Investigation and Refinement of Palladium-Coupling Conditions for the Synthesis of Diarylethyne-Linked Multiporphyrin Arrays

1999 ◽  
Vol 11 (10) ◽  
pp. 2974-2983 ◽  
Author(s):  
Richard W. Wagner ◽  
Yangzhen Ciringh ◽  
Christian Clausen ◽  
Jonathan S. Lindsey
2020 ◽  
Vol 4 (1) ◽  
pp. 9
Author(s):  
Vasilios Karanikolas ◽  
Ioannis Thanopulos ◽  
Emmanuel Paspalakis

Two-dimensional materials allow for extreme light confinement, thus becoming important candidates for all optical application platforms.  [...]


Sensors ◽  
2021 ◽  
Vol 21 (6) ◽  
pp. 2042
Author(s):  
Redha Boubenia ◽  
Patrice Le Moal ◽  
Gilles Bourbon ◽  
Emmanuel Ramasso ◽  
Eric Joseph

The paper deals with a capacitive micromachined ultrasonic transducer (CMUT)-based sensor dedicated to the detection of acoustic emissions from damaged structures. This work aims to explore different ways to improve the signal-to-noise ratio and the sensitivity of such sensors focusing on the design and packaging of the sensor, electrical connections, signal processing, coupling conditions, design of the elementary cells and operating conditions. In the first part, the CMUT-R100 sensor prototype is presented and electromechanically characterized. It is mainly composed of a CMUT-chip manufactured using the MUMPS process, including 40 circular 100 µm radius cells and covering a frequency band from 310 kHz to 420 kHz, and work on the packaging, electrical connections and signal processing allowed the signal-to-noise ratio to be increased from 17 dB to 37 dB. In the second part, the sensitivity of the sensor is studied by considering two contributions: the acoustic-mechanical one is dependent on the coupling conditions of the layered sensor structure and the mechanical-electrical one is dependent on the conversion of the mechanical vibration to electrical charges. The acoustic-mechanical sensitivity is experimentally and numerically addressed highlighting the care to be taken in implementation of the silicon chip in the brass housing. Insertion losses of about 50% are experimentally observed on an acoustic test between unpackaged and packaged silicon chip configurations. The mechanical-electrical sensitivity is analytically described leading to a closed-form amplitude of the detected signal under dynamic excitation. Thus, the influence of geometrical parameters, material properties and operating conditions on sensitivity enhancement is clearly established: such as smaller electrostatic air gap, and larger thickness, Young’s modulus and DC bias voltage.


2015 ◽  
Vol 261 ◽  
pp. 38-42
Author(s):  
Gianluigi Tiberi ◽  
Nunzia Fontana ◽  
Agostino Monorchio ◽  
Riccardo Stara ◽  
Alessandra Retico ◽  
...  

ChemInform ◽  
2003 ◽  
Vol 34 (35) ◽  
Author(s):  
T. Yu. Orlova ◽  
Yu. S. Nekrasov ◽  
P. V. Petrovskii ◽  
M. G. Ezernitskaya

1969 ◽  
Vol 30 (9) ◽  
pp. 624-625 ◽  
Author(s):  
H. Weigmann ◽  
G. Rohr ◽  
J. Winter

Author(s):  
Ramesh Mamidala ◽  
Chandrasekhar Kommuri ◽  
Justin Paulose ◽  
Hema Aswath ◽  
Lokesh Pawar ◽  
...  

1994 ◽  
Vol 35 (27) ◽  
pp. 4711-4714 ◽  
Author(s):  
Miguel A. Romero ◽  
Alex G. Fallis
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document