Epoxy–Amine Based Nanocomposites Reinforced by Silica Nanoparticles. Relationships between Morphologic Aspects, Cure Kinetics, and Thermal Properties

2011 ◽  
Vol 115 (46) ◽  
pp. 22789-22795 ◽  
Author(s):  
Camille Alzina ◽  
Nicolas Sbirrazzuoli ◽  
Alice Mija
Keyword(s):  
Thermal Properties ◽  
Silica Nanoparticles ◽  
Cure Kinetics ◽  
Epoxy Amine

scholarly journals Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3853
Author(s):  
Bilen Emek Abali ◽  
Michele Zecchini ◽  
Gilda Daissè ◽  
Ivana Czabany ◽  
Wolfgang Gindl-Altmutter ◽  
...  
Keyword(s):  
Inverse Analysis ◽  
Building Materials ◽  
Cure Kinetics ◽  
Accurate Estimation ◽  
Curing Process ◽  
Degree Of Cure ◽  
Material Parameters ◽  
Epoxy Amine ◽  
Thermosetting Polymers ◽  
Material Equation

Thermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature necessary for a fast and complete curing. As material properties depend on the degree of cure, its accurate estimation is of paramount interest and the main objective in this work. Thus, we develop an approach for modeling the curing process for epoxy based thermosetting polymers. Specifically, we perform experiments and demonstrate an inverse analysis for determining parameters in the curing model. By using calorimetry measurements and implementing an inverse analysis algorithm by using open-source packages, we obtain 10 material parameters describing the curing process. We present the methodology for two commercial, epoxy based products, where a statistical analysis provides independence of material parameters leading to the conclusion that the material equation is adequately describing the material response.

Cure Kinetics and Network Development of a Very High Tg Naphthalene-Based Epoxy Amine Network

2021 ◽  
Author(s):  
Samuel R. Swan ◽  
Claudia Creighton ◽  
Bekim V. Gashi ◽  
James M. Griffin ◽  
Russell J. Varley
Keyword(s):  
Cure Kinetics ◽  
Network Development ◽  
Epoxy Amine ◽  
Very High

Epoxy Cured with Anhydride Terminated Polydimethylsiloxane: Cure Kinetics and Thermal Properties

2011 ◽  
Vol 415-417 ◽  
pp. 261-264
Author(s):  
Yuan Ren ◽  
Zheng Xi ◽  
Wen Jun Gan ◽  
Liang Zhang ◽  
Jing Zhang ◽  
...  
Keyword(s):  
Activation Energy ◽  
Thermal Stability ◽  
Thermal Properties ◽  
Succinic Anhydride ◽  
Cure Kinetics ◽  
Diglycidyl Ether ◽  
Scanning Calorimetry ◽  
Thermogravimetric Analyses ◽  
Isothermal Measurements ◽  
Thermal Stability Of

A siloxane-containing dianhydride, succinic anhydride terminated polydimethylsiloxane (DMS-Z21) was selected to cure diglycidyl ether of bisphenol-A based epoxy resin (DGEBA). The cure kinetics and thermal properties were investigated by nonisothermal and isothermal differential scanning calorimetry (DSC) and thermogravimetric analyses (TGA), respectively. The activation energy (Ea) of the curing reaction was obtained based on the methods of Kissinger and isothermal measurements. The results of the thermogravimetric analyses of the DGEBA/DMS-Z21 system showed that the thermal stability of the DGEBA/DMS-Z21 system was slightly higher than the DGEBA/MeTHPA system.

Mechanical and Thermal Properties of Epoxy Composites Containing Amine-Modified Silica Nanoparticles

2017 ◽  
Vol 737 ◽  
pp. 262-268
Author(s):  
Hye Ryun Lee ◽  
Moon Il Kim ◽  
Hye Ryun Na ◽  
Choong Sun Lim ◽  
Bong Kuk Seo
Keyword(s):  
Tensile Strength ◽  
Glass Transition ◽  
Thermal Properties ◽  
Silica Nanoparticles ◽  
Flexural Modulus ◽  
Silica Particles ◽  
Test Machine ◽  
Mechanical And Thermal Properties ◽  
Modified Silica ◽  
Modified Silica Nanoparticles

Epoxy/silica composites were prepared using aminopropyl triethoxysilane (APTES)-modified silica nanoparticles in the sol state. Different sizes of silica particles were synthesized and they were applied into the epoxy/silica composites with different compositions. The mechanical and thermal properties of the composites were investigated and compared with those of pristine epoxy composite. The structure and morphology of the modified silica nanoparticles and epoxy/silica composites were analyzed using field emission scanning electron microscope. The flexural modulus and tensile strength of the epoxy/silica composites were investigated by universal test machine (UTM). Also, glass transition and thermal stability were investigated using thermomechanical analyzer (TMA). Sizes of silica particles in sol state were controlled by using different concentration of the accelerator. The tensile strength of epoxy/silica composites containing 20 wt% of 30 nm silica was found to be 37.98 MPa. In addition, the glass transition temperature (Tg) decreased with increasing silica particle sizes.

Anomalies between Microwave and Thermal Cure Kinetics of Epoxy-Amine Resin Systems

1999 ◽  
Vol 11 (1) ◽  
pp. 27-39 ◽  
Author(s):  
D G Rogers ◽  
E Marand ◽  
D J T Hill ◽  
G A George
Keyword(s):  
Cure Kinetics ◽  
Thermal Cure ◽  
Epoxy Amine ◽  
Kinetics Of

Synthesis, cure kinetics, and thermal properties of the Bis(3-allyl-2-cyanatophenyl)sulphoxide/BMI blends

2008 ◽  
Vol 110 (1) ◽  
pp. 517-522 ◽  
Author(s):  
G. Anuradha ◽  
M. Sarojadevi ◽  
P. R. Sundararajan
Keyword(s):  
Thermal Properties ◽  
Cure Kinetics

Cure kinetics of several epoxy–amine systems at ambient and high temperatures

2014 ◽  
Vol 11 (2) ◽  
pp. 143-157 ◽  
Author(s):  
Monoj Pramanik ◽  
Eric W. Fowler ◽  
James W. Rawlins
Keyword(s):  
High Temperatures ◽  
Cure Kinetics ◽  
Epoxy Amine ◽  
Kinetics Of
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