Bifurcation structure of the chemical oscillation in the hexacyanoferrate(4-)-hydrogen peroxide-sulfuric acid system

1993 ◽  
Vol 97 (28) ◽  
pp. 7375-7378 ◽  
Author(s):  
Yoshihito Mori ◽  
Ichiro Hanazaki
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
Acid System ◽  
Bifurcation Structure ◽  
Chemical Oscillation

Study on Microetching Performance of Hydrogen Peroxide / Sulfuric Acid System

2011 ◽  
Vol 233-235 ◽  
pp. 614-618 ◽  
Author(s):  
Yan Yang ◽  
De Liang Li
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
Acid Content ◽  
Copper Concentration ◽  
Acid System ◽  
Optimum Conditions ◽  
Operation Temperature ◽  
Sulfuric Acid Content ◽  
Static Corrosion

In order to get the optimum technological conditions of the hydrogen peroxide /sulfuric acid system,the static corrosion method was used to study the related parameters including compositions of the microetching system and the operation temperature. The results of the experiment show that the microetching performance of the hydrogen peroxide /sulfuric acid system was excellent under optimum conditions of maintaining temperature at 30~35, copper concentration about 25 g/L, hydrogen peroxide 30~40 g/L and sulfuric acid content 70~90 g/L . The process of microetching is stable and controllable.

scholarly journals Effective Recovery Process of Copper from Waste Printed Circuit Boards Utilizing Recycling of Leachate

JOM ◽  
2020 ◽  
Author(s):  
Joona Rajahalme ◽  
Siiri Perämäki ◽  
Roshan Budhathoki ◽  
Ari Väisänen
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
Printed Circuit Boards ◽  
Sulfuric Acid Concentration ◽  
Recovery Process ◽  
Copper Recovery ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Acid Consumption

AbstractThis study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.

A New pH Oscillator:  The Chlorite−Sulfite−Sulfuric Acid System in a CSTR

2001 ◽  
Vol 105 (5) ◽  
pp. 829-837 ◽  
Author(s):  
Glen A. Frerichs ◽  
Tara M. Mlnarik ◽  
Robert J. Grun ◽  
Richard C. Thompson
Keyword(s):  
Sulfuric Acid ◽  
Acid System

Effect of Oxidant on the Leaching Rate of Indium from Water Quenching Slag

2013 ◽  
Vol 591 ◽  
pp. 122-125
Author(s):  
Li Jiao Yang ◽  
Si Chen ◽  
Yan Zhang ◽  
Nan Chun Chen ◽  
Jun Gao ◽  
...  
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
Potassium Permanganate ◽  
Crystal Violet ◽  
Acid Leaching ◽  
Water Quenching ◽  
Test Results ◽  
Leaching Rate ◽  
Initial Concentration ◽  
Solid Ratio

Extracting indium from water quenching slag, which contains poor indium, by two process of leaching, the effect of different oxidants and dosages on the leaching rate of indium in water quenching slag were studied. The leaching conditions: temperature 80 °C, leaching time 2 h, the liquid to solid ratio of neutral leaching 8︰1, the liquid to solid ratio of acid leaching 2︰1, initial concentration of sulfuric acid 500 g·L-1, adding different oxidants, the concentration was detected by crystal violet spectrophotometry. Test results showed that the leaching rate of indium was significantly improved by adding hydrogen peroxide and potassium permanganate. Compared with the effect of different oxidants, the effect of potassium permanganate was significantly higher than that of hydrogen peroxide on the leaching rate of indium.

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