Stress Release Process Along an Intraplate Fault Analogous to the Plate Boundary: A Case Study of the 2017 M 5.2 Akita‐Daisen Earthquake, NE Japan

2020 ◽  
Vol 125 (5) ◽  
Author(s):  
Keisuke Yoshida ◽  
Taka'aki Taira ◽  
Yoshiaki Matsumoto ◽  
Tatsuhiko Saito ◽  
Kentaro Emoto ◽  
...  
Keyword(s):  
Plate Boundary ◽  
Stress Release ◽  
Release Process ◽  
Stress Release Process ◽  
Ne Japan

Stress release process along a crustal fault analogous to the plate boundary: a case study of the 2017 M5.2 Akita-Daisen earthquake, NE Japan

2020 ◽  
Author(s):  
Keisuke Yoshida ◽  
Taka'aki Taira ◽  
Yoshiaki Matsumoto ◽  
Tatsuhiko Saito ◽  
Kentaro Emoto ◽  
...  
Keyword(s):  
Plate Boundary ◽  
Stress Release ◽  
Release Process ◽  
Stress Release Process ◽  
Ne Japan

Stress release process along an intraplate fault analogous to the plate boundary: a case study of the 2017 M5.2 Akita-Daisen earthquake, NE Japan

2020 ◽  
Author(s):  
Keisuke Yoshida ◽  
Taka'aki Taira ◽  
Yoshiaki Matsumoto ◽  
Tatsuhiko Saito ◽  
Kentaro Emoto ◽  
...  
Keyword(s):  
Plate Boundary ◽  
Stress Release ◽  
Release Process ◽  
Stress Release Process ◽  
Ne Japan

scholarly journals Autocorrelations in pulsar glitch waiting times and sizes

2019 ◽  
Vol 488 (4) ◽  
pp. 4890-4896 ◽  
Author(s):  
J B Carlin ◽  
A Melatos
Keyword(s):  
Waiting Time ◽  
Waiting Times ◽  
P Value ◽  
Spearman Correlation ◽  
Stress Release ◽  
Release Process ◽  
Meta Model ◽  
State Dependent ◽  
Cross Correlations ◽  
Stress Release Process

ABSTRACT Among the five pulsars with the most recorded rotational glitches, only PSR J0534+2200 is found to have an autocorrelation between consecutive glitch sizes that differs significantly from zero (Spearman correlation coefficient ρ = −0.46, p-value = 0.046). No statistically compelling autocorrelations between consecutive waiting times are found. The autocorrelation observations are interpreted within the framework of a predictive meta-model describing stress release in terms of a state-dependent Poisson process. Specific combinations of size and waiting time autocorrelations are identified, alongside combinations of cross-correlations and size and waiting time distributions, that are allowed or excluded within the meta-model. For example, future observations of any ‘quasi-periodic’ glitching pulsar, such as PSR J0537–6910, should not reveal a positive waiting time autocorrelation. The implications for microphysical models of the stress-release process driving pulsar glitches are discussed briefly.

scholarly journals ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

2021 ◽  
Author(s):  
Pengfei Xu ◽  
Zhenyu Wei ◽  
Lu Jia ◽  
Yongmei Zhao ◽  
Guowei Han ◽  
...  
Keyword(s):  
Thermal Stresses ◽  
Stress Release ◽  
Release Process ◽  
Practical Applications ◽  
Induced Stress ◽  
Mems Gyroscopes ◽  
Zero Rate ◽  
Packaging Structure ◽  
Stress Release Process ◽  
Release Method

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gy-roscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage, and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. This stress release method achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√h, and the long-term bias performance is significantly improved.

scholarly journals ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1329
Author(s):  
Pengfei Xu ◽  
Zhenyu Wei ◽  
Lu Jia ◽  
Yongmei Zhao ◽  
Guowei Han ◽  
...  
Keyword(s):  
Thermal Stresses ◽  
Stress Release ◽  
Release Process ◽  
Practical Applications ◽  
Induced Stress ◽  
Mems Gyroscopes ◽  
Zero Rate ◽  
Packaging Structure ◽  
Stress Release Process ◽  
Release Method

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual-mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency, and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. The optimized device achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√ h, and its long-term bias performance is significantly improved.

DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATION

2013 ◽  
Vol 2013 (1) ◽  
pp. 000516-000522 ◽  
Author(s):  
G. Parès ◽  
A. Attard ◽  
F. Dosseul ◽  
A. N'Hari ◽  
O. Boillon ◽  
...  
Keyword(s):  
Flip Chip ◽  
Transient Liquid Phase ◽  
High Yield ◽  
Integration Scheme ◽  
Wafer Level ◽  
Release Process ◽  
Process Improvements ◽  
Low Profile ◽  
Stress Release Process ◽  
Tin Silver Copper

3D integration relying on novel vertical interconnection technologies opens the gate to powerful microelectronic systems in ultra-thin packages answering the demand of the mobile market. Among these, die-to-wafer stacking is a key enabling technology for 2.5D as well as for 3D with technological challenges driven by, in one hand, the increase of the die surface and the number of I/Os and, on the other hand, the reduction of the vertical dimensions. In our integration scheme we have achieved flip chip stacking (or Face to Face) of 35 μm ultra-thin dies with low stand-off (< 15 μm) copper micro-bumps and tin-silver-copper solders (SAC). Ultra-thin dies are prepared using dicing before grinding (DBG) technique. After DBG, plasma stress release process is applied to the backside of the singulated chips. Copper μbump technology is challenging with this very low profile stacking since the current flip chip process is no longer adapted to this geometry and that the die flatness tolerance become very critical to obtain a high soldering yield. Process improvements have been achieved on the copper pillar fabrication itself with several metallurgy stack configurations as well as new processes using damascene techniques. Furthermore, innovative technologies have been deployed on the pick and place and collective soldering processes. Intermetallic formation during reflow process is achieved through transient liquid phase (TLP) reaction leading to thorough consumption of the tin layer and to the formation of Cu6Sn5 and Cu3Sn compounds. Capillary underfill is finally successfully applied in the narrow die-to-wafer gap by jetting technique. After optimization, electrical tests show a very high yield close to 100% over a representative number of fully populated wafers. Reliability tests have also been carried out at wafer level exhibiting no significant resistance increase or yield loss over 1000 thermal cycles between −40 and +125°C.

scholarly journals Military Training Areas as Semi Commons: The Territorial Valorization of Quirra (Sardinia) from Easements to Ecosystem Services

2019 ◽  
Author(s):  
Ginevra Balletto ◽  
Alessandra Milesi ◽  
Nicolò Fenu ◽  
Giuseppe Borruso ◽  
Luigi Mundula
Keyword(s):  
Ecosystem Services ◽  
Military Training ◽  
Management Plan ◽  
Release Process ◽  
Community Interest ◽  
The Status ◽  
Combined Action ◽  
Military Training Areas ◽  
The Military

The military areas in Sardinia are around 234 km2, which constitutes 59.97% of the national surface affected by military easements. This situation is due to its geographic centrality in the Mediterranean. This contribution evaluates the performance of the Local Coastline Plan (LCP) and the Site Management Plan of Community Interest (SCI) in conditions of military constraint. The case study is the Municipality of Villaputzu where an important coastal military easement and the use of the coast for recreational tourism purposes coexist together through specific planning, a consequence of institutional agreements between the Municipal Administration of Villaputzu and the Ministry of Defense. The evaluation of the congruence of the specific objectives of the LCP and the SCI shows how their combined action favors the environmental enhancement of Sardinia, contributing to the formation of ecosystem services, even in particular conditions arising from military easements. These are sites that pass from the status of "anti-commons" to "semi-commons". In fact, the military release process in Sardinia, together with the promiscuous military and civil use, activates unique governance policies of their kind that find a significant field of application in Sardinia to guarantee a sustainable renewal of economic development of the ‘semi-commons’ awaiting to become ‘commons’

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