The Importance of Nanometric Passivating Films on Cathodes for Li–Air Batteries

ACS Nano ◽  
2014 ◽  
Vol 8 (12) ◽  
pp. 12483-12493 ◽  
Author(s):  
Brian D. Adams ◽  
Robert Black ◽  
Claudio Radtke ◽  
Zack Williams ◽  
B. Layla Mehdi ◽  
...  
Keyword(s):  
Passivating Films

Ionic processes in solid-electrolyte passivating films on lithium

2000 ◽  
Vol 4 (4) ◽  
pp. 216-224 ◽  
Author(s):  
A. V. Churikov ◽  
I. M. Gamayunova ◽  
A. V. Shirokov
Keyword(s):  
Solid Electrolyte ◽  
Passivating Films

The role of hydrogen in the pitting of passivating films on pure iron

1992 ◽  
Vol 33 (3) ◽  
pp. 437-444 ◽  
Author(s):  
Su-Il Pyun ◽  
Chan Lim ◽  
R.A Oriani
Keyword(s):  
Pure Iron ◽  
Passivating Films

Film Fracture Phenomena During Indentation

2000 ◽  
Vol 649 ◽  
Author(s):  
D.F. Bahr ◽  
M. Pang ◽  
D. Rodriguez-Marek
Keyword(s):  
Permanent Deformation ◽  
Dislocation Nucleation ◽  
Ex Situ ◽  
Depth Sensing ◽  
Indentation Tests ◽  
Probe Microscope ◽  
Rapid Generation ◽  
Engineering Alloys ◽  
Complementary Set ◽  
Passivating Films

ABSTRACTDiscontinuities during both load and depth controlled continuous indentation tests have been ascribed to dislocation nucleation or multiplication and film fracture. In materials which exhibit permanent deformation prior to a discontinuity in loading, it is more likely that the phenomena is indeed controlled by film fracture, and not the rapid generation of dislocations. The current study has been undertaken to examine the properties of passivating films on engineering alloys. An electrochemical cell coupled with a scanning probe microscope and nanoindentation system allows growth and mechanical testing of passive films on an austenitic stainless steel as well as a titanium alloy. A complementary set of ex situ experiments shows the presence of deformation prior to film fracture with both load – depth sensing techniques as well as imaging the surface topography. The occurrence of excursions is shown in these materials to be linked directly with film fracture, rather than dislocation multiplication.

Study on Material Removal Mechanism of Silicon Nitride during ELID Ultraprecision Grinding

2011 ◽  
Vol 314-316 ◽  
pp. 1740-1745
Author(s):  
Wei Dong Jin
Keyword(s):  
Silicon Nitride ◽  
Material Removal ◽  
Dynamic Balance ◽  
Grinding Process ◽  
Silicon Nitride Ceramic ◽  
Elid Grinding ◽  
Hard And Brittle Materials ◽  
Plastic Shearing ◽  
Material Removal Mode ◽  
Passivating Films

Based on the analyzing ultraprecision grinding process of hard and brittle materials, taking ELID grinding of silicon nitride ceramic as an example, active control technology of passivating films state was introduced in this paper. ELID ultraprecision grinding process respectively at adaptive dynamic balance mode, discontinuous electrolyzing mode and discontinuous grinding mode had been comparatively studied. By means of AFM used for analyzing surface topography of parts, studies show that material removal method for ELID grinding is always a combination of micro brittle fracture, plastic shearing, lapping and polishing action, and which is the main material removal mode depends on the actual grinding contact state. Finally, finishing surface generating mechanism for silicon nitride in ELID ultraprecision grinding was summed up.

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