Anisotropic Thermal Expansion Behavior of Thin Films of Polymethylsilsesquioxane, a Spin-on-Glass Dielectric for High-Performance Integrated Circuits

Langmuir ◽  
2004 ◽  
Vol 20 (16) ◽  
pp. 6932-6939 ◽  
Author(s):  
Weontae Oh ◽  
Moonhor Ree
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Integrated Circuits ◽  
High Performance ◽  
Thermal Expansion Behavior ◽  
Anisotropic Thermal Expansion ◽  
Expansion Behavior

Magnetic layered perovskites of [CH3C(NH2)2]2[M(HCOO)4] (M = Co2+ and Ni2+): synthesis, structures and properties

2018 ◽  
Vol 47 (34) ◽  
pp. 11925-11933 ◽  
Author(s):  
Shu Liu ◽  
Bing-Wu Wang ◽  
Zhe-Ming Wang ◽  
Song Gao
Keyword(s):  
Thermal Expansion ◽  
Weak Ferromagnetism ◽  
Thermal Expansion Behavior ◽  
Anisotropic Thermal Expansion ◽  
Expansion Behavior ◽  
Structures And Properties ◽  
Layered Perovskites

Two layered perovskites of the formula [CH3C(NH2)2]2[M(HCOO)4] (M = Co and Ni) exhibit anisotropic thermal expansion behavior and weak ferromagnetism.

Anisotropic thermal expansion behavior in tetragonal Sr2MgWO6

2006 ◽  
Vol 41 (3) ◽  
pp. 674-682 ◽  
Author(s):  
S.N. Achary ◽  
K.R. Chakraborty ◽  
S.J. Patwe ◽  
A.B. Shinde ◽  
P.S.R. Krishna ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Behavior ◽  
Anisotropic Thermal Expansion ◽  
Expansion Behavior

scholarly journals Phonons and anisotropic thermal expansion behavior of NiX (X = S, Se, Te)

2019 ◽  
Vol 125 (20) ◽  
pp. 205106
Author(s):  
Prabhatasree Goel ◽  
M. K. Gupta ◽  
S. K. Mishra ◽  
Baltej Singh ◽  
R. Mittal ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Behavior ◽  
Anisotropic Thermal Expansion ◽  
Expansion Behavior

scholarly journals Thermal expansion behavior of thin films expanding freely on water surface

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Jae-Han Kim ◽  
Kyung-Lim Jang ◽  
Kwangho Ahn ◽  
Taeshik Yoon ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Water Surface ◽  
Thermal Expansion Behavior ◽  
Expansion Behavior

Anomalous thermal expansion behaviors of wood under dry and low-temperature conditions

Holzforschung ◽  
2014 ◽  
Vol 68 (5) ◽  
pp. 567-574 ◽  
Author(s):  
Tsunehisa Miki ◽  
Hiroyuki Sugimoto ◽  
Yuzo Furuta ◽  
Ichinori Shigematsu ◽  
Kozo Kanayama
Keyword(s):  
Thermal Expansion ◽  
Linear Thermal Expansion ◽  
Longitudinal Direction ◽  
Mechanical Analysis ◽  
Solid Wood ◽  
Compression Pressure ◽  
Thermal Expansion Behavior ◽  
Expansion Behavior ◽  
Dry Conditions ◽  
Anomalous Thermal Expansion

Abstract The thermal expansion behavior of dry solid wood was investigated by dynamic dilatometry and thermal mechanical analysis. Anomalous thermal expansion behavior was observed concerning the displacement change under a constant compression pressure, which was not previously reported. Wood submitted to temperatures below 0°C under dry conditions exhibited a large increment in the linear thermal expansion coefficient (CLTE) and a sudden drop in the CLTE around 50°C as well as above 130°C during heating. In subsequent cooling/heating processes, these anomalous behaviors remained at temperatures below 100°C, although less pronounced, and disappeared at temperatures above 100°C. These behaviors were clearly perceptible in the radial and tangential directions but not in the longitudinal direction. The CLTE depended strongly on the heat and moisture history of the samples and the effects are species-specific.

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