Volatile and Thermally Stable Mid to Late Transition Metal Complexes Containing α-Imino Alkoxide Ligands, a New Strongly Reducing Coreagent, and Thermal Atomic Layer Deposition of Ni, Co, Fe, and Cr Metal Films

2013 ◽  
Vol 135 (34) ◽  
pp. 12588-12591 ◽  
Author(s):  
Lakmal C. Kalutarage ◽  
Philip D. Martin ◽  
Mary Jane Heeg ◽  
Charles H. Winter
2021 ◽  
Author(s):  
Nils Boysen ◽  
Anish Philip ◽  
Detlef Rogalla ◽  
Maarit Karppinen ◽  
Anjana Devi

Cu and Ag precursors that are volatile, reactive, and thermally stable are currently of high interest for their application in atomic layer deposition (ALD) of thin metal films. In pursuit of new precursors for coinage metals namely Cu and Ag, a series of new N-heterocyclic carbene (NHC) based Cu(I) and Ag(I) complexes were synthesized. Modifications in the substitution pattern of diketonate-based anionic backbones led to five monomeric Cu complexes and four closely related Ag complexes with the general formula [M(tBuNHC)(R)] (M = Cu, Ag; tBuNHC = 1,3-di-tert-butyl-imidazolin-2-ylidene; R = diketonate). Thermal analysis indicated that most of the Cu complexes are thermally stable and volatile compared to the more fragile Ag analogs. One of the promising Cu precursors was evaluated for the ALD of nanoparticulate Cu metal films using hydroquinone as the reducing agent at appreciably low deposition temperatures (145–160 °C). This study highlights the considerable impact of the employed ligand sphere on the structural and thermal properties of metal complexes that are relevant for vapor phase processing of thin films.


2021 ◽  
Author(s):  
Nils Boysen ◽  
Anish Philip ◽  
Detlef Rogalla ◽  
Maarit Karppinen ◽  
Anjana Devi

Cu and Ag precursors that are volatile, reactive, and thermally stable are currently of high interest for their application in atomic layer deposition (ALD) of thin metal films. In pursuit of new precursors for coinage metals namely Cu and Ag, a series of new N-heterocyclic carbene (NHC) based Cu(I) and Ag(I) complexes were synthesized. Modifications in the substitution pattern of diketonate-based anionic backbones led to five monomeric Cu complexes and four closely related Ag complexes with the general formula [M(tBuNHC)(R)] (M = Cu, Ag; tBuNHC = 1,3-di-tert-butyl-imidazolin-2-ylidene; R = diketonate). Thermal analysis indicated that most of the Cu complexes are thermally stable and volatile compared to the more fragile Ag analogs. One of the promising Cu precursors was evaluated for the ALD of nanoparticulate Cu metal films using hydroquinone as the reducing agent at appreciably low deposition temperatures (145–160 °C). This study highlights the considerable impact of the employed ligand sphere on the structural and thermal properties of metal complexes that are relevant for vapor phase processing of thin films.


RSC Advances ◽  
2015 ◽  
Vol 5 (8) ◽  
pp. 5879-5885 ◽  
Author(s):  
Nuttapol Risangud ◽  
Zhijian Li ◽  
Athina Anastasaki ◽  
Paul Wilson ◽  
Kristian Kempe ◽  
...  

Hydrosilylation is a well-established reaction for the preparation of organo-silicon compounds, in which vinyl groups react with silanes (Si–H) usually catalysed by late transition metal complexes, most often Pt(ii) complexes.


2018 ◽  
Vol 20 (17) ◽  
pp. 11682-11691
Author(s):  
M. A. Peck ◽  
G. R. Hearne ◽  
C. Obuah ◽  
J. Darkwa

57Fe Mössbauer spectroscopy has been used to study electronic dispersions in complexes of Fe, Co, Ni and Pd anchored onto 3-ferrocenyl-5-methylpyrazolylmethylenepyridine and 3-ferrocenylpyrazolylmethylenepyridine ligands.


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