Low-temperature (below Tg) thermal bonding of COC microfluidic devices using UV photografted HEMA-modified substrates: high strength, stable hydrophilic, biocompatible surfaces
2011 ◽
Vol 21
(38)
◽
pp. 15031
◽
Keyword(s):
Keyword(s):
2011 ◽
Vol 121-126
◽
pp. 126-131
◽
2011 ◽
Vol 71-78
◽
pp. 890-897
◽