Facile synthesis of SnS hollow nanoparticles via laser ablation followed by chemical etching

RSC Advances ◽  
2012 ◽  
Vol 2 (20) ◽  
pp. 7824 ◽  
Author(s):  
Ming-Yan Sun ◽  
Jing Yang ◽  
Tao Lin ◽  
Xi-Wen Du
Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.


2012 ◽  
Vol 16 ◽  
pp. 15-20 ◽  
Author(s):  
Omid Tayefeh Ghalehbeygi ◽  
Vural Kara ◽  
Levent Trabzon ◽  
Selcuk Akturk ◽  
Huseyin Kizil

We fabricated Si Nano-columns by a femtosecond laser with various wavelengths and process parameters, whilst the specimen was submerged in water. The experiments were carried out by three types of wavelengths i.e. 1030 nm, 515nm, 343nm, with 500 fs laser pulses. The scales of these spikes are much smaller than micro spikes that are constructed by laser irradiation of silicon surface in vacuum or gases like SF6, Cl2. The Si nano-columns of 300 nm or less in width were characterized by SEM measurements. The formation of these Si Nano-columns that were revealed by SEM observation, indicates chemical etching with laser ablation occurred when surface exposed by laser beam. We observed 200 nm spikes height at the center of laser beam profile and the ones uniform in height at lateral incident area.


Langmuir ◽  
2010 ◽  
Vol 26 (22) ◽  
pp. 16652-16657 ◽  
Author(s):  
K. Y. Niu ◽  
J. Yang ◽  
S. A. Kulinich ◽  
J. Sun ◽  
X. W. Du

Author(s):  
Xing Zhang ◽  
Bo Mao ◽  
Rebecca Histed ◽  
Yiliang Liao

Abstract Pulsed laser ablation (PLA) under active liquid confinement, also known as chemical etching enhanced pulsed laser ablation (CE-PLA), has emerged as a novel laser processing methodology, which breaks the current major limitation in underwater PLA caused by the breakdown plasma and effectively improves the efficiencies of underwater PLA-based processes, such as laser-assisted nano-/micro-machining and laser shock processing. Despite of experimental efforts, little attention has been paid on CE-PLA process modeling. In this study, an extended two-temperature model is proposed to predict the temporal/spatial evolution of the electron-lattice temperature and the ablation rate in the CE-PLA process. The model is developed with considerations on the temperature-dependent electronic thermal properties and optical properties of the target material. The ablation rate is formulated by incorporating the mutual promotion between ablation and etching processes. The simulation results are validated by the experimental data of CE-PLA of zinc under the liquid confinement of hydrogen peroxide.


2011 ◽  
Vol 501 (4-6) ◽  
pp. 419-422 ◽  
Author(s):  
G. Viau ◽  
V. Collière ◽  
L.-M. Lacroix ◽  
G.A. Shafeev

2009 ◽  
Vol 113 (18) ◽  
pp. 7522-7525 ◽  
Author(s):  
Guoxin Chen ◽  
Mutong Niu ◽  
Lifeng Cui ◽  
Feng Bao ◽  
Lihua Zhou ◽  
...  

2018 ◽  
Vol 54 (80) ◽  
pp. 11356-11359 ◽  
Author(s):  
Tong Zhang ◽  
Min Li ◽  
Xiaotong Wang ◽  
Zhimin Zhou ◽  
Wei Yuan ◽  
...  

Magnetic poly(l-lactide) coarse microspheres as artificial antigen-presenting cells were synthesized via simple chemical etching and antibody immobilization.


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