Three-Dimensional Metallic Boron Nitride

2013 ◽  
Vol 135 (48) ◽  
pp. 18216-18221 ◽  
Author(s):  
Shunhong Zhang ◽  
Qian Wang ◽  
Yoshiyuki Kawazoe ◽  
Puru Jena
Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 938 ◽  
Author(s):  
Weijie Liang ◽  
Xin Ge ◽  
Jianfang Ge ◽  
Tiehu Li ◽  
Tingkai Zhao ◽  
...  

The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements are restricted by the amount of hBN nanosheets added, owing to a dramatic increase in the viscosity of silicone thermal grease. To this end, a rational structural design of the filler is needed to ensure the viable development of the composite material. Using reduced graphene oxide (RGO) as substrate, three-dimensional (3D) heterostructured reduced graphene oxide-hexagonal boron nitride (RGO-hBN)-stacking material was constructed by self-assembly of hBN nanosheets on the surface of RGO with the assistance of binder for silicone thermal grease. Compared with hBN nanosheets, 3D RGO-hBN more effectively improves the thermally conductive properties of silicone thermal grease, which is attributed to the introduction of graphene and its phonon-matching structural characteristics. RGO-hBN/silicone thermal grease with lower viscosity exhibits higher thermal conductivity, lower thermal resistance and better thermal management capability than those of hBN/silicone thermal grease at the same filler content. It is feasible to develop polymer-based thermal interface materials with good thermal transport performance for heat removal of modern electronics utilising graphene-supported hBN as the filler at low loading levels.


2019 ◽  
Vol 11 (10) ◽  
pp. 10276-10282 ◽  
Author(s):  
Chen Yang ◽  
Dan Liu ◽  
Ying Chen ◽  
Cheng Chen ◽  
Jiemin Wang ◽  
...  

Small ◽  
2014 ◽  
Vol 10 (15) ◽  
pp. 2992-2999 ◽  
Author(s):  
Manuela Loeblein ◽  
Roland Yingjie Tay ◽  
Siu Hon Tsang ◽  
Wei Beng Ng ◽  
Edwin Hang Tong Teo

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.


2022 ◽  
Author(s):  
Dong Xia ◽  
Huayang Yu ◽  
Qun Li ◽  
Jamie Mannering ◽  
Robert Menzel ◽  
...  

Boron nitride (BN) aerogels are three-dimensional, bulk materials, with exceptional performances in a wide range of areas. However, detailed investigations into the relationships of synthesis, structure, and properties are rare....


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