Metal Surface Effects on Heat Resistance of Adhesive Bonds

1958 ◽  
Vol 50 (6) ◽  
pp. 918-921 ◽  
Author(s):  
J. M. Black ◽  
R. F. Blomquist
2015 ◽  
Vol 806 ◽  
pp. 135-140
Author(s):  
Elena F. Kudina ◽  
Natalia S. Vinidiktova ◽  
Vladeta Jevremović ◽  
Radovan Nikolić

Epoxy-silicate modifiers were obtained by a sol-gel procedure from the alkali-silicate solutions and their effect on physico-mechanical properties of the coatings based on the binary epoxide binder were investigated. It is shown that pretreatment of the metal surface effects strength of adhesive bonding with the epoxide coating.


Author(s):  
L.H. Bolz ◽  
D.H. Reneker

The attack, on the surface of a polymer, by the atomic, molecular and ionic species that are created in a low pressure electrical discharge in a gas is interesting because: 1) significant interior morphological features may be revealed, 2) dielectric breakdown of polymeric insulation on high voltage power distribution lines involves the attack on the polymer of such species created in a corona discharge, 3) adhesive bonds formed between polymer surfaces subjected to such SDecies are much stronger than bonds between untreated surfaces, 4) the chemical modification of the surface creates a reactive surface to which a thin layer of another polymer may be bonded by glow discharge polymerization.


Author(s):  
L.E. Murr ◽  
V. Annamalai

Georgius Agricola in 1556 in his classical book, “De Re Metallica”, mentioned a strange water drawn from a mine shaft near Schmölnitz in Hungary that eroded iron and turned it into copper. This precipitation (or cementation) of copper on iron was employed as a commercial technique for producing copper at the Rio Tinto Mines in Spain in the 16th Century, and it continues today to account for as much as 15 percent of the copper produced by several U.S. copper companies.In addition to the Cu/Fe system, many other similar heterogeneous, electrochemical reactions can occur where ions from solution are reduced to metal on a more electropositive metal surface. In the case of copper precipitation from solution, aluminum is also an interesting system because of economic, environmental (ecological) and energy considerations. In studies of copper cementation on aluminum as an alternative to the historical Cu/Fe system, it was noticed that the two systems (Cu/Fe and Cu/Al) were kinetically very different, and that this difference was due in large part to differences in the structure of the residual, cement-copper deposit.


Author(s):  
A. Elgsaeter ◽  
T. Espevik ◽  
G. Kopstad

The importance of a high rate of temperature decrease (“rapid freezing”) when freezing specimens for freeze-etching has long been recognized1. The two basic methods for achieving rapid freezing are: 1) dropping the specimen onto a metal surface at low temperature, 2) bringing the specimen instantaneously into thermal contact with a liquid at low temperature and subsequently maintaining a high relative velocity between the liquid and the specimen. Over the last couple of years the first method has received strong renewed interest, particularily as the result of a series of important studies by Heuser and coworkers 2,3. In this paper we will compare these two freezing methods theoretically and experimentally.


2007 ◽  
Vol 177 (4S) ◽  
pp. 93-93
Author(s):  
Makoto Sumitomo ◽  
Kenji Kuroda ◽  
Takako Asano ◽  
Akio Horiguchi ◽  
Keiichi Ito ◽  
...  

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