scholarly journals Relative importance of grain boundaries and size effects in thermal conductivity of nanocrystalline materials

2014 ◽  
Vol 4 (1) ◽  
Author(s):  
Huicong Dong ◽  
Bin Wen ◽  
Roderick Melnik
Keyword(s):  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Size Effects ◽  
Nanocrystalline Materials ◽  
Relative Importance

Densification and Thermal Conductivity of Y2O3-Doped AlN Ceramics by Spark Plasma Sintering

2007 ◽  
Vol 352 ◽  
pp. 227-231 ◽  
Author(s):  
Qiang Shen ◽  
Z.D. Wei ◽  
Mei Juan Li ◽  
Lian Meng Zhang
Keyword(s):  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Spark Plasma Sintering ◽  
Particle Surface ◽  
Boundary Phase ◽  
Homogeneous Microstructure ◽  
Densification Mechanism ◽  
Sintering Additive ◽  
Plasma Sintering ◽  
Spark Plasma

AlN ceramics doped with yttrium oxide (Y2O3) as the sintering additive were prepared via the spark plasma sintering (SPS) technique. The sintering behaviors and densification mechanism were mainly investigated. The results showed that Y2O3 addition could promote the AlN densification. Y2O3-doped AlN samples could be densified at low temperatures of 1600-1700oC in 20-25 minutes. The AlN samples were characterized with homogeneous microstructure. The Y-Al-O compounds were created on the grain boundaries due to the reactions between Y2O3 and Al2O3 on AlN particle surface. With increasing the sintering temperature, AlN grains grew up, and the location of grain boundaries as well as the phase compositions changed. The Y/Al ratio in the aluminates increased, from Y3Al5O12 to YAlO3 and to Y4Al2O9. High-density, the growth of AlN grains and the homogenous dispersion of boundary phase were helpful to improve the thermal conductivity of AlN ceramics. The thermal conductivity of 122Wm-1K-1 for the 4.0 mass%Y2O3-doped AlN sample was reached.

Onset of size effects in lattice thermal conductivity and lifetime of low-frequency thermal phonons

2012 ◽  
Vol 1404 ◽  
Author(s):  
A.A. Maznev
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Size Effects ◽  
Lattice Thermal Conductivity ◽  
Low Frequency ◽  
Square Root ◽  
Relaxation Rates ◽  
Frequency Limit ◽  
Conductivity Of Thin Films ◽  
Closed Form Formula

ABSTRACTThe onset of size effects in phonon-mediated thermal transport along a thin film at temperatures comparable or greater than the Debye temperature is analyzed theoretically. Assuming a quadratic frequency dependence of phonon relaxation rates in the low-frequency limit, a simple closed-form formula for the reduction of the in-plane thermal conductivity of thin films is derived. The effect scales as the square root of the film thickness, which leads to the prediction of measurable size-effects even at “macroscopic” distances ~100 μm. However, this prediction needs to be corrected to account for the deviation from the ω−2 dependence of phonon lifetimes at sub-THz frequencies due to the transition from Landau-Rumer to Akhiezer mechanism of phonon dissipation.

Deformation Twins Formed in Nanocrystalline Materials

2006 ◽  
Vol 503-504 ◽  
pp. 125-132 ◽  
Author(s):  
Yuntian T. Zhu
Keyword(s):  
Grain Boundaries ◽  
Nanocrystalline Materials ◽  
Partial Dislocation ◽  
Room Temperature ◽  
High Pressure Torsion ◽  
Nucleation And Growth ◽  
Analytical Models ◽  
Partial Dislocations ◽  
Deformation Twins ◽  
Low Strain Rate

Deformation twins have been oberved in nanocrystalline (NC) Al synthsized by cryogenic ball-milling and in NC Cu processed by high-pressure torsion under room temperature and at a very low strain rate. They were found formed by partial dislocations emitted from grain boundaries. This paper first reviews experimental evidences on deformation twinning and partial dislocation emissions from grain boundaries, and then discusses recent analytical models on the nucleation and growth of deformation twins. These models are compared with experimental results to establish their validity and limitations.

HPHT synthesis and enhanced TE performance of Te and Sn/Se elements binary-doped CoSb3

2019 ◽  
Vol 12 (01) ◽  
pp. 1850105 ◽  
Author(s):  
Hairui Sun ◽  
Pin Lv ◽  
Chao Wang ◽  
Yunxian Liu ◽  
Xiaopeng Jia ◽  
...  
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
High Pressure ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Grain Boundaries ◽  
Preparation Methods ◽  
Synthesis Time ◽  
Lattice Disorder ◽  
Positive Effect

A series of binary-doped CoSb3 with Te and Se/Sn bulk compounds Co4Sb[Formula: see text]TexSny/Sey ([Formula: see text] and 0.6, [Formula: see text] and 0.3), have been successfully prepared via a simple high pressure and high-temperature (HPHT) method. And, the influence of the doping elements on the microstructure of the samples synthesized under diverse pressures and the corresponding TE performance were studied in detail. Comparing with other preparation methods, the synthesis time of HPHT was acutely shortened. The obtained samples contain more grain boundaries, lattice disorder, dislocations and the possible “nanodot”, which have positive effect on reducing thermal conductivity. The experimental data indicate that the absolute values of Seebeck coefficient increases with pressure. What’s more, the thermal conductivities show a monotone decreasing trend as the synthesis pressure rises. The minimum value obtained is 1.93[Formula: see text]Wm[Formula: see text]K[Formula: see text] at normal temperature for Co4Sb[Formula: see text]Te[Formula: see text]Se[Formula: see text] prepared under 3[Formula: see text]GPa.

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

2014 ◽  
Author(s):  
Pornvitoo Rittinon ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Diffraction Method ◽  
Electron Back Scatter Diffraction ◽  
High Resistivity ◽  
Copper Thin Film ◽  
Electroplated Copper ◽  
The Relationship

Copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (Trough Silicon Via), fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grain boundaries in the films. Porous or sparse grain boundaries show very high resistivity and brittle fracture characteristic in the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on the Wiedemann-Franz’s law. Since the copper interconnections are used not only for the electrical conduction but also for the thermal conduction, it is very important to quantitatively evaluate the crystallinity of the polycrystalline thin-film materials and clarify the relationship between the crystallinity and thermal properties of the films. The crystallinity of the interconnections were quantitatively evaluated using an electron back-scatter diffraction method. It was found that the porous grain boundaries which contain a significant amount of vacancies increase the local electrical resistance in the interconnections, and thus, cause the local high Joule heating. Such porous grain boundaries can be eliminated by control the crystallinity of the seed layer material on which the electroplated copper thin film is electroplated.

scholarly journals Lattice Boltzmann method simulation of the gas heat conduction of nanoporous material

2020 ◽  
Vol 24 (6 Part A) ◽  
pp. 3749-3756
Author(s):  
Ya Han ◽  
Shuai Li ◽  
Hai-Dong Liu ◽  
Weipeng Cui
Keyword(s):  
Thermal Conductivity ◽  
Heat Conduction ◽  
Lattice Boltzmann Method ◽  
Knudsen Number ◽  
Lattice Boltzmann ◽  
Size Effects ◽  
Temperature Jump ◽  
Boundary Scattering ◽  
Nanoporous Material ◽  
Boltzmann Method

In order to deeply investigate the gas heat conduction of nanoporous aerogel, a model of gas heat conduction was established based on microstructure of aerogel. Lattice Boltzmann method was used to simulate the temperature distribution and gas thermal conductivity at different size, and the size effects of gas heat conduction have had been obtained under micro-scale conditions. It can be concluded that the temperature jump on the boundary was not obvious and the thermal conductivity remained basically constant when the value of Knudsen number was less than 0.01; as the value of Knudsen number increased from 0.01 to 0.1, there was a clear temperature jump on the boundary and the thermal conductivity tended to decrease and the effect of boundary scattering increased drastically, as the value of Knudsen number was more than 0.1, the temperature jump increased significantly on the boundary, furtherly, the thermal conductivity decreased dramatically, and the size effects were significantly.

Size effects on the thermal conductivity of polycrystalline platinum nanofilms

2006 ◽  
Vol 18 (34) ◽  
pp. 7937-7950 ◽  
Author(s):  
Q G Zhang ◽  
B Y Cao ◽  
X Zhang ◽  
M Fujii ◽  
K Takahashi
Keyword(s):  
Thermal Conductivity ◽  
Size Effects ◽  
Polycrystalline Platinum

Thermal Transport in Nanocrystalline Materials

2005 ◽  
Author(s):  
Zhanrong Zhong ◽  
Xinwei Wang
Keyword(s):  
Thermal Conductivity ◽  
Specific Heat ◽  
Thermal Transport ◽  
Nanocrystalline Materials ◽  
Large Scale ◽  
Md Simulation ◽  
Fundamental Physics ◽  
Grain Sizes ◽  
Simulation Results ◽  
Thermal Phenomena

In this work, thermal transport in nanocrystalline materials is studied using large-scale equilibrium molecular dynamics (MD) simulation. Nanocrystalline materials with different grain sizes are studied to explore how and to what extent the size of nanograins affects the thermal conductivity and specific heat. Substantial thermal conductivity reduction is observed and the reduction is stronger for nanocrystalline materials with smaller grains. On the other hand, the specific heat of nanocrystalline materials shows little change with the grain size. The simulation results are compared with the thermal transport in individual nanograins based on MD simulation. Further discussions are provided to explain the fundamental physics behind the observed thermal phenomena in this work.

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