Partitioning of Hydrophobic Organic Compounds to Hydroxypropyl-β-cyclodextrin:  Experimental Studies and Model Predictions for Surfactant-Enhanced Remediation Applications

1999 ◽  
Vol 33 (16) ◽  
pp. 2765-2770 ◽  
Author(s):  
Seok-Oh Ko ◽  
Mark A. Schlautman ◽  
Elizabeth R. Carraway
1998 ◽  
Vol 32 (18) ◽  
pp. 2769-2775 ◽  
Author(s):  
Seok-Oh Ko ◽  
Mark A. Schlautman ◽  
Elizabeth R. Carraway

Chemosphere ◽  
1990 ◽  
Vol 20 (1-2) ◽  
pp. 161-178 ◽  
Author(s):  
Brian J. Eadie ◽  
Nancy R. Morehead ◽  
Peter F. Landrum

1996 ◽  
Vol 118 (4) ◽  
pp. 214-222 ◽  
Author(s):  
T. E. Voth ◽  
T. L. Bergman

The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide development of a process model capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system’s thermomechanical response to thermal and mechanical processing conditions, as well as component properties. High thermal conductivity assemblies show the greatest sensitivity to mechanical loading conditions.


Chemosphere ◽  
2020 ◽  
Vol 252 ◽  
pp. 126534
Author(s):  
Liang Wu ◽  
Rong Wang ◽  
Chun-Li Huang ◽  
Chen-Chou Wu ◽  
Charles S. Wong ◽  
...  

1999 ◽  
Vol 71 (20) ◽  
pp. 4506-4512 ◽  
Author(s):  
Tohru Saitoh ◽  
Yuki Yoshida ◽  
Toshiyuki Matsudo ◽  
Shinsuke Fujiwara ◽  
Akira Dobashi ◽  
...  

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