A THERMODYNAMIC STUDY OF THE SYSTEM AMMONIUM FLUORIDE-WATER. II. THE SOLID SOLUTION OF AMMONIUM FLUORIDE IN ICE

1961 ◽  
Vol 65 (3) ◽  
pp. 408-414 ◽  
Author(s):  
Leonard C. Labowitz ◽  
Edgar F. Westrum
Keyword(s):  
Solid Solution ◽  
Ammonium Fluoride ◽  
Thermodynamic Study

scholarly journals Thermodynamic Study of the Silver-Rich Ag–Cu Solid Solution

1992 ◽  
Vol 33 (1) ◽  
pp. 51-56 ◽  
Author(s):  
Marcus Bienzle ◽  
Toshio Oishi ◽  
Ferdinand Sommer ◽  
Katsutoshi Ono
Keyword(s):  
Solid Solution ◽  
Thermodynamic Study

scholarly journals Thermodynamic Study of Fe–Ni Solid Solution

1977 ◽  
Vol 18 (9) ◽  
pp. 610-616 ◽  
Author(s):  
Katsutoshi Ono ◽  
Yukitomi Ueda ◽  
Akio Yamaguchi ◽  
Joichiro Moriyama
Keyword(s):  
Solid Solution ◽  
Thermodynamic Study

scholarly journals Thermodynamic study of semiconducting related materials by use of EMF method with solid electrolyte

2003 ◽  
Vol 39 (3-4) ◽  
pp. 453-464 ◽  
Author(s):  
Iwao Katayama ◽  
Toshihiro Tanaka ◽  
Takamichi Iida
Keyword(s):  
Solid Solution ◽  
Solid Electrolyte ◽  
Thermodynamic Functions ◽  
Electromotive Force ◽  
Experimental Methods ◽  
Thermodynamic Study ◽  
Published Data ◽  
Emf Method ◽  
Force Method ◽  
Electromotive Force Method

Electromotive force method with solid electrolyte is briefly explained, and a thermodynamic study of semi conducting compound solid solution ZnTe-CdTe is picked up to show the way how thermodynamic functions of this system are obtained by several experimental methods based on our published papers and recently published data are added for comparison.

NiAl precipitation in Fe-12w/o Cr-5w/o Ni-4w/o Al

1983 ◽  
Vol 41 ◽  
pp. 202-203
Author(s):  
L.E. Murr ◽  
J.S. Dunning ◽  
S. Shankar
Keyword(s):  
Solid Solution ◽  
Stainless Steel ◽  
Stainless Steels ◽  
Alloy Composition ◽  
Chromium Content ◽  
Scale Up ◽  
Optical Metallography ◽  
Property Evaluation ◽  
310 Stainless Steel ◽  
Microstructural Studies

Aluminum additions to conventional 18Cr-8Ni austenitic stainless steel compositions impart excellent resistance to high sulfur environments. However, problems are typically encountered with aluminum additions above about 1% due to embrittlement caused by aluminum in solid solution and the precipitation of NiAl. Consequently, little use has been made of aluminum alloy additions to stainless steels for use in sulfur or H2S environments in the chemical industry, energy conversion or generation, and mineral processing, for example.A research program at the Albany Research Center has concentrated on the development of a wrought alloy composition with as low a chromium content as possible, with the idea of developing a low-chromium substitute for 310 stainless steel (25Cr-20Ni) which is often used in high-sulfur environments. On the basis of workability and microstructural studies involving optical metallography on 100g button ingots soaked at 700°C and air-cooled, a low-alloy composition Fe-12Cr-5Ni-4Al (in wt %) was selected for scale up and property evaluation.

Solid Solution Effects and Deformation Micros trueture of Shock-Loaded Iron Manganese Alloys

1970 ◽  
Vol 28 ◽  
pp. 420-421
Author(s):  
A. Christou ◽  
J. V. Foltz ◽  
N. Brown
Keyword(s):  
Solid Solution ◽  
Shock Loading ◽  
High Strain ◽  
Local Stress ◽  
Strain Rates ◽  
Local Stress Concentration ◽  
Bcc Metals ◽  
Manganese Alloys ◽  
Iron Manganese ◽  
Transmission Microscope

In general, all BCC transition metals have been observed to twin under appropriate conditions. At the present time various experimental reports of solid solution effects on BCC metals have been made. Indications are that solid solution effects are important in the formation of twins. The formation of twins in metals and alloys may be explained in terms of dislocation mechanisms. It has been suggested that twins are nucleated by the achievement of local stress-concentration of the order of 15 to 45 times the applied stress. Prietner and Leslie have found that twins in BCC metals are nucleated at intersections of (110) and (112) or (112) and (112) type of planes.In this paper, observations are reported of a transmission microscope study of the iron manganese series under conditions in which twins both were and were not formed. High strain rates produced by shock loading provided the appropriate deformation conditions. The workhardening mechanisms of one alloy (Fe - 7.37 wt% Mn) were studied in detail.

Fine Microstructure of a Mechanically Alloyed Oxide Dispersion Strengthened Nickel-Base Superalloy

1977 ◽  
Vol 35 ◽  
pp. 298-299
Author(s):  
Jordi Marti ◽  
Timothy E. Howson ◽  
David Kratz ◽  
John K. Tien
Keyword(s):  
Solid Solution ◽  
Volume Fraction ◽  
Stress Rupture ◽  
Oxide Dispersion Strengthened ◽  
Solid Solution Alloy ◽  
Oxide Dispersion ◽  
Creep And Stress Rupture ◽  
Mechanically Alloyed ◽  
Fine Microstructure ◽  
Nickel Base

The previous paper briefly described the fine microstructure of a mechanically alloyed oxide dispersion strengthened nickel-base solid solution. This note examines the fine microstructure of another mechanically alloyed system. This alloy differs from the one described previously in that it is more generously endowed with coherent precipitate γ forming elements A1 and Ti and it contains a higher volume fraction of the finely dispersed Y2O3 oxide. An interesting question to answer in the comparative study of the creep and stress rupture of these two ODS systems is the role of the precipitate γ' in the mechanisms of creep and stress rupture in alloys already containing oxide dispersoids.The nominal chemical composition of this alloy is Ni - 20%Cr - 2.5%Ti - 1.5% A1 - 1.3%Y203 by weight. The system receives a three stage heat treatment-- the first designed to produce a coarse grain structure similar to the solid solution alloy but with a smaller grain aspect ratio of about ten.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

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