Microfluidic devices fabricated in poly(methyl methacrylate) using hot-embossing with integrated sampling capillary and fiber optics for fluorescence detection

Lab on a Chip ◽  
2002 ◽  
Vol 2 (2) ◽  
pp. 88 ◽  
Author(s):  
Shize Qi ◽  
Xuezhu Liu ◽  
Sean Ford ◽  
James Barrows ◽  
Gloria Thomas ◽  
...  
Keyword(s):  
Methyl Methacrylate ◽  
Fiber Optics ◽  
Fluorescence Detection ◽  
Microfluidic Devices ◽  
Hot Embossing ◽  
Poly Methyl Methacrylate

Experimental Characterization and Finite Element Prediction of Large Strain Spring-Back Behavior of Poly(Methyl Methacrylate)

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
D. Mathiesen ◽  
A. Kakumani ◽  
R. B. Dupaix
Keyword(s):  
Finite Element ◽  
Glass Transition ◽  
Methyl Methacrylate ◽  
Large Strain ◽  
Hot Embossing ◽  
Large Strains ◽  
Spring Back ◽  
Simulation Accuracy ◽  
Poly Methyl Methacrylate ◽  
Strain Stress

Spring-back of poly(methyl methacrylate) (PMMA) at large strains, various embossing temperatures, and release temperatures below glass transition is quantified through modified unconfined recovery tests. Cooling, as well as large strains, is shown to reduce the amount of spring-back. Despite reducing the amount of spring-back, these experiments show that there is still a substantial amount present that needs to be accounted for in hot embossing processes. Spring-back is predicted using finite element simulations utilizing a constitutive model for the large strain stress relaxation behavior of PMMA. The model's temperature dependence is modified to account for cooling and focuses on the glass transition temperature region. Spring-back is predicted with this model, capturing the temperature and held strain dependence. Temperature assignment of the sample is found to have the largest effect on simulation accuracy. Interestingly, despite large thermal gradients in the PMMA, a uniform temperature approximation still yields reasonably accurate spring-back predictions. These experiments and simulations fill a substantial gap in knowledge of large strain recovery of PMMA under conditions normally found in hot embossing.

Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices

Talanta ◽  
2010 ◽  
Vol 81 (4-5) ◽  
pp. 1331-1338 ◽  
Author(s):  
Zongbo Zhang ◽  
Xiaodong Wang ◽  
Yi Luo ◽  
Shengqiang He ◽  
Liding Wang
Keyword(s):  
Methyl Methacrylate ◽  
Microfluidic Devices ◽  
Poly Methyl Methacrylate ◽  
Ultrasonic Bonding ◽  
Bonding Method

scholarly journals Simplified immobilisation method for histidine-tagged enzymes in poly(methyl methacrylate) microfluidic devices

2018 ◽  
Vol 47 ◽  
pp. 31-38 ◽  
Author(s):  
Gulsim Kulsharova ◽  
Nikolay Dimov ◽  
Marco P.C. Marques ◽  
Nicolas Szita ◽  
Frank Baganz
Keyword(s):  
Methyl Methacrylate ◽  
Microfluidic Devices ◽  
Poly Methyl Methacrylate

Effect of Size on Average Molecular Weight of Poly(Methyl Methacrylate) Micropattern during Hot Embossing

2013 ◽  
Vol 683 ◽  
pp. 133-136
Author(s):  
Ching Bin Lin ◽  
Zue Chin Chang ◽  
Jin Shin Ho ◽  
C.F. Hsiao
Keyword(s):  
Molecular Weight ◽  
Methyl Methacrylate ◽  
Average Molecular Weight ◽  
Orthogonal Arrays ◽  
Hot Embossing ◽  
Number Average Molecular Weight ◽  
Poly Methyl Methacrylate ◽  
The Relationship ◽  
Base Width

Hot-embossing experiments were conducted on poly (methyl methacrylate) orthogonal arrays with base widths of 1μm, 3μm, 5μm, 10μm, and 50μm. The relationship between the base width with respect to average molecular weight and number average molecular weight of micropattern were also investigated. It was discovered that the average molecular weight and number average molecular weight decreased as the base width increased.

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