HfOx-Based Vertical Resistive Switching Random Access Memory Suitable for Bit-Cost-Effective Three-Dimensional Cross-Point Architecture

ACS Nano ◽  
2013 ◽  
Vol 7 (3) ◽  
pp. 2320-2325 ◽  
Author(s):  
Shimeng Yu ◽  
Hong-Yu Chen ◽  
Bin Gao ◽  
Jinfeng Kang ◽  
H.-S. Philip Wong
Keyword(s):  
Resistive Switching ◽  
Three Dimensional ◽  
Random Access ◽  
Random Access Memory ◽  
Cost Effective ◽  
Access Memory ◽  
Cross Point

scholarly journals Analysis of the Sensing Margin of Silicon and Poly-Si 1T-DRAM

Micromachines ◽  
2020 ◽  
Vol 11 (2) ◽  
pp. 228
Author(s):  
Hyeonjeong Kim ◽  
Songyi Yoo ◽  
In-Man Kang ◽  
Seongjae Cho ◽  
Wookyung Sun ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Random Access ◽  
Random Access Memory ◽  
Cost Effective ◽  
Dynamic Random Access Memory ◽  
Silicon On Insulator ◽  
Floating Body ◽  
Thin Body ◽  
Access Memory ◽  
The Cost

Recently, one-transistor dynamic random-access memory (1T-DRAM) cells having a polysilicon body (poly-Si 1T-DRAM) have attracted attention as candidates to replace conventional one-transistor one-capacitor dynamic random-access memory (1T-1C DRAM). Poly-Si 1T-DRAM enables the cost-effective implementation of a silicon-on-insulator (SOI) structure and a three-dimensional (3D) stacked architecture for increasing integration density. However, studies on the transient characteristics of poly-Si 1T-DRAM are still lacking. In this paper, with TCAD simulation, we examine the differences between the memory mechanisms in poly-Si and silicon body 1T-DRAM. A silicon 1T-DRAM cell’s data state is determined by the number of holes stored in a floating body (FB), while a poly-Si 1T-DRAM cell’s state depends on the number of electrons trapped in its grain boundary (GB). This means that a poly-Si 1T-DRAM can perform memory operations by using GB as a storage region in thin body devices with a small FB area.

Circuit-level simulation of resistive-switching random-access memory cross-point array based on a highly reliable compact model

2017 ◽  
Vol 17 (1) ◽  
pp. 273-278 ◽  
Author(s):  
Min-Hwi Kim ◽  
Sungjun Kim ◽  
Kyung-Chang Ryoo ◽  
Seongjae Cho ◽  
Byung-Gook Park
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
Random Access Memory ◽  
Compact Model ◽  
Access Memory ◽  
Cross Point

Transparent resistive random access memory and its characteristics for nonvolatile resistive switching

2008 ◽  
Vol 93 (22) ◽  
pp. 223505 ◽  
Author(s):  
Jung Won Seo ◽  
Jae-Woo Park ◽  
Keong Su Lim ◽  
Ji-Hwan Yang ◽  
Sang Jung Kang
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Access Memory

Fabrication of Semi-transparent Resistive Random Access memory and Its Characteristics of Nonvolatile Resistive Switching

2011 ◽  
Vol 1292 ◽  
Author(s):  
Jung Won Seo ◽  
Seung Jae Baik ◽  
Sang Jung Kang ◽  
Koeng Su Lim
Keyword(s):  
Metal Oxide ◽  
Resistive Switching ◽  
Current Density ◽  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Access Memory ◽  
Promising Candidate ◽  
Forward Current ◽  
Switching Characteristics

ABSTRACTThis report covers the resistive switching characteristics of cross-bar type semi-transparent (or see-through) resistive random access memory (RRAM) devices based on ZnO. In order to evaluate the transmittance of the devices, we designed the memory array with various electrode sizes and spaces between the electrodes. To prevent read disturbance problems due to sneak currents, we employed a metal oxide based p-NiO/n-ZnO diode structure, which exhibited good rectifying characteristics and high forward current density. Based on these results, we found that the combined metal oxide diode/RRAM device could be promising candidate with suppressed read disturbances of cross-bar type ZnO RRAM device.

THERMAL EXPANSION OF PHASE-CHANGE RANDOM ACCESS MEMORY CELLS

2008 ◽  
Vol 1072 ◽  
Author(s):  
Jianming Li ◽  
L.P. Shi ◽  
H.X. Yang ◽  
K.G. Lim ◽  
X.S. Miao ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Phase Change ◽  
Electrical Power ◽  
Thermal Strain ◽  
Three Dimensional ◽  
Amorphous State ◽  
Random Access ◽  
Random Access Memory ◽  
Access Memory ◽  
Three Dimensional Finite Element

ABSTRACTThree-dimensional finite element method (FEM) is used to solve the thermal strain-stress fields of phase-change random access memory (PCRAM) cells. Simulation results show that thermal stress concentrates at the interfaces between electrodes and phase change layer and it is significantly larger than that within the phase change layer. It has been found that the peak thermal stress is linearly related to the voltage of electrical pulse in the reset process but once amorphous state is produced in the cell, a nonlinear relationship between thermal stress and electrical power exists. This paper reported the change of thermal stress during set process. It was found that the stress decreases significantly due to the amorphous active region during set processes.

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