Supervisory methods and techniques.

2016 ◽  
pp. 47-68
Author(s):  
Joan E. Sarnat
Keyword(s):  
Methods And Techniques ◽  
Supervisory Methods

Strengthening the Services in Early Childhood Development in the Roma Communities

2018 ◽  
Vol 5 (1) ◽  
pp. 54-60
Author(s):  
Alma Tasevska
Keyword(s):  
Early Childhood ◽  
Focus Group ◽  
Early Childhood Development ◽  
Recent Decade ◽  
Childhood Development ◽  
Joint Project ◽  
Pedagogical Documentation ◽  
Methods And Techniques ◽  
Kindergarten Educators ◽  
And Training

Abstract The realistic state of the education of the Roma community illustrates the need for serious investments in resources of a human and material kind. Although the recent decade proved to be a decade of educational needs of the Roma, analyses still show the necessity for sustaining the continuity in advancing the developments of everything connected to early childhood development, as a basic sub-system in education. The research that was done had the aim of exploring the needs for strengthening the competencies and the sensibilities of work in environments with social, language and cultural specificities. The research was conducted in several stages, with focus groups as well: a questionnaire for kindergarten educators was conducted; research with a focus group of kindergarten educators was conducted; research with a focus group of parents whose children attend the kindergarten was conducted; research with a focus group of NGO representatives was conducted. The methods and techniques applied are the method of analysis, the inductive, descriptive and the method of generalization, as well as techniques of analysis of pedagogical documentation, observation,and surveying. It can be concluded that: kindergarten educators show a need towards professional development and training related to early childhood development and learning; kindergarten educators show a need towards cooperation with the community; parents showed their dissatisfaction withthe difficult adaptation of children in the kindergarten; NGO representatives stated the need for infrastructural investments, as well as investments in joint project activities between the children, educators,and parents.

Decapsulation Techniques for Cu Wire Bonding Package

2009 ◽  
Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon
Keyword(s):  
Laser Ablation ◽  
Thin Layer ◽  
Chemical Etching ◽  
Wire Bonding ◽  
Methods And Techniques ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Reliability Issue ◽  
Etch Time ◽  
Device Technology

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.

Techniques to Remove the C4 Die from a Ceramic Package

1998 ◽  
Author(s):  
Mehrdad Mahanpour ◽  
Andy Gray ◽  
Jose Hulog ◽  
Pat Chang
Keyword(s):  
Failure Analysis ◽  
Photon Emission ◽  
Emission Analysis ◽  
Methods And Techniques

Abstract C4 (Controlled Collapse Chip Connection) failure analysis compared to conventional packages (DIP- LCC- QFP, etc.) is not trivial. For instance, one has to thin the C4 die for IR microscope inspection or for photon emission analysis. Then, after failure analysis on the die, it must be removed for deprocessing or further analysis. Three methods and techniques will be discussed for removing the C4 die from the package without damaging the die. However, for each technique it is very important to know the condition of the die and package prior to die removal. The method used will differ, for example, if the die is thinned or not.

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