scholarly journals Complex diffusion behavior of oxygen in nanocrystalline BaTiO3 ceramics

2014 ◽  
Vol 16 (6) ◽  
pp. 2568 ◽  
Author(s):  
Roger A. De Souza ◽  
Christophe Voisin ◽  
Henning Schraknepper ◽  
Markus Teusner ◽  
Markus Kessel ◽  
...  
Keyword(s):  
Diffusion Behavior ◽  
Complex Diffusion ◽  
Nanocrystalline Batio3 Ceramics

Diffusion Behavior of Aluminum Atoms in Hot Dip RE-Aluminizing

2011 ◽  
Vol 328-330 ◽  
pp. 1523-1527
Author(s):  
Wei Zhang ◽  
Ai Ping Liu ◽  
Wen Zhong Jin
Keyword(s):  
Binding Energy ◽  
Energy Dispersive Spectroscopy ◽  
Energy Condition ◽  
Aluminum Atom ◽  
Alloy Layer ◽  
Scanning Electronic Microscopy ◽  
Electronic Microscopy ◽  
Diffusion Behavior ◽  
Vacancy Complex ◽  
Complex Diffusion

The pure aluminized layer and RE-aluminized layer on industrial pure iron were prepared by hot dip aluminizing method, and the thickness and composition of the layer were investigated by means of scanning electronic microscopy (SEM) and energy dispersive spectroscopy (EDS), respectively. The results showed that the RE was permeated into the alloy layer after hot dip RE-aluminizing and the thickness of the alloy layer increases by about 30% as against hot dip pure aluminizing. The binding energy between the vacancy and aluminum atom was calculated. According to the energy condition of the solute-vacancy complex diffusion, it points out that the solute-vacancy complex diffusion is the main mechanism of aluminum atoms diffusion in hot dip RE-aluminizing and the main reason why the thickness of alloy layer increases after hot dip RE-aluminizing.

Sorption and diffusion behavior of actinium(iii) ions in contact with hydroxyapatite as a transporter of medical radionuclides

2020 ◽  
Vol 69 (12) ◽  
pp. 2286-2293
Author(s):  
A. V. Severin ◽  
A. N. Vasiliev ◽  
A. V. Gopin ◽  
K. I. Enikeev
Keyword(s):  
Diffusion Behavior ◽  
And Diffusion ◽  
Medical Radionuclides

scholarly journals A Mechanism of Anti-Oxidation Coating Design Based on Inhibition Effect of Interface Layer on Ions Diffusion within Oxide Scale

Coatings ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 454
Author(s):  
Bo Yu ◽  
Ya Liu ◽  
Lianqi Wei ◽  
Xiaomeng Zhang ◽  
Yingchao Du ◽  
...  
Keyword(s):  
Oxide Scale ◽  
Energy Barrier ◽  
Tetrahedral Site ◽  
Interface Layer ◽  
Diffusion Behavior ◽  
Mullite Phase ◽  
Inhibition Effect ◽  
Coating Design ◽  
Oxidation Effect ◽  
Dynamics Method

In this paper, a mechanism of anti-oxidation coating design based on the inhibition effect of the interface layer on the diffusion of ions within oxide scale was introduced. The Fe2+ ions diffusion behavior in Fe3O4, Cr2FeO4, and FeAl2O4 were studied by molecular dynamics method of Nudged elastic bond. As the result shown, Fe2+ ions tended to diffuse through the vacancy at tetrahedral site in Cr2FeO4 and FeAl2O4, but diffuse through the octahedral vacancy in Fe3O4. When temperature ranged from 1073 to 1325 K, the energy barrier of Fe2+ ions diffusion in Cr2FeO4 was higher than that of FeAl2O4, and both of that were still obvious higher than that in Fe3O4. A new anti-oxidation coating was prepared based on the inhibition of interface layer consisted of FeAl2O4 to protect the carbon steel S235JR at 1200 °C for 2 h. The FeAl2O4 region was formed and observed at the interface between coating and Fe element diffusion area, and the mullite phase was distributed outside of the FeAl2O4 region. Comparing to the bare sample, the prepared coating exhibited an excellent anti-oxidation effect.

Fe/Ni diffusion behavior in the shear-extrusion solid state bonding process

2021 ◽  
Vol 67 ◽  
pp. 35-45
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Qiang Li
Keyword(s):  
Solid State ◽  
Bonding Process ◽  
Diffusion Behavior ◽  
Solid State Bonding

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

2014 ◽  
Vol 26 (2) ◽  
pp. 87-95 ◽  
Author(s):  
J. Mittal ◽  
K.L. Lin
Keyword(s):  
Theoretical Calculations ◽  
Research Work ◽  
Content Type ◽  
Diffusion Behavior ◽  
Zn Diffusion ◽  
Cu Substrate ◽  
Practical Applications ◽  
Substrate Interface ◽  
Solder Balls ◽  
Practical Implications

Purpose – This paper aims to compare the reflow and Zn diffusion behaviors in Sn-Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (5E) solders during soldering on a Ni/Cu substrate under infrared (IR) reflow. The study proposes a model on the effect of various elements particularly Zn diffusion behavior in the solders on the formation of intermetallic compounds (IMCs). Design/methodology/approach – The melting activities of two solders near their melting points on copper substrates are visualized in an IR reflow furnace. Reflowed solder joints were analyzed using scanning electron microscope and energy dispersive X-ray spectroscopy. Findings – Reflow behaviors of the solders are similar. During melting, solder balls are first merged into each other and then reflow on the substrate from top to bottom. Both solders show a reduced amount of Zn in the solder. Theoretical calculations demonstrate a higher Zn diffusion in the 5E solder; however, the amount of Zn actually observed at the solder/substrate interface is lower than Sn-9Zn solder due to the formation of ZnAg3 in the solder. A thinner IMC layer is formed at the interface in the 5E solder than the Sn-Zn solder. Research limitations/implications – The present work compares the 5E solder only with Sn-Zn solder. Additional research work may be required to compare 5E solder with other solders like Sn-Ag, SnAgCu, etc. to further establish its practical applications. Practical implications – The study ascertains the advantages of 5E solder over Sn-Zn solder for all practical applications. Originality/value – The significance of this paper is the understanding of the relation between reflow behavior of solders and reactivity of different elements in the solder alloys and substrate to form various IMCs and their influence on the formation of IMC layer at solder/substrate interface. Emphasis is provided for the diffusion behavior of Zn during reflow and respective reaction mechanisms.

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