Interfacial forces, average pore size, and pore size distribution of ultrafiltration membranes

1982 ◽  
Vol 21 (4) ◽  
pp. 605-612 ◽  
Author(s):  
Kam Chan ◽  
Takeshi Matsuura ◽  
S. Sourirajan
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Average Pore Size ◽  
Ultrafiltration Membranes ◽  
Average Pore ◽  
Interfacial Forces

Evaluation of the Effect of Catalyst Pore-Size Distribution on the Effectiveness Factor in Ethylbenzene Dehydrogenation by Orthogonal Collocation

2011 ◽  
Vol 316-317 ◽  
pp. 155-169
Author(s):  
Mohammad Ebrahim Zeynali
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Average Pore Size ◽  
Effectiveness Factor ◽  
Orthogonal Collocation ◽  
Average Pore ◽  
Catalyst Pellet ◽  
Pore Size Distributions ◽  
Styrene Production

The mathematical model for multicomponent diffusion in styrene production is given considering all six reactions involved in styrene production. The diffusion coefficients for catalyst pellet are calculated for unimodal and bimodal pore size distributions using trapezoidal rule of integration. The effects of standard deviation and average pore size on the diffusion coefficient are determined. The differential equations are converted to algebraic equations and solved by the orthogonal collocation method. The effectiveness factor of catalyst pellet in styrene production is calculated for various pore sizes. It is seen that the average pore size and pore size distribution affects the production rate and effectiveness factor significantly.

Probing Pore Characteristics in Low-K Thin Films Using Positronium Annihilation Lifetime Spectroscopy

2000 ◽  
Vol 612 ◽  
Author(s):  
D. W. Gidley ◽  
W. E. Frieze ◽  
T. L. Dull ◽  
J. N. Sun ◽  
A. F. Yee
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Average Pore Size ◽  
Gas Absorption ◽  
Porous Films ◽  
Pore Characteristics ◽  
Average Pore ◽  
Positronium Annihilation ◽  
Positronium Annihilation Lifetime Spectroscopy

AbstractDepth profiled positronium annihilation lifetime spectroscopy (PALS) has been used to probe the pore characteristics (size, distribution, and interconnectivity) in thin, porous films, including silica and organic-based films. The technique is sensitive to all pores (both interconnected and closed) in the size range from 0.3 nm to 300 nm, even in films buried under a diffusion barrier. PALS may be particularly useful in deducing the pore-size distribution in closed-pore systems where gas absorption methods are not available. In this technique a focussed beam of several keV positrons forms positronium (Ps, the electron-positron bound state) with a depth distribution that depends on the selected positron beam energy. Ps inherently localizes in the pores where its natural (vacuum) annihilation lifetime of 142 ns is reduced by collisions with the pore surfaces. The collisionally reduced Ps lifetime is correlated with pore size and is the key feature in transforming a Ps lifetime distribution into a pore size distribution. In thin silica films that have been made porous by a variety of methods the pores are found to be interconnected and an average pore size is determined. In a mesoporous methyl-silsesquioxane film with nominally closed pores a pore size distribution has been determined. The sensitivity of PALS to metal overlayer interdiffusion is demonstrated. PALS is a non-destructive, depth profiling technique with the only requirement that positrons can be implanted into the porous film where Ps can form.

Sol-Gel Processing of Low Dielectric Constant Nanoporous Silica Thin Films

2001 ◽  
Vol 703 ◽  
Author(s):  
Deok-Yang Kim ◽  
Henry Du ◽  
Suhas Bhandarkar ◽  
David W. Johnson
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Average Pore Size ◽  
Sol Gel ◽  
Porous Silica ◽  
Dielectric Constants ◽  
Gelling Agent ◽  
Porous Films ◽  
Average Pore

ABSTRACTTetramethyl ammonium silicate (TMAS) is known as a structuring agent in zeolite synthesis. We report its first use to prepare porous silica films for low k dielectric applications in microelectronics. A solution of TMAS 18.7 wt. % was spin coated on silicon substrates with a 3000 Å thick thermal oxide. The spin coated films were subsequently heat-treated at 450°C to obtain porous silica. The use of TMAS solution without gelation led to films of only moderate porosity value of 10%. The addition of methyl lactate, a gelling agent, significantly increased film porosity and improved the pore size distribution. For example, 50% porosity and uniform pore size distribution (average pore size ∼ 40 Å) has been achieved. Dielectric constants (k) of our porous films are as low as 2.5.

scholarly journals Filtration performance and pore size distribution of hypochlorite aged PES/PVP ultrafiltration membranes

2015 ◽  
Vol 474 ◽  
pp. 175-186 ◽  
Author(s):  
Bastien Pellegrin ◽  
Fernanda Mezzari ◽  
Yamina Hanafi ◽  
Anthony Szymczyk ◽  
Jean-Christophe Remigy ◽  
...  
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Ultrafiltration Membranes ◽  
Filtration Performance

Characterisation of Low-K Dielectric Films by Ellipsometric Porosimetry

2000 ◽  
Vol 612 ◽  
Author(s):  
M.R. Baklanov ◽  
K.P. Mogilnikov
Keyword(s):  
Pore Size Distribution ◽  
Pore Size ◽  
Size Distribution ◽  
Surface Area ◽  
Average Pore Size ◽  
Dielectric Films ◽  
Swelling Properties ◽  
Small Surface ◽  
Ellipsometric Porosimetry ◽  
Low K

AbstractEllipsometric porosimetry (EP) is a simple and effective method for the characterization of the porosity (volume of both open and close pores), average pore size, specific surface area and pore size distribution (PSD) in thin porous films deposited on top of any smooth solid substrat e. Because a laser probe is used, small surface area can be analyzed. Therefore, EP can be used on patterned wafers and it is compatible with microelectronic technology. This method is a new version of adsorption (BET) porosimetry. In situ ellipsometry is used to determine the amount of adsorptive which adsorbed/condensed in the film. Change in refractive index is used to calculate of the quantity of adsorptive present in the film. EP also allows the study of thermal stability, adsorption and swelling properties of low-K dielectric films. Room temperature EP based on the adsorption of vapor of some suitable organic solvents and method of calculation of porosity and PSD is discussed. Examination of the validity of Gurvitsch rule for various organic adsorptives (toluene, heptane, carbon tetrachloride and isopropyl alcohol) has been carried out to assess the reliability of measurements of pore size distribution by the ellipsometric porosimetry.

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