Theoretical Prediction of New High-Performance Lead-Free Piezoelectrics

2005 ◽  
Vol 17 (6) ◽  
pp. 1376-1380 ◽  
Author(s):  
Pio Baettig ◽  
Charles F. Schelle ◽  
Richard LeSar ◽  
Umesh V. Waghmare ◽  
Nicola A. Spaldin
Keyword(s):  
Theoretical Prediction ◽  
High Performance ◽  
Lead Free

scholarly journals Lead-free halide perovskite Cs3Bi2Br9 single crystals for high-performance X-ray detection

2021 ◽  
Author(s):  
Xiang Li ◽  
Xinyuan Du ◽  
Peng Zhang ◽  
Yunqiu Hua ◽  
Lin Liu ◽  
...  
Keyword(s):  
Single Crystals ◽  
High Performance ◽  
Lead Free ◽  
X Ray ◽  
Halide Perovskite

High performance Bi0.5Na0.5TiO3-BiAlO3-K0.5Na0.5NbO3 lead-free pyroelectric ceramics for thermal detectors

2018 ◽  
Vol 112 (14) ◽  
pp. 142903 ◽  
Author(s):  
Zhen Liu ◽  
Weijun Ren ◽  
Ping Peng ◽  
Shaobo Guo ◽  
Teng Lu ◽  
...  
Keyword(s):  
High Performance ◽  
Lead Free ◽  
Thermal Detectors

High-performance lead-free two-dimensional perovskite photo transistors assisted by ferroelectric dielectrics

2018 ◽  
Vol 6 (46) ◽  
pp. 12714-12720 ◽  
Author(s):  
Haoliang Wang ◽  
Yan Chen ◽  
Engliang Lim ◽  
Xudong Wang ◽  
Sijian Yuan ◽  
...  
Keyword(s):  
High Performance ◽  
Lead Free ◽  
Two Dimensional ◽  
Ferroelectric Polymer

With the assistance of a ferroelectric field created by a ferroelectric polymer, the performance of perovskite photo transistors is significantly improved.

High performance lead free ferroelectric ATiO3/SnTiO3 superlattices

2013 ◽  
Vol 103 (6) ◽  
pp. 062905 ◽  
Author(s):  
Rui-Zhi Zhang ◽  
Da-Wei Wang ◽  
Fei Li ◽  
Hong-Jun Ye ◽  
Xiao-Yong Wei ◽  
...  
Keyword(s):  
High Performance ◽  
Lead Free

Ultra High performance, lead free Bi2WO6: P(VDF-TrFE) based triboelectric nanogenerator for self-powered sensor and smart electronic applications

2022 ◽  
Author(s):  
Dhiraj Bharti ◽  
Sushmitha Veeralingam ◽  
Sushmee Badhulika
Keyword(s):  
Output Power ◽  
Power Supply ◽  
High Performance ◽  
Lead Free ◽  
Triboelectric Nanogenerator ◽  
High Output Power ◽  
Self Powered ◽  
Triboelectric Nanogenerators ◽  
High Output

Obtaining sustainable, high output power supply from triboelectric nanogenerators still remains a major issue which restricts their widespread use in self-powered electronic applications. In this work, an ultra-high performance, non-toxic,...

Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 000631-000649
Author(s):  
Matthew A Thorseth ◽  
Mark Scalisi ◽  
Inho Lee ◽  
Sang-Min Park ◽  
Yil-Hak Lee ◽  
...  
Keyword(s):  
High Performance ◽  
Performance Criteria ◽  
Lead Free ◽  
Lead Free Solder ◽  
Market Demand ◽  
Feature Size ◽  
Deposition Rates ◽  
Cu Pillar ◽  
Free Solder ◽  
Pure Cu

Increasing market demand for portable high-performance electronic devices is requiring an increase in the I/O density in the chip packaging used to make these products. Flip-chip interconnects that enable advanced packaging utilize a C4 bumping process with lead-free solder to make the chip interconnection. However, with the decreasing chip size and tighter I/O pitch requirements that are needed to realize high-performance, Cu pillar plating has emerged as an enabling technology to meet the technical demands. Cu pillars, capped with a lead-free solder, allow for increased I/O density while still maintaining the standoff needed for proper thermal and electrical performance of stacked chips. With this realized performance, there is expected to be a significant increase in capacity of Cu pillar in the industry, requiring electrolytic Cu plating products with fast deposition rates in order to decrease wafer plating time and increase throughput. In this paper, Cu electroplating products are evaluated for plating performance at increased deposition rates for Cu pillar applications ranging from micropillar (<20 μm feature size), to standard pillar (20 – 75 μm feature size), redistribution layer (RDL) wiring, and the emerging fan-out wafer level packaging (FO-WLP), which encompasses megapillars (>150 μm feature sizes) as well as stacked via RDL designs. The chief performance criteria for evaluation is the ability to increase deposition rates while maintaining feature height uniformity, smooth and uniform feature morphology, and ability to plate a wide variety of feature sizes and shapes. Additionally, performance of these products is assessed on their ability to plate highly pure Cu deposits which enable void-free integration with lead-free solder without the need of (but is compatible with) a cost-added barrier layer.

Sign in / Sign up

Export Citation Format

Share Document