scholarly journals Ordering simulation of high thermal conductivity epoxy resins

2012 ◽  
Vol 45 (4) ◽  
pp. 444-448 ◽  
Author(s):  
Tomonori Koda ◽  
Toshiyuki Toyoshima ◽  
Tokutaro Komatsu ◽  
Yoshitaka Takezawa ◽  
Akihiro Nishioka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resins ◽  
High Thermal Conductivity

Highly thermal conductive resins formed from wide-temperature-range eutectic mixtures of liquid crystalline epoxies bearing diglycidyl moieties at the side positions

2017 ◽  
Vol 8 (18) ◽  
pp. 2806-2814 ◽  
Author(s):  
Youngsu Kim ◽  
Hyeonuk Yeo ◽  
Nam-Ho You ◽  
Se Gyu Jang ◽  
Seokhoon Ahn ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Wide Temperature Range ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
High Thermal Conductivity ◽  
Temperature Range ◽  
Eutectic Mixtures ◽  
Liquid Crystalline Epoxy ◽  
Conductive Resins

Liquid crystalline epoxy resins with a wide temperature range exhibit a high thermal conductivity of 0.4 W m−1 K−1.

Graphene Encapsulating Boron Nitride Electrostatic Assemblies for Fabrication of Polymer Composites with High Thermal Conductivity

2016 ◽  
Vol 25 (6) ◽  
pp. 096369351602500 ◽  
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Reduced Graphene Oxide ◽  
Epoxy Resins ◽  
Thermal Reduction ◽  
High Thermal Conductivity ◽  
Reduced Graphene ◽  
Significant Attention

In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m−1.K−1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy.

scholarly journals Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 597 ◽  
Author(s):  
Van-Dung Mai ◽  
Dae-Il Lee ◽  
Jun-Hong Park ◽  
Dai-Soo Lee
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Packaging ◽  
Epoxy Resins ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Packaging Materials ◽  
Thermally Conductive

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

Preparation of 1D C/C Composites with High Thermal Conductivity

2013 ◽  
Vol 28 (12) ◽  
pp. 1338-1344 ◽  
Author(s):  
Jian-Feng LIN ◽  
Guan-Ming YUAN ◽  
Xuan-Ke LI ◽  
Zhi-Jun DONG ◽  
Jiang ZHANG ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity
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