Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
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1994 ◽
Vol 9
(9)
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pp. 2216-2218
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2014 ◽
Vol 29
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pp. 1711-1720
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1995 ◽
Vol 34
(Part 2, No. 1A)
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pp. L51-L53
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1991 ◽
Vol 3
(47)
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pp. 9551-9557
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1985 ◽
Vol 55
(13)
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pp. 1406-1409
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