scholarly journals The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation

2014 ◽  
Vol 4 (1) ◽  
Author(s):  
Yongcun Zhou ◽  
Yagang Yao ◽  
Chia-Yun Chen ◽  
Kyoungsik Moon ◽  
Hong Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Epoxy Composites ◽  
Enhanced Thermal Conductivity

Enhanced thermal conductivity of epoxy composites by constructing aluminum nitride honeycomb reinforcements

2020 ◽  
Vol 199 ◽  
pp. 108304 ◽  
Author(s):  
Zhilei Wei ◽  
Wenqi Xie ◽  
Bangzhi Ge ◽  
Zhejian Zhang ◽  
Wanli Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Epoxy Composites ◽  
Enhanced Thermal Conductivity

scholarly journals Simultaneously Enhanced Thermal Conductivity and Breakdown Performance of Micro/Nano-BN Co-Doped Epoxy Composites

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3521
Author(s):  
Chuang Zhang ◽  
Jiao Xiang ◽  
Shihang Wang ◽  
Zhimin Yan ◽  
Zhuolin Cheng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Frequency ◽  
Breakdown Strength ◽  
Epoxy Composites ◽  
Endurance Time ◽  
Insulating Materials ◽  
Power Frequency ◽  
High Frequency Devices ◽  
Co Doped ◽  
Enhanced Thermal Conductivity

Micro/nano- BN co-doped epoxy composites were prepared and their thermal conductivity, breakdown strength at power frequency and voltage endurance time under high frequency bipolar square wave voltage were investigated. The thermal conductivity and breakdown performance were enhanced simultaneously in the composite with a loading concentration of 20 wt% BN at a micro/nano proportion of 95/5. The breakdown strength of 132 kV/mm at power frequency, the thermal conductivity of 0.81 W∙m−1∙K−1 and voltage endurance time of 166 s were obtained in the composites, which were approximately 28%, 286% and 349% higher than that of pristine epoxy resin. It is proposed that thermal conductive pathways are mainly constructed by micro-BN, leading to improved thermal conductivity and voltage endurance time. A model was introduced to illustrate the enhancement of the breakdown strength. The epoxy composites with high thermal conductivity and excellent breakdown performance could be feasible for insulating materials in high-frequency devices.

Enhanced thermal conductivity of epoxy composites by constructing thermal conduction networks via adding hybrid alumina filler

2021 ◽  
Author(s):  
Zhong‐Yu Wang ◽  
Xiao‐Nan Zhou ◽  
Zi‐Xuan Li ◽  
Song‐Song Xu ◽  
Liu‐Cheng Hao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Conduction ◽  
Epoxy Composites ◽  
Enhanced Thermal Conductivity

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

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