scholarly journals Surface Chemistry of CH3Br and Methyl Modified by Copper Deposition on Ru(001)

1999 ◽  
Vol 103 (27) ◽  
pp. 5665-5674 ◽  
Author(s):  
T. Livneh ◽  
M. Asscher
Keyword(s):  
Surface Chemistry ◽  
Copper Deposition

Impact of Surface Chemistry on Copper Deposition in Mesoporous Silicon

Langmuir ◽  
2016 ◽  
Vol 32 (30) ◽  
pp. 7452-7458 ◽  
Author(s):  
Walid Darwich ◽  
Anthony Garron ◽  
Piotr Bockowski ◽  
Catherine Santini ◽  
Frédéric Gaillard ◽  
...  
Keyword(s):  
Surface Chemistry ◽  
Copper Deposition ◽  
Mesoporous Silicon

Photoluminescence behavior of silicon nanocrystals: Role of surface chemistry and size

2008 ◽  
Author(s):  
Anoop Gupta ◽  
Folarin Erogbogbo ◽  
Mark T. Swihart ◽  
Hartmut Wiggers
Keyword(s):  
Surface Chemistry ◽  
Silicon Nanocrystals ◽  
Photoluminescence Behavior

Improved Autoadhesion Measurement Method for Micromachined Polysilicon Beams

1996 ◽  
Vol 444 ◽  
Author(s):  
Maarten P. de Boer ◽  
Terry A. Michalske
Keyword(s):  
Surface Chemistry ◽  
Optical Microscopy ◽  
Measurement Method ◽  
Current Practice ◽  
Cantilever Beams ◽  
Beam Length ◽  
Substrate Adhesion

AbstractWe have measured autoadhesion (e.g. stiction) of individual polysilicon beams by interferometric optical microscopy. Untreated cantilever beams were dried from water in air, while treated beams were coated with a hydrophobic molecular coating of octadecyltrichlorosilane (ODTS). Adhesion values obtained for beams adhered to the substrate over a long length (large d) are independent of beam length with values of 16.7 and 4.4 mJ/m2 for untreated and treated samples respectively. These values can be understood in terms of differences in surface chemistry and polysilicon roughness. Using the shortest length beam which remains attached to the substrate, adhesion values were 280 and 16 mJ/m2 respectively. These higher values may be a result of capillarity effects. We recommend that measurements be made on beams in which d is large, in contrast to the current practice of noting the shortest beam adhered.

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Surface Chemistry Effects on Quantum Confinement in Group IV Nanocrystals

2019 ◽  
Author(s):  
Nathan Neale ◽  
Michael Carroll ◽  
Rens Limpens ◽  
Lance Wheeler ◽  
Gregory Pach
Keyword(s):  
Surface Chemistry ◽  
Quantum Confinement ◽  
Group Iv
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