Two mechanisms for positive inotropism of low-K Ringer solution in bullfrog atrium

Nature ◽  
1977 ◽  
Vol 268 (5622) ◽  
pp. 755-757 ◽  
Author(s):  
MASAYOSI GOTO ◽  
YASUO TSUDA ◽  
ATSUKO YATANI
Keyword(s):  
Ringer Solution ◽  
Positive Inotropism ◽  
Low K

Endothelial cell hyperpolarization increases [Ca2+]i and venular microvessel permeability

1994 ◽  
Vol 76 (6) ◽  
pp. 2288-2297 ◽  
Author(s):  
P. He ◽  
F. E. Curry
Keyword(s):  
Endothelial Cells ◽  
Membrane Potential ◽  
Endothelial Cell ◽  
Cell Membrane ◽  
Ringer Solution ◽  
Experimental Conditions ◽  
Vasoactive Substances ◽  
Microvessel Permeability ◽  
Low K ◽  
Microvessel Wall

We tested the hypothesis that Ca2+ influx into endothelial cells forming the walls of intact venular microvessels was increased when the cell membranes were hyperpolarized. Cytoplasmic free Ca2+ concentration ([Ca2+]i) was measured after the endothelial cells forming the microvessel wall were loaded with fura 2, endothelial cell membrane potential was measured with the membrane potential dye bis-oxonol, and hydraulic conductivity (Lp) of the vessels was measured by the modified Landis technique to follow changes in microvessel permeability. When microvessels were exposed to low-K+ (0.1 mM) Ringer solution, the membrane of the endothelial cells was hyperpolarized approximately 27 mV and [Ca2+]i increased from 47 nM to a peak value of 151 +/- 28 nM. Under the same experimental conditions, Lp increased to a peak 6.3 times control. In the presence of ionomycin (5 microM), the initial peak [Ca2+]i measured with low-K+ Ringer solution was 347 +/- 58 nM compared with 252 +/- 58 nM with ionophore and normal Ringer solution. The corresponding initial increases in Lp were 28 times control and 10 times control, respectively. The results conform to the hypothesis that vasoactive substances that hyperpolarize the endothelial cell membrane may initiate and/or potentiate the inflammatory response in venular microvessels.

Scanning Electron Microscopy of the Red Pulp of the Spleen

1971 ◽  
Vol 29 ◽  
pp. 496-497
Author(s):  
Masayuki Miyoshi
Keyword(s):  
Electron Microscope ◽  
Ringer Solution ◽  
Conclusive Evidence ◽  
Sinus Wall ◽  
Transmission Electron ◽  
Type 3 ◽  
Cytoplasmic Processes ◽  
Splenic Red Pulp ◽  
Scanning Electron ◽  
Red Pulp

In spite of various attempts, conclusive evidence to explain blood passage in the splenic red pulp does not seem to have been presented. Scanning electron microscope (SEM) observations on the rabbit spleen, originally performed by us, revealed that the sinus was lined by a perforated lattice composed of longitudinally extended rod cells and transverse cytoplasmic processes, and that perforations in the lattice were continuous to the spaces among the stellate reticulum cells of the cord. In the present study the observation was extended to the dog and rat spleens, in which the cord is more developed than in the rabbit in order to clarify the possible differences in the fine structure of the sinus wall. An attempt was also made to examine the development and distribution of macrophage in the blood passage of the red pulp.Spleens were washed and fixed by perfusion with Ringer solution and then with buffered glutaraldehyde. Small tissue cubes were dehydrated with acetone, dried in air and heated with gold. Observations were made by a JEOL SEM Type-3. One air dried tissue cube was cut into small pieces and post fixed with buffered OsO4 for examination under the transmission electron microscope (TEM).

Electron Probe Analysis of Vertebrate Smooth Muscle: Distribution of Ca and Ci

1976 ◽  
Vol 34 ◽  
pp. 334-335 ◽  
Author(s):  
Avril V. Somlyo ◽  
H. Shuman ◽  
A.P. Somlyo
Keyword(s):  
Smooth Muscle ◽  
Electron Probe ◽  
Preliminary Report ◽  
Cell Damage ◽  
Electron Probe Analysis ◽  
Perinuclear Space ◽  
Probe Analysis ◽  
High K ◽  
Low K ◽  
Initial Results

This is a preliminary report of electron probe analysis of rabbit portal-anterior mesenteric vein (PAMV) smooth muscle cryosectioned without fixation or cryoprotection. The instrumentation and method of electron probe quantitation used (1) and our initial results with cardiac (2) and skeletal (3) muscle have been presented elsewhere.In preparations depolarized with high K (K2SO4) solution, significant calcium peaks were detected over the sarcoplasmic reticulum (Fig 1 and 2) and the continuous perinuclear space. In some of the fibers there were also significant (up to 200 mM/kg dry wt) calcium peaks over the mitochondria. However, in smooth muscle that was not depolarized, high mitochondrial Ca was found in fibers that also contained elevated Na and low K (Fig 3). Therefore, the possibility that these Ca-loaded mitochondria are indicative of cell damage remains to be ruled out.

Deposition of Wave-shaped Layered Low-k Dielectric a-C:F Films by C8F18 Plasma CVD

2010 ◽  
Vol 130 (4) ◽  
pp. 319-324
Author(s):  
Kouichiro Mizuno ◽  
Hirotake Sugawara ◽  
Akihiro Murayama
Keyword(s):  
Plasma Cvd ◽  
Low K

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism

2012 ◽  
Author(s):  
Dongmei Meng ◽  
Laura Buck ◽  
James Cargo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Corrosion Mechanism ◽  
Fundamental Study ◽  
Corrosion Failure ◽  
Transmission Electron ◽  
Intermetallic Compound Formation ◽  
Scanning Transmission ◽  
Low K

Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.

Focused Ion Beam Analysis of Low-K Dielectrics

2000 ◽  
Author(s):  
H. J. Bender ◽  
R. A. Donaton
Keyword(s):  
Electron Microscope ◽  
Cross Section ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Single Step ◽  
Specimen Preparation ◽  
Transmission Electron ◽  
Beam Analysis ◽  
Low K ◽  
Scanning Electron

Abstract The characteristics of an organic low-k dielectric during investigation by focused ion beam (FIB) are discussed for the different FIB application modes: cross-section imaging, specimen preparation for transmission electron microscopy, and via milling for device modification. It is shown that the material is more stable under the ion beam than under the electron beam in the scanning electron microscope (SEM) or in the transmission electron microscope (TEM). The milling of the material by H2O vapor assistance is strongly enhanced. Also by applying XeF2 etching an enhanced milling rate can be obtained so that both the polymer layer and the intermediate oxides can be etched in a single step.

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