scholarly journals Vector separation of particles and cells using an array of slanted open cavities

Lab on a Chip ◽  
2013 ◽  
Vol 13 (6) ◽  
pp. 1086 ◽  
Author(s):  
Jorge A. Bernate ◽  
Chengxun Liu ◽  
Liesbet Lagae ◽  
Konstantinos Konstantopoulos ◽  
German Drazer
Keyword(s):  
Open Cavities ◽  
Vector Separation

Passive Die Alignment in Glass Embedded Fan-Out Packaging

2019 ◽  
Vol 2019 (1) ◽  
pp. 000152-000156 ◽  
Author(s):  
Roman Ostholt ◽  
Rafael Santos ◽  
Norbert Ambrosius ◽  
Daniel Dunker ◽  
Jean-Pol Delrue
Keyword(s):  
Glass Substrate ◽  
Process Step ◽  
Glass Substrates ◽  
Minimal Dimension ◽  
Open Cavities ◽  
Accuracy Study ◽  
Study Test ◽  
Passive Alignment ◽  
State Of Art ◽  
Alignment Marks

Abstract The objective of this paper is to demonstrate the feasibility of glass mounting substrates made by Laser Induced Deept Etching (LIDE) technology, which include newly developed passive die alignment structures. The aim of these structures is to compensate for potential die misalignments and die shift issues which become severe when moving to panel level fan-out packaging. The passive alignment structures are located at two adjacent edges of the rectangular cavity and are created in the same process step as the open cavities. The filigree spring-like alignment structures benefit from being processed in a crack- and stress-free manner. Although the spring elements have a minimal dimension of less than 100 μm, these structures show an outstanding break strength while deformed when active dies are placed in the mounting cavity. Depending on the design, the spring elements can have a stroke of several tenths of micrometer which enable the compensation of rather large die displacements. Here, we present examples for LIDE-processed mounting glass substrates with the described features. The performance of the proposed design and method was evaluated with a die accuracy study. Test dies with alignment marks were placed in the cavities and measured relatively to alignments marks on the mounting glass substrate. The Fan-Out packaging concept based on the research shown here combines several advantages: due to the relatively high Young's modulus of the glass, the reconstituted wafer shows less warpage than in the state-of-art; while the passive alignment structures reduce the die shift to a minimum (depending on dicing accuracies and through package vias for package-on-package or antenna-in-package application), and can be readily integrated.

scholarly journals Catalogue of Occultation Double Star Observations

1983 ◽  
Vol 62 ◽  
pp. 73-90
Keyword(s):  
Spectral Type ◽  
Position Angle ◽  
Double Star ◽  
Star Catalogue ◽  
Grade 3 ◽  
Vector Separation

The catalogue is divided into three sections: bright stars with magnitudes less than or equal to 6.7: other stars having numbers in the Smithsonian Astrophysical Star Catalogue with magnitudes greater than 6.7: and other stars with no SAO numbers, usually faint and with often only fragmentary information concerning their magnitudes or spectra.Each section has the following columns: SAO number, other name, magnitude, spectral type, run number of the observation, date in obvious coded form, grade — grade zero indicates no duplicity, grade 1 possible duplicity, grade 2 probable duplicity, and grade 3 certain duplicity. Grades are based on statements by observers. For grades other than zero the vector separation and its computed error are given in arc milliseconds. P.A. denotes the direction in which the vector separation is measured, that is the position angle on the lunar limb as modified by the slope deduced in favorable cases from the spacing of the diffraction bands on the occultation trace. The next column gives the limb slope and its error.

Sign in / Sign up

Export Citation Format

Share Document