A rapid synthesis of high aspect ratio copper nanowires for high-performance transparent conducting films

2014 ◽  
Vol 50 (20) ◽  
pp. 2562-2564 ◽  
Author(s):  
Shengrong Ye ◽  
Aaron R. Rathmell ◽  
Ian E. Stewart ◽  
Yoon-Cheol Ha ◽  
Adria R. Wilson ◽  
...  
2014 ◽  
Vol 33 (1) ◽  
pp. 147-151 ◽  
Author(s):  
Tao Cheng ◽  
Yizhou Zhang ◽  
Wenyong Lai ◽  
Yao Chen ◽  
Wei Huang

Aerospace ◽  
2021 ◽  
Vol 8 (3) ◽  
pp. 80
Author(s):  
Dmitry V. Vedernikov ◽  
Alexander N. Shanygin ◽  
Yury S. Mirgorodsky ◽  
Mikhail D. Levchenkov

This publication presents the results of complex parametrical strength investigations of typical wings for regional aircrafts obtained by means of the new version of the four-level algorithm (FLA) with the modified module responsible for the analysis of aerodynamic loading. This version of FLA, as well as a base one, is focused on significant decreasing time and labor input of a complex strength analysis of airframes by using simultaneously different principles of decomposition. The base version includes four-level decomposition of airframe and decomposition of strength tasks. The new one realizes additional decomposition of alternative variants of load cases during the process of determination of critical load cases. Such an algorithm is very suitable for strength analysis and designing airframes of regional aircrafts having a wide range of aerodynamic concepts. Results of validation of the new version of FLA for a high-aspect-ratio wing obtained in this work confirmed high performance of the algorithm in decreasing time and labor input of strength analysis of airframes at the preliminary stages of designing. During parametrical design investigation, some interesting results for strut-braced wings having high aspect ratios were obtained.


Nanoscale ◽  
2017 ◽  
Vol 9 (46) ◽  
pp. 18311-18317 ◽  
Author(s):  
Yuan Gao ◽  
Yuanjing Lin ◽  
Zehua Peng ◽  
Qingfeng Zhou ◽  
Zhiyong Fan

Three-dimensional interconnected nanoporous structure (3-D INPOS) possesses high aspect ratio, large surface area, as well as good structural stability. Profiting from its unique interconnected architecture, the 3-D INPOS pseudocapacitor achieves a largely enhanced capacitance and rate capability.


2021 ◽  
Author(s):  
Eun Seop Yoon ◽  
Bong Gill Choi ◽  
Hwan-Jin Jeon

Abstract The development of energy storage electrode materials is important for enhancing the electrochemical performance of supercapacitors. Despite extensive research on improving electrochemical performance with polymer-based materials, electrode materials with micro/nanostructures are needed for fast and efficient ion and electron transfer. In this work, highly ordered phosphomolybdate (PMoO)-grafted polyaniline (PMoO-PAI) deposited onto Au hole-cylinder nanopillar arrays is developed for high-performance pseudocapacitors. The three-dimensional nanostructured arrays are easily fabricated by secondary sputtering lithography, which has recently gained attention and features a high resolution of 10 nm, a high aspect ratio greater than 20, excellent uniformity/accuracy/precision, and compatibility with large area substrates. These 10nm scale Au nanostructures with a high aspect ratio of ~30 on Au substrates facilitate efficient ion and electron transfer. The resultant PMoO-PAI electrode exhibits outstanding electrochemical performance, including a high specific capacitance of 114 mF/cm2, a high-rate capability of 88%, and excellent long-term stability.


2021 ◽  
Author(s):  
Yaxiong Zhang ◽  
Erqing Xie

Carbon nanotubes (CNTs) have been widely studied as supercapacitor electrodes because of their excellent conductivity, high aspect ratio, excellent mechanical properties, chemical stability, and large specific surface area. However, the...


ACS Nano ◽  
2015 ◽  
Vol 9 (5) ◽  
pp. 5264-5274 ◽  
Author(s):  
Hyun Ah Um ◽  
Dae Hee Lee ◽  
Dong Uk Heo ◽  
Da Seul Yang ◽  
Jicheol Shin ◽  
...  

2013 ◽  
Vol 562-565 ◽  
pp. 1387-1392
Author(s):  
Zhao Yun Zhang ◽  
Zhi Gui Shi ◽  
Zhen Chuan Yang ◽  
Bo Peng

The monolithic integrated technology of MEMS was discussed. First discussed the advantages and difficulties faced by the MEMS monolithic integration technology. Second the features and the process of the mainstream MEMS monolithic integration technology was introduced. And finally put forward a SOI MEMS monolithic integration technology, the technology with no high-temperature process, Post-CMOS integrated solution, compatible with the CMOS process. This technology can achieve high aspect ratio, high-performance micro-inertial devices..


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