Siloxane Polymers for High-Resolution, High-Accuracy Soft Lithography

2000 ◽  
Vol 33 (8) ◽  
pp. 3042-3049 ◽  
Author(s):  
H. Schmid ◽  
B. Michel
Keyword(s):  
High Resolution ◽  
Soft Lithography ◽  
High Accuracy ◽  
Siloxane Polymers

scholarly journals Micromechanical Punching: A Versatile Method for Non-Spherical Microparticle Fabrication

Polymers ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 83
Author(s):  
Ritika Singh Petersen ◽  
Anja Boisen ◽  
Stephan Sylvest Keller
Keyword(s):  
Drug Delivery ◽  
High Resolution ◽  
Physicochemical Properties ◽  
High Throughput ◽  
Liquid State ◽  
Soft Lithography ◽  
Glycolic Acid ◽  
Thermosetting Polymers ◽  
Spherical Microparticle ◽  
Spherical Microparticles

Microparticles are ubiquitous in applications ranging from electronics and drug delivery to cosmetics and food. Conventionally, non-spherical microparticles in various materials with specific shapes, sizes, and physicochemical properties have been fabricated using cleanroom-free lithography techniques such as soft lithography and its high-resolution version particle replication in non-wetting template (PRINT). These methods process the particle material in its liquid/semi-liquid state by deformable molds, limiting the materials from which the particles and the molds can be fabricated. In this study, the microparticle material is exploited as a sheet placed on a deformable substrate, punched by a robust mold. Drawing inspiration from the macro-manufacturing technique of punching metallic sheets, Micromechanical Punching (MMP) is a high-throughput technique for fabrication of non-spherical microparticles. MMP allows production of microparticles from prepatterned, porous, and fibrous films, constituting thermoplastics and thermosetting polymers. As an illustration of application of MMP in drug delivery, flat, microdisk-shaped Furosemide embedded poly(lactic-co-glycolic acid) microparticles are fabricated and Furosemide release is observed. Thus, it is shown in the paper that Micromechanical punching has potential to make micro/nanofabrication more accessible to the research and industrial communities active in applications that require engineered particles.

High-Resolution Soft Lithography: Enabling Materials for Nanotechnologies

2004 ◽  
Vol 116 (43) ◽  
pp. 5920-5923 ◽  
Author(s):  
Jason P. Rolland ◽  
Erik C. Hagberg ◽  
Ginger M. Denison ◽  
Kenneth R. Carter ◽  
Joseph M. De Simone
Keyword(s):  
High Resolution ◽  
Soft Lithography

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Terahertz frequency comb by multifrequency-heterodyning photoconductive detection for high-accuracy, high-resolution terahertz spectroscopy

2006 ◽  
Vol 88 (24) ◽  
pp. 241104 ◽  
Author(s):  
Takeshi Yasui ◽  
Yasuhiro Kabetani ◽  
Eisuke Saneyoshi ◽  
Shuko Yokoyama ◽  
Tsutomu Araki
Keyword(s):  
High Resolution ◽  
Terahertz Spectroscopy ◽  
Frequency Comb ◽  
High Accuracy ◽  
Terahertz Frequency

A 3D Optimized Frequency–Wavenumber (FK), Time–Space Optimized Symplectic (TSOS) Hybrid Method for Teleseismic Wave Modeling

2021 ◽  
Author(s):  
Weijuan Meng ◽  
Dinghui Yang ◽  
Xingpeng Dong ◽  
Jian Ma
Keyword(s):  
High Resolution ◽  
Seismic Wave ◽  
Hybrid Method ◽  
High Efficiency ◽  
Reference Model ◽  
3D Models ◽  
Realistic Model ◽  
High Accuracy ◽  
Memory Requirement ◽  
Time Space

ABSTRACT Although teleseismic waveform tomography can provide high-resolution images of the deep mantle, it is still unrealistic to numerically simulate the whole domain of seismic wave propagation due to the huge amount of computation. In this article, we develop a new three-dimensional hybrid method to address this issue, which couples the modified frequency–wavenumber (FK) method with the 3D time–space optimized symplectic (TSOS) method. First, the FK method, which is used to calculate the semianalytical incident wavefields in the layered reference model, is modified to compute the wavefields efficiently with a significantly low-memory requirement. Second, 3D TSOS method is developed to model the seismic wave propagating in the local 3D heterogeneous domain. The low memory requirement of the modified FK method and the high accuracy of the TSOS method make it feasible to obtain highly accurate synthetic seismograms efficiently. A crust–upper mantle model for P-, SV-, and SH-wave incidences is calculated to benchmark the accuracy and efficiency of the 3D optimized FK-TSOS method. Numerical experiments for 3D models with heterogeneities, undulated discontinuous interfaces, and realistic model in eastern Tibet, illustrate the capability of hybrid method to accurately capture the scattered waves caused by heterogeneities in 3D medium. The 3D optimized FK-TSOS method developed shows low-memory requirement, high accuracy, and high efficiency, which makes it be a promising forward method to further apply to high-resolution mantle structure images beneath seismic array.

scholarly journals Rapid and Inexpensive Fabrication of Multi-Depth Microfluidic Device using High-Resolution LCD Stereolithographic 3D Printing

2019 ◽  
Vol 3 (1) ◽  
pp. 26 ◽  
Author(s):  
Mohamed Mohamed ◽  
Hitendra Kumar ◽  
Zongjie Wang ◽  
Nicholas Martin ◽  
Barry Mills ◽  
...  
Keyword(s):  
High Resolution ◽  
3D Printing ◽  
Soft Lithography ◽  
Liquid Crystal Display ◽  
Three Dimensional ◽  
Microfluidic Devices ◽  
Single Step ◽  
Droplet Generator ◽  
Rapid Fabrication ◽  
Printing System

With the dramatic increment of complexity, more microfluidic devices require 3D structures, such as multi-depth and -layer channels. The traditional multi-step photolithography is time-consuming and labor-intensive and also requires precise alignment during the fabrication of microfluidic devices. Here, we present an inexpensive, single-step, and rapid fabrication method for multi-depth microfluidic devices using a high-resolution liquid crystal display (LCD) stereolithographic (SLA) three-dimensional (3D) printing system. With the pixel size down to 47.25 μm, the feature resolutions in the horizontal and vertical directions are 150 μm and 50 μm, respectively. The multi-depth molds were successfully printed at the same time and the multi-depth features were transferred properly to the polydimethylsiloxane (PDMS) having multi-depth channels via soft lithography. A flow-focusing droplet generator with a multi-depth channel was fabricated using the presented 3D printing method. Experimental results show that the multi-depth channel could manipulate the morphology and size of droplets, which is desired for many engineering applications. Taken together, LCD SLA 3D printing is an excellent alternative method to the multi-step photolithography for the fabrication of multi-depth microfluidic devices. Taking the advantages of its controllability, cost-effectiveness, and acceptable resolution, LCD SLA 3D printing can have a great potential to fabricate 3D microfluidic devices.

Realization of Miniature Air Data System Based on Silicon Micro Pressure Sensor

2012 ◽  
Vol 503-504 ◽  
pp. 1445-1449
Author(s):  
Li Min Chang ◽  
Xiang Bin Yu ◽  
Li Jing Zhang
Keyword(s):  
Mach Number ◽  
High Resolution ◽  
Real Time ◽  
Pressure Sensor ◽  
Pressure Measurement ◽  
High Stability ◽  
Computer Calculation ◽  
High Accuracy ◽  
Data System ◽  
Embedded Computer

In this paper, miniature air data system is designed based on thermally excited resonant silicon micro structural pressure sensor. The system employs thermally excited resonant silicon micro structural pressure sensor for the pressure measurement. Using miniature embedded computer, calculation of the parameters such as height, airspeed and mach number and real-time display by LCD are realized. The volume and weight of this system is only one-twelfth of the original. In addition, it has the characteristics of high accuracy, high resolution, high stability and repeatability.

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