scholarly journals Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

2014 ◽  
Vol 4 (1) ◽  
Author(s):  
M. L. Huang ◽  
F. Yang
Keyword(s):  
Size Effect ◽  
Interfacial Reaction ◽  
Cu Substrate ◽  
Effect Model ◽  
Kinetics Of ◽  
Size Effect Model

A simple size effect model for tension perpendicular to the grain

2003 ◽  
Vol 37 (2) ◽  
pp. 125-140 ◽  
Author(s):  
M. U. Pedersen ◽  
C. O. Clorius ◽  
L. Damkilde ◽  
P. Hoffmeyer
Keyword(s):  
Size Effect ◽  
Effect Model ◽  
Size Effect Model

A modified size effect model for brittle nonmetallic materials

2002 ◽  
Vol 69 (7) ◽  
pp. 781-791 ◽  
Author(s):  
Horst Fischer ◽  
Walter Rentzsch ◽  
Rudolf Marx
Keyword(s):  
Size Effect ◽  
Effect Model ◽  
Size Effect Model

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Global Size Effect Model—A Variant for Type-2 Size Effect Model

2021 ◽  
Vol 118 (3) ◽  
Author(s):  
Dong Li ◽  
Liu Jin ◽  
Xiuli Du
Keyword(s):  
Size Effect ◽  
Effect Model ◽  
Size Effect Model

Size effect model for the edge strength of glass with cut and ground edge finishing

2014 ◽  
Vol 79 ◽  
pp. 96-105 ◽  
Author(s):  
Marc Vandebroek ◽  
Christian Louter ◽  
Robby Caspeele ◽  
Frank Ensslen ◽  
Jan Belis
Keyword(s):  
Size Effect ◽  
Edge Strength ◽  
Effect Model ◽  
Edge Finishing ◽  
Size Effect Model
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