Stepwise Reduction of Four Carbonyl Ligands in (η5-C5H4Me)4Fe4(μ3-CO)4To Produce Clusters Containing μ3-Methylidyne and/or Acetylene Ligands

2004 ◽  
Vol 23 (17) ◽  
pp. 4055-4061 ◽  
Author(s):  
Masaaki Okazaki ◽  
Takeo Ohtani ◽  
Masato Takano ◽  
Hiroshi Ogino
Keyword(s):  
Carbonyl Ligands ◽  
Stepwise Reduction

Air Bridge Technology: A Comparison of Novel Interconnect Materials and Integration Schemes for Beyond 45 nm

2003 ◽  
Vol 766 ◽  
Author(s):  
Kenneth Foster ◽  
Joost Waeterloos ◽  
Don Frye ◽  
Steve Froelicher ◽  
Mike Mills
Keyword(s):  
Dielectric Constants ◽  
Advanced Technology ◽  
Effective Dielectric Constant ◽  
Device Performance ◽  
Interlayer Dielectric ◽  
Integration Schemes ◽  
Stepwise Reduction ◽  
Bridge Technology ◽  
Integrated Device ◽  
Compare And Contrast

AbstractThe electronics industry, in a continual drive for improved integrated device performance, is seeking increasingly lower dielectric constants (k) of the insulators that are used as interlayer dielectric (ILD) for advanced logic interconnects. As the industry continually seeks a stepwise reduction of the “effective” dielectric constant (keff), simple extendibility, leads to the consideration of the highest performance possible, namely air bridge technology. In this paper we will discuss requirements, integration schemes and properties for a novel class of materials that has been developed as part of an advanced technology probe into air bridge architecture. We will compare and contrast these potential technology offerings with other existing dense and porous ILD integration options, and show that the choice is neither trivial nor obvious.

The role of elasticity in thixotropy: Transient elastic stress during stepwise reduction in shear rate

2021 ◽  
Vol 33 (3) ◽  
pp. 033112
Author(s):  
Jiho Choi ◽  
Matthew Armstrong ◽  
Simon A. Rogers
Keyword(s):  
Shear Rate ◽  
Elastic Stress ◽  
Stepwise Reduction

The effect of an abrupt stepwise reduction in pressure on the integrity of the eukaryotic and prokaryotic cell envelope

1995 ◽  
Vol 17 (8) ◽  
pp. 712-718 ◽  
Author(s):  
Jean-Michel Bavouzet ◽  
Christine Lafforgue-Delorme ◽  
Christian Fonade ◽  
Gérard Goma
Keyword(s):  
Cell Envelope ◽  
Prokaryotic Cell ◽  
Stepwise Reduction

Carbonyl Ligands

1977 ◽  
pp. 243-265
Author(s):  
Arthur E. Martell ◽  
Robert M. Smith
Keyword(s):  
Carbonyl Ligands

scholarly journals Measurement and Modeling of Thermal Conductivity for Dense Iron Oxide and Porous Iron Ore Aggliomerates in Stepwise Reduction.

1992 ◽  
Vol 32 (7) ◽  
pp. 829-837 ◽  
Author(s):  
Tomohiro Akiyama ◽  
Hiromichi Ohta ◽  
Reijiro Takahashi ◽  
Yoshio Waseda ◽  
Jun-ichiro Yagi
Keyword(s):  
Thermal Conductivity ◽  
Iron Oxide ◽  
Iron Ore ◽  
Porous Iron ◽  
Stepwise Reduction

Undecacarbonyl(pyridine-κN)-tetrahedro-tetrairidium(4Ir—Ir)

2006 ◽  
Vol 62 (4) ◽  
pp. m838-m840 ◽  
Author(s):  
Alvaro J. Pardey ◽  
Manoa A. Moreno ◽  
Matthias Lutz ◽  
Matti Haukka ◽  
Reinaldo Atencio
Keyword(s):  
Hydrogen Bonds ◽  
Title Compound ◽  
Triple Bond ◽  
Crystal Packing ◽  
Pyridine Molecule ◽  
Carbonyl Groups ◽  
Carbonyl Ligands

The title compound, [Ir4(C5H5N)(CO)11], shows a tetrahedral Ir4 core in which each Ir atom is linked to three other Ir atoms and three terminal carbonyl groups, except for one Ir atom, which carries two carbonyl ligands and one N-coordinated pyridine molecule. An intricate set of C—H...π hydrogen bonds stabilizes the crystal packing, where the π-systems are those of the C[triple-bond]O bonds of the carbonyl ligands.

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