Rubber-Modified Glassy Amorphous Polymers Prepared via Chemically Induced Phase Separation. 1. Morphology Development and Mechanical Properties

2001 ◽  
Vol 34 (12) ◽  
pp. 3998-4006 ◽  
Author(s):  
B. J. P. Jansen ◽  
S. Rastogi ◽  
H. E. H. Meijer ◽  
P. J. Lemstra
Keyword(s):  
Mechanical Properties ◽  
Phase Separation ◽  
Amorphous Polymers ◽  
Chemically Induced ◽  
Morphology Development

Epoxy/methyl methacrylate acrylonitrile butadiene styrene (MABS) copolymer blends: reaction-induced viscoelastic phase separation, morphology development and mechanical properties

2019 ◽  
Vol 43 (23) ◽  
pp. 9216-9225 ◽  
Author(s):  
Jomon Joy ◽  
Krzysztof Winkler ◽  
Kuruvilla Joseph ◽  
S. Anas ◽  
Sabu Thomas
Keyword(s):  
Mechanical Properties ◽  
Phase Separation ◽  
Methyl Methacrylate ◽  
Acrylonitrile Butadiene Styrene ◽  
Copolymer Blends ◽  
Morphology Development ◽  
Butadiene Styrene

Epoxy/MABS blends undergo viscoelastic phase separation during curing due to the dynamic asymmetry of the phases and a significant improvement in the mechanical properties of the system is observed.

scholarly journals Mechanical and Morphological Properties of Bio-Phenolic/Epoxy Polymer Blends

Molecules ◽  
2021 ◽  
Vol 26 (4) ◽  
pp. 773
Author(s):  
Ahmad Safwan Ismail ◽  
Mohammad Jawaid ◽  
Norul Hisham Hamid ◽  
Ridwan Yahaya ◽  
Azman Hassan
Keyword(s):  
Mechanical Properties ◽  
Phase Separation ◽  
Polymer Blends ◽  
Epoxy Polymer ◽  
Flexural Modulus ◽  
Polymeric Materials ◽  
Morphological Properties ◽  
Comparison Results ◽  
Unique Material ◽  
Different Types

Polymer blends is a well-established and suitable method to produced new polymeric materials as compared to synthesis of a new polymer. The combination of two different types of polymers will produce a new and unique material, which has the attribute of both polymers. The aim of this work is to analyze mechanical and morphological properties of bio-phenolic/epoxy polymer blends to find the best formulation for future study. Bio-phenolic/epoxy polymer blends were fabricated using the hand lay-up method at different loading of bio-phenolic (5 wt%, 10 wt%, 15 wt%, 20 wt%, and 25 wt%) in the epoxy matrix whereas neat bio-phenolic and epoxy samples were also fabricated for comparison. Results indicated that mechanical properties were improved for bio-phenolic/epoxy polymer blends compared to neat epoxy and phenolic. In addition, there is no sign of phase separation in polymer blends. The highest tensile, flexural, and impact strength was shown by P-20(biophenolic-20 wt% and Epoxy-80 wt%) whereas P-25 (biophenolic-25 wt% and Epoxy-75 wt%) has the highest tensile and flexural modulus. Based on the finding, it is concluded that P-20 shows better overall mechanical properties among the polymer blends. Based on this finding, the bio-phenolic/epoxy blend with 20 wt% will be used for further study on flax-reinforced bio-phenolic/epoxy polymer blends.

scholarly journals Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1129
Author(s):  
Bo-Young Lee ◽  
Dae-Hyeon Lee ◽  
Keon-Soo Jang
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resins ◽  
Film Formation ◽  
Electronic Devices ◽  
Amorphous Polymers ◽  
Acidic Group ◽  
Adhesive Film ◽  
Acidic Compounds ◽  
Semiconductor Packaging ◽  
Compatibilizing Agent

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

Sign in / Sign up

Export Citation Format

Share Document