◽  
P Type

Transport Mechanisms in Focused Ion Beam Assisted Ohmic Contacts to p-Type 6H-SiC

2002 ◽  
Vol 742 ◽  
Author(s):  
Agis A. Iliadis
Keyword(s):  
Transport Mechanism ◽  
Ohmic Contacts ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Direct Write ◽  
Current Transport ◽  
Semiconductor Interface ◽  
Current Transport Mechanism ◽  
Surface Modified ◽  
P Type

ABSTRACTThe current transport mechanism in non-annealed Ohmic contact metallizations on p-type 6H-SiC formed by using focused ion beam (FIB) surface-modification and direct-write metal deposition is reported, and the properties of such focused ion beam assisted non-annealed contacts are discussed. The process uses a Ga focused ion beam to modify the surface of the semiconductor with different doses, and then introduces an organometallic compound in the Ga ion beam, to effect the direct-write deposition of a metal on the modified surface. Contact resistance measurements by the transmission line method produced values in the low 10-4 Ω cm2 range for surface-modified and direct-write Pt and W non-annealed contacts, and mid 10-5 Ω cm2 range for surface-modified and pulse laser deposited TiN contacts. The current transport mechanism of these contacts was examined and found to proceed mainly by tunneling through the metal-modified-semiconductor interface layer.

Current Transport Mechanism of n-Type Nanocrystalline FeSi2/Intrinsic Si/p-Type Si Heterojunctions Fabricated by Facing-Targets Direct-Current Sputtering

2013 ◽  
Vol 802 ◽  
pp. 199-203 ◽  
Author(s):  
Nathaporn Promros ◽  
Suguru Funasaki ◽  
Ryūhei Iwasaki ◽  
Tsuyoshi Yoshitake
Keyword(s):  
Ideality Factor ◽  
Low Temperatures ◽  
Transport Mechanism ◽  
Carrier Transport ◽  
Thermionic Emission ◽  
Current Transport ◽  
Current Transport Mechanism ◽  
Current Voltage ◽  
P Type ◽  
Direct Current Sputtering

n-Type nanocrystalline FeSi2/intrinsic Si/p-type Si heterojunctions were successfully fabricated by FTDCS and their forward current-voltage characteristics at low temperatures were analyzed on the basis of thermionic emission theory. The analysis of J-V characteristics exhibits an increase in the ideality factor and a decrease in the barrier height at low temperatures. The values of ideality factor were estimated to be 2.26 at 300 K and 9.29 at 77 K. The temperature dependent ideality factortogether with the constant value of parameter A indicated that a trap assisted multi-step tunneling process is the dominant carrier transport mechanism in this heterojunction. At high voltages, the current transport mechanism is dominated by SCLC process.

Current Transport Mechanism of High-Performance Novel GaN MIS Diode

2021 ◽  
Vol 42 (3) ◽  
pp. 304-307
Author(s):  
Tao Zhang ◽  
Yanni Zhang ◽  
Jincheng Zhang ◽  
Xiangdong Li ◽  
Yueguang Lv ◽  
...  
Keyword(s):  
Transport Mechanism ◽  
High Performance ◽  
Current Transport ◽  
Current Transport Mechanism ◽  
Mis Diode

Temperature dependent current transport mechanism in osmium-doped perovskite yttrium manganite-based heterojunctions

2019 ◽  
Vol 125 (21) ◽  
pp. 214104 ◽  
Author(s):  
F. M. Coșkun ◽  
O. Polat ◽  
M. Coșkun ◽  
A. Turut ◽  
M. Caglar ◽  
...  
Keyword(s):  
Transport Mechanism ◽  
Current Transport ◽  
Temperature Dependent ◽  
Current Transport Mechanism

Current-transport mechanism in Au/V-doped PVC+TCNQ/p-Si structures

2015 ◽  
Vol 29 (13) ◽  
pp. 1550076 ◽  
Author(s):  
H. Tecimer ◽  
Ö. Vural ◽  
A. Kaya ◽  
Ş. Altındal
Keyword(s):  
Temperature Coefficient ◽  
Transport Mechanism ◽  
Forward Bias ◽  
Thermionic Emission ◽  
Negative Temperature ◽  
Positive Temperature ◽  
Current Transport ◽  
Insulator Layer ◽  
Zero Bias ◽  
Current Transport Mechanism

The forward and reverse bias current–voltage (I–V) characteristics of Au/V-doped polyvinyl chloride+Tetracyanoquino dimethane/porous silicon (PVC+TCNQ/p-Si) structures have been investigated in the temperature range of 160–340 K. The zero bias or apparent barrier height (BH) (Φ ap = Φ Bo ) and ideality factor (n ap = n) were found strongly temperature dependent and the value of n ap decreases, while the Φ ap increases with the increasing temperature. Also, the Φ ap versus T plot shows almost a straight line which has positive temperature coefficient and it is not in agreement with the negative temperature coefficient of ideal diode or forbidden bandgap of Si (α Si = -4.73×10-4 eV/K ). The high value of n cannot be explained only with respect to interfacial insulator layer and interface traps. In order to explain such behavior of Φ ap and n ap with temperature, Φ ap Versus q/2kT plot was drawn and the mean value of (Φ Bo ) and standard deviation (σs) values found from the slope and intercept of this plot as 1.176 eV and 0.152 V, respectively. Thus, the modified ( ln (Io/T2)-(qσs)2/2(kT)2 versus (q/kT) plot gives the Φ Bo and effective Richardson constant A* as 1.115 eV and 31.94 A ⋅(cm⋅K)-2, respectively. This value of A*( = 31.94 A⋅( cm ⋅K)-2) is very close to the theoretical value of 32 A ⋅(cm⋅K)-2 for p-Si. Therefore, the forward bias I–V–T characteristics confirmed that the current-transport mechanism (CTM) in Au/V-doped PVC+TCNQ/p-Si structures can be successfully explained in terms of the thermionic emission (TE) mechanism with a Gaussian distribution (GD) of BHs at around mean BH.

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