Precision-Cut Crystalline Silicon Nanodots and Nanorods from Nanowires and Direct Visualization of Cross Sections and Growth Orientations of Silicon Nanowires

Nano Letters ◽  
2003 ◽  
Vol 3 (12) ◽  
pp. 1735-1737 ◽  
Author(s):  
Boon K. Teo ◽  
X. H. Sun ◽  
T. F. Hung ◽  
X. M. Meng ◽  
N. B. Wong ◽  
...  
2019 ◽  
Vol 18 (03n04) ◽  
pp. 1940030 ◽  
Author(s):  
A. I. Efimova ◽  
E. A. Lipkova ◽  
K. A. Gonchar ◽  
A. A. Eliseev ◽  
V. Yu. Timoshenko

Free charge carrier concentration in arrays of silicon nanowires (SiNWs) with cross-sectional size of the order of 100[Formula: see text]nm was quantitatively studied by means of the infrared spectroscopy in an attenuated total reflection mode. SiNWs were formed on lightly-doped [Formula: see text]-type crystalline silicon substrates by metal-assisted chemical etching followed by additional doping through thermoactivated diffusion of boron at 900–1000∘C. The latter process was found to increase the concentration of free holes in SiNWs up to [Formula: see text][Formula: see text]cm[Formula: see text]. Potential applications of highly doped SiNWs in thermoelectric energy converters and infrared plasmonic devices are discussed.


2012 ◽  
Vol 1512 ◽  
Author(s):  
Jian-Wei Ho ◽  
Qixun Wee ◽  
Jarrett Dumond ◽  
Li Zhang ◽  
Keyan Zang ◽  
...  

ABSTRACTA combinatory approach of Step-and-Flash Imprint Lithography (SFIL) and Metal-Assisted Chemical Etching (MacEtch) was used to generate near perfectly-ordered, high aspect ratio silicon nanowires (SiNWs) on 4" silicon wafers. The ordering and shapes of SiNWs depends only on the SFIL nanoimprinting mould used, thereby enabling arbitary SiNW patterns not possible with nanosphere and interference lithography (IL) to be generated. Very densely packed SiNWs with periodicity finer than that permitted by conventional photolithography can be produced. The height of SiNWs is, in turn, controlled by the etching duration. However, it was found that very high aspect ratio SiNWs tend to be bent during processing. Hexagonal arrays of SiNW with circular and hexagonal cross-sections of dimensions 200nm and less were produced using pillar and pore patterned SFIL moulds. In summary, this approach allows highlyordered SiNWs to be fabricated on a wafer-level basis suitable for semiconductor device manufacturing.


2018 ◽  
Vol 123 (16) ◽  
pp. 161515 ◽  
Author(s):  
T. Südkamp ◽  
G. Hamdana ◽  
M. Descoins ◽  
D. Mangelinck ◽  
H. S. Wasisto ◽  
...  

2002 ◽  
Vol 737 ◽  
Author(s):  
Shashank Sharma ◽  
Mahendra K. Sunkara ◽  
Elizabeth C. Dickey

ABSTRACTWe report for the first time, bulk synthesis of single crystalline silicon nanowires using molten gallium pools and an activated vapor phase containing silane. The resulting silicon nanowires were single crystalline with <100> growth direction. Nanowires contained an unexpectedly thin, non-uniform oxide sheath determined using high-resolution Transmission Electron Microscopy (TEM). Nanowires were tens of nanometers in diameter and tens to hundreds of microns long. The use of activated gas phase chemistry containing solute of interest over molten metal pools of low-solubility eutectics such as gallium offer a viable route to generate nanowire systems containing abrupt compositional hetero-interfaces.


2013 ◽  
Vol 52 (9R) ◽  
pp. 092301 ◽  
Author(s):  
Kyeom Seon Do ◽  
Min Gu Kang ◽  
Je Jun Park ◽  
Gi Hwan Kang ◽  
Jae-Min Myoung ◽  
...  

2013 ◽  
Vol 80 (2) ◽  
Author(s):  
E. Suhir ◽  
D. Shangguan ◽  
L. Bechou

Low-temperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strength-of-materials) analytical (“mathematical”) model. The addressed stresses include normal stresses acting in the cross-sections of the assembly components and determining their short- and long-term reliability, as well as the interfacial shearing and peeling stresses responsible for the adhesive and cohesive strength of the assembly. The model is applied to a preframed crystalline silicon photovoltaic module (PVM) assembly. It is concluded that the interfacial thermal stresses, and especially the peeling stresses, can be rather high, so that the structural integrity of the module could be compromised, unless appropriate design for reliability measures are taken. The developed model can be helpful in the stress analysis and physical (structural) design of the PVM and other trimaterial assemblies.


2012 ◽  
Vol 258 (24) ◽  
pp. 9792-9799 ◽  
Author(s):  
Shao-long Wu ◽  
Ting Zhang ◽  
Rui-ting Zheng ◽  
Guo-an Cheng

2016 ◽  
Vol 7 (2) ◽  
pp. 8-25 ◽  
Author(s):  
Orazio Muscato ◽  
Tina Castiglione

AbstractTransport phenomena in silicon nanowires with different cross-section are investigated using an Extended Hydrodynamic model, coupled to the Schrödinger-Poisson system. The model has been formulated by closing the moment system derived from the Boltzmann equation on the basis of the maximum entropy principle of Extended Thermodynamics, obtaining explicit closure relations for the high-order fluxes and the production terms. Scattering of electrons with acoustic and non polar optical phonons have been taken into account. The bulk mobility is evaluated for square and equilateral triangle cross-sections of the wire.


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