Au–Cu alloy bridged synthesis and optoelectronic properties of Au@CuInSe2core–shell hybrid nanostructures

2012 ◽  
Vol 22 (5) ◽  
pp. 1765-1769 ◽  
Author(s):  
Qingfeng Zhang ◽  
Jian-jun Wang ◽  
Zhiyuan Jiang ◽  
Yu-Guo Guo ◽  
Li-Jun Wan ◽  
...  
Keyword(s):  
Optoelectronic Properties ◽  
Hybrid Nanostructures ◽  
Cu Alloy

Plastic deformation of θ ' in Al-4%Cu alloy

1978 ◽  
Vol 36 (1) ◽  
pp. 576-577
Author(s):  
Shrikant P. Bhat
Keyword(s):  
Deformation Behavior ◽  
Room Temperature ◽  
Electron Microscopic Observation ◽  
Bulk Alloy ◽  
Electron Microscopic ◽  
Cu Alloy ◽  
Cu Alloys ◽  
Orowan Mechanism ◽  
The Subject ◽  
Cyclic Straining

deformation behavior of Al-Cu alloys aged to contain θ ' has been the subject of many investigations (e.g., Ref. 1-5). Since θ ' is strong and hard, dislocations bypass θ ' plates (Orowan mechanism) at low strains. However, at high strains the partially coherent θ ' plates are probably sheared, although the mechanism is complex, depending on the form of deformation. Particularly, the cyclic straining of the bulk alloy is known to produce gross bends and twists of θ '. However, no detailed investigation of the deformation of θ ' has yet been reported; moreover, Calabrese and Laird interpreted the deformation of θ ' as largely being elastic.During an investigation of high temperature cyclic deformation, the detailed electron-microscopic observation revealed that, under reversed straining conditions, θ ' particles are severely distorted--bent and twisted depending on the local matrix constraint. A typical electronmicrograph, showing the twist is shown in Fig. 1. In order to establish whether the deformation is elastic or plastic, a sample from a specimen cycled at room temperature was heated inside the microscope and the results are presented in a series of micrographs (Fig. 2a-e).

Deviations from Ideal Decagonal Symmetry in Electron Diffraction Patterns of the “Decagonal” Phase in the Al-Co-Cu Alloy System

1991 ◽  
Vol 49 ◽  
pp. 914-915
Author(s):  
Atul S. Ramani ◽  
Earle R. Ryba ◽  
Paul R. Howell
Keyword(s):  
Electron Microscope ◽  
Alloy System ◽  
Nominal Composition ◽  
Dimensional Lattice ◽  
3 Dimensional ◽  
Decagonal Phase ◽  
Cu Alloy ◽  
Transmission Electron ◽  
Lattice Periodicity ◽  
Diffraction Patterns

The “decagonal” phase in the Al-Co-Cu system of nominal composition Al65CO15Cu20 first discovered by He et al. is especially suitable as a topic of investigation since it has been claimed that it is thermodynamically stable and is reported to be periodic in the dimension perpendicular to the plane of quasiperiodic 10-fold symmetry. It can thus be expected that it is an important link between fully periodic and fully quasiperiodic phases. In the present paper, we report important findings of our transmission electron microscope (TEM) study that concern deviations from ideal decagonal symmetry of selected area diffraction patterns (SADPs) obtained from several “decagonal” phase crystals and also observation of a lattice of main reflections on the 10-fold and 2-fold SADPs that implies complete 3-dimensional lattice periodicity and the fundamentally incommensurate nature of the “decagonal” phase. We also present diffraction evidence for a new transition phase that can be classified as being one-dimensionally quasiperiodic if the lattice of main reflections is ignored.

Influence of ion-milling on the T2 phase in Al-2.5%Li-2.5%Cu alloy

1989 ◽  
Vol 47 ◽  
pp. 288-289
Author(s):  
J. R. Reed ◽  
D. J. Michel ◽  
P. R. Howell
Keyword(s):  
Thin Foil ◽  
Icosahedral Symmetry ◽  
Ion Milling ◽  
Cu Alloy ◽  
Thin Foils ◽  
Heat Treated ◽  
Aluminum Solid Solution ◽  
In Situ Heating ◽  
The Stability

The Al6Li3Cu (T2) phase, which exhibits five-fold or icosahedral symmetry, forms through solid state precipitation in dilute Al-Li-Cu alloys. Recent studies have reported that the T2 phase transforms either during TEM examination of thin foils or following ion-milling of thin foil specimens. Related studies have shown that T2 phase transforms to a microcrystalline array of the TB phase and a dilute aluminum solid solution during in-situ heating in the TEM. The purpose of this paper is to report results from an investigation of the influence of ion-milling on the stability of the T2 phase in dilute Al-Li-Cu alloy.The 3-mm diameter TEM disc specimens were prepared from a specially melted Al-2.5%Li-2.5%Cu alloy produced by conventional procedures. The TEM specimens were solution heat treated 1 h at 550°C and aged 1000 h at 190°C in air to develop the microstructure. The disc specimens were electropolished to achieve electron transparency using a 20:80 (vol. percent) nitric acid: methanol solution at -60°C.

ATOM-PROBE ANALYSIS OF G.P. ZONES IN AN Al-1.7 at % Cu ALLOY

1987 ◽  
Vol 48 (C6) ◽  
pp. C6-349-C6-354
Author(s):  
K. Hono ◽  
T. Sakurai ◽  
H. W. Pickering
Keyword(s):  
Atom Probe ◽  
Cu Alloy ◽  
Probe Analysis ◽  
Atom Probe Analysis

The formation of low temperature Cu3Si in Ag(Cu)/Si structure upon annealing and its effects on adhesion and resistivity

2003 ◽  
Vol 766 ◽  
Author(s):  
Sungjin Hong ◽  
Seob Lee ◽  
Yeonkyu Ko ◽  
Jaegab Lee
Keyword(s):  
Low Temperature ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Si Substrate ◽  
Copper Silicide ◽  
Alloy Films ◽  
Cu Alloy ◽  
Cu Film ◽  
Rapid Drop

AbstractThe annealing of Ag(40 at.% Cu) alloy films deposited on a Si substrate at 200 – 800 oC in vacuum has been conducted to investigate the formation of Cu3Si at the Ag-Si interface and its effects on adhesion and resistivity of Ag(Cu)/Si structure. Auger electron spectroscopy(AES) analysis showed that annealing at 200°C allowed a diffusion of Cu to the Si surface, leading to the significant reduction in Cu concentration in Ag(Cu) film and thus causing a rapid drop in resistivity. In addition, the segregated Cu to the Si surface reacts with Si, forming a continuous copper silicide at the Ag(Cu)/Si interface, which can contribute to an enhanced adhesion of Ag(Cu)/Si annealed at 200 oC. However, as the temperature increases above 300°C, the adhesion tends to decrease, which may be attributed to the agglomeration of copper silicide beginning at around 300°C.

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