High-resolution soft lithography of thin film resists enabling nanoscopic pattern transfer

Soft Matter ◽  
2008 ◽  
Vol 4 (1) ◽  
pp. 168-176 ◽  
Author(s):  
Isaac W. Moran ◽  
Dalton F. Cheng ◽  
Sarav B. Jhaveri ◽  
Kenneth R. Carter
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Soft Lithography ◽  
Pattern Transfer

The measurement of thin-film reaction layers with high-resolution FESEM

1995 ◽  
Vol 53 ◽  
pp. 330-331
Author(s):  
Paul G. Kotula ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Reaction Layer ◽  
Product Layer ◽  
Buffer Layers ◽  
Oxide Superconductors ◽  
Rate Limiting Step ◽  
Ceramic Thin Film ◽  
Backscattered Electron ◽  
Boundary Reaction

Thin-film reactions in ceramic systems are of increasing importance as materials such as oxide superconductors and ferroelectrics are applied in thin-film form. In fact, reactions have been found to occur during the growth of YBa2Cu3O6+x on ZrO2. Additionally, thin-film reactions have also been intentionally initiated for the production of buffer layers for the subsequent growth of high-Tc superconductor thin films. The problem is that the kinetics of ceramic thin-film reactions are not well understood when the reaction layer is very thin; that is, when the rate-limiting step is a phase-boundary reaction as opposed to diffusion of the reactants through the product layer. In this case, the reaction layer is likely to be laterally non-uniform. In the present study, the measurement of thin reaction-product layers is accomplished by first digitally acquiring backscattered-electron images in a high-resolution field-emission scanning electron microscope (FESEM) followed by image analysis. Furthermore, the problem of measuring such small thicknesses (e.g., 20-500nm) over lengths of interfaces longer than 3mm is addressed.

High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

1992 ◽  
Vol 50 (2) ◽  
pp. 1334-1335
Author(s):  
K. Ogura ◽  
H. Nishioka ◽  
N. Ikeo ◽  
T. Kanazawa ◽  
J. Teshima
Keyword(s):  
Thin Film ◽  
Fine Structure ◽  
High Resolution ◽  
Magnetic Recording ◽  
High Performance ◽  
Magnetic Hysteresis ◽  
Grain Structure ◽  
Magnetic Media ◽  
Cross Sectional ◽  
Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

A New Scanning Thermal Microprobe

1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Thermal Response ◽  
Temperature Sensing ◽  
Thermal Sensor ◽  
Atomic Force ◽  
Thin Film Thermocouple ◽  
Processing Steps ◽  
Thermocouple Junction

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.

scholarly journals Micromechanical Punching: A Versatile Method for Non-Spherical Microparticle Fabrication

Polymers ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 83
Author(s):  
Ritika Singh Petersen ◽  
Anja Boisen ◽  
Stephan Sylvest Keller
Keyword(s):  
Drug Delivery ◽  
High Resolution ◽  
Physicochemical Properties ◽  
High Throughput ◽  
Liquid State ◽  
Soft Lithography ◽  
Glycolic Acid ◽  
Thermosetting Polymers ◽  
Spherical Microparticle ◽  
Spherical Microparticles

Microparticles are ubiquitous in applications ranging from electronics and drug delivery to cosmetics and food. Conventionally, non-spherical microparticles in various materials with specific shapes, sizes, and physicochemical properties have been fabricated using cleanroom-free lithography techniques such as soft lithography and its high-resolution version particle replication in non-wetting template (PRINT). These methods process the particle material in its liquid/semi-liquid state by deformable molds, limiting the materials from which the particles and the molds can be fabricated. In this study, the microparticle material is exploited as a sheet placed on a deformable substrate, punched by a robust mold. Drawing inspiration from the macro-manufacturing technique of punching metallic sheets, Micromechanical Punching (MMP) is a high-throughput technique for fabrication of non-spherical microparticles. MMP allows production of microparticles from prepatterned, porous, and fibrous films, constituting thermoplastics and thermosetting polymers. As an illustration of application of MMP in drug delivery, flat, microdisk-shaped Furosemide embedded poly(lactic-co-glycolic acid) microparticles are fabricated and Furosemide release is observed. Thus, it is shown in the paper that Micromechanical punching has potential to make micro/nanofabrication more accessible to the research and industrial communities active in applications that require engineered particles.

High-Resolution Soft Lithography: Enabling Materials for Nanotechnologies

2004 ◽  
Vol 116 (43) ◽  
pp. 5920-5923 ◽  
Author(s):  
Jason P. Rolland ◽  
Erik C. Hagberg ◽  
Ginger M. Denison ◽  
Kenneth R. Carter ◽  
Joseph M. De Simone
Keyword(s):  
High Resolution ◽  
Soft Lithography

scholarly journals Implantable Thin Film Devices as Brain-Computer Interfaces: Recent Advances in Design and Fabrication Approaches

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 204
Author(s):  
Yuhao Zhou ◽  
Bowen Ji ◽  
Minghao Wang ◽  
Kai Zhang ◽  
Shuaiqi Huangfu ◽  
...  
Keyword(s):  
Thin Film ◽  
High Resolution ◽  
Future Research ◽  
Nano Fabrication ◽  
Computer Interfaces ◽  
Continuous Progress ◽  
Open Mesh ◽  
Remarkable Progress ◽  
Thin Film Devices ◽  
Made In

Remarkable progress has been made in the high resolution, biocompatibility, durability and stretchability for the implantable brain-computer interface (BCI) in the last decades. Due to the inevitable damage of brain tissue caused by traditional rigid devices, the thin film devices are developing rapidly and attracting considerable attention, with continuous progress in flexible materials and non-silicon micro/nano fabrication methods. Therefore, it is necessary to systematically summarize the recent development of implantable thin film devices for acquiring brain information. This brief review subdivides the flexible thin film devices into the following four categories: planar, open-mesh, probe, and micro-wire layouts. In addition, an overview of the fabrication approaches is also presented. Traditional lithography and state-of-the-art processing methods are discussed for the key issue of high-resolution. Special substrates and interconnects are also highlighted with varied materials and fabrication routines. In conclusion, a discussion of the remaining obstacles and directions for future research is provided.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

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