The Evolution of the Polycrystalline Copper Surface, First to Cu(111) and Then to Cu(100), at a Fixed CO2RR Potential: A Study by Operando EC-STM

Langmuir ◽  
2014 ◽  
Vol 30 (50) ◽  
pp. 15053-15056 ◽  
Author(s):  
Youn-Geun Kim ◽  
Jack Hess Baricuatro ◽  
Alnald Javier ◽  
John Mathew Gregoire ◽  
Manuel P. Soriaga
Keyword(s):  
Copper Surface ◽  
Polycrystalline Copper

Electrochemically Prepared Polycrystalline Copper Surface for the Growth of Hexagonal Boron Nitride

2017 ◽  
Vol 17 (4) ◽  
pp. 1669-1678 ◽  
Author(s):  
Karthik Sridhara ◽  
Boris N. Feigelson ◽  
James A. Wollmershauser ◽  
Jennifer K. Hite ◽  
Anindya Nath ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Copper Surface ◽  
Polycrystalline Copper

Room-Temperature UHV-Deposited Titanium Monoxide Films on Oxidized Polycrystalline Copper

2001 ◽  
Vol 672 ◽  
Author(s):  
V. M. Fuenzalida ◽  
C. R. Grahmann ◽  
C. Herrera ◽  
R. A. Zárate ◽  
C. Avila ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Room Temperature ◽  
Copper Substrate ◽  
Copper Film ◽  
Copper Surface ◽  
Native Oxide ◽  
Titanium Monoxide ◽  
Copper Films ◽  
Polycrystalline Copper ◽  
Tungsten Boat

ABSTRACTPolycrystalline copper films thicker than 100 nm were evaporated on silicon wafers with their native oxide under ultrahigh vacuum conditions leading to an rms roughness of ~2 nm of the copper film. X-ray photoelectron spectroscopy (XPS) revealed a clean copper surface with only traces of oxygen. The samples were exposed to air, leading to an oxide film consisting of CuO. TiO films were subsequently deposited onto the oxidized copper films from a resistively heated tungsten boat with the substrate at room temperature. The TiO films exhibited good adherence and were amorphous. XPS measurements revealed that the TiO films were contamination-free and that the first layers of TiO reduced the thin native oxide of the copper substrate from Cu(II) into Cu(I) or Cu(0) and transformed the TiO into TiO2 at the interface.

Influence of oxidative treatment of copper grid electrodes on the efficiency of conversion to aniline in the electroreduction of nitrobenzene and azobenzene in basic aqueous methanol

1994 ◽  
Vol 72 (12) ◽  
pp. 2353-2360 ◽  
Author(s):  
Anna Martel ◽  
Amoy Kam Cheong ◽  
Jean Lessard ◽  
Louis Brossard
Keyword(s):  
Current Efficiency ◽  
Copper Surface ◽  
Polycrystalline Copper ◽  
High Current ◽  
Average Yield ◽  
Aqueous Methanol ◽  
Copper Electrodes ◽  
Controlled Potential ◽  
Average Current ◽  
High Yields

The influence of preoxidizing the surface of polycrystalline copper electrodes on the efficiency of the controlled potential electrochemical reduction of nitrobenzene and azobenzene to aniline in basic aqueous methanol has been investigated. Electrodes electrochemically preoxidized to Cu(OH)2 or to Cu2O gave high yields of aniline (90–100%) with high current efficiencies (88–99%) for the electrohydrogenation of nitrobenzene compared to electrodes preoxidized by air (7–29% of aniline, 64–74% current efficiency). For the electrohydrogenation of azobenzene, copper electrodes preoxidized to Cu2O were found to be more active (average yield of aniline of 28%, average current efficiency of 55%) than electrodes preoxidized to Cu(OH)2 (3–11% of aniline, 42–53% current efficiency), and electrodes preoxidized by air were inactive (the electrohydrogenation stopped at hydrazobenzene). The improvement of activity induced by preoxidation of the copper surface is linked to the increase of the surface area.

scholarly journals ELECTROCHEMICAL BEHAVIOR OF POLYCRYSTALLINE COPPER DURING THE ADSORPTION OF CO ABSTRACT

2017 ◽  
Vol 20 (1) ◽  
pp. 19-26
Author(s):  
J. Salimon ◽  
M. Kalaji
Keyword(s):  
Electrochemical Properties ◽  
Hydrogen Evolution ◽  
Adsorption Process ◽  
Supporting Electrolyte ◽  
Copper Surface ◽  
Polycrystalline Copper ◽  
Cathodic Potential ◽  
Subsequent Formation ◽  
Adsorption Of Co ◽  
Supporting Electrolyte Solution

The electrochemical properties of electrode copper in carbon monoxide-saturated phosphate buffered solution were investigated. The electrochemistry of copper surface was sufficiently changed after the supporting electrolyte solution was saturated with CO. The hydrogen evolution region was depressed and shifted cathodically due to the adsorption process of CO on the copper surface in a linear or terminally bonded manner, Cu-CO . The oxidation and the reduction peaks of copper were significantly changed with two couple of redox peaks. This is due to the subsequent formation and the corresponding reduction of copper(I) and the copper carbon monoxides species. Further changed in electrochemical properties occurred when the electrode surface was polarized at high cathodic potential (-1.4 V) for a period of time (15 min). The hydrogen evolution region was further depressed due to the adsorption of CO process in multiple bonding sites as adsorbed bridge bonded CO, Cu-CO B L that occurred predominantly.

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

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