Buildup of Polymer/Au Nanoparticle Multilayer Thin Films Based on Hydrogen Bonding

2000 ◽  
Vol 12 (11) ◽  
pp. 3392-3396 ◽  
Author(s):  
Encai Hao ◽  
Tianquan Lian
Keyword(s):  
Thin Films ◽  
Hydrogen Bonding ◽  
Au Nanoparticle ◽  
Multilayer Thin Films

Stabilization of Hydrogen-Bonded Poly(N-isopropylacrylamide) Multilayers by a Dual Electrostatic/Hydrogen Bonding Copolymer

2005 ◽  
Vol 58 (6) ◽  
pp. 442 ◽  
Author(s):  
John F. Quinn ◽  
Frank Caruso
Keyword(s):  
Thin Films ◽  
Hydrogen Bonding ◽  
Electrostatic Interactions ◽  
Ph Stability ◽  
Multilayer Thin Films ◽  
Film Morphology ◽  
Styrene Sulfonate ◽  
Allylamine Hydrochloride ◽  
Multilayer Assemblies ◽  
Poly Styrene Sulfonate

Multilayer thin films were prepared based on hydrogen bonding between poly(N-isopropylacrylamide) (PNiPAAm), and poly(styrene sulfonate-co-maleic acid) (PSSMA). Since PSSMA is capable of associating with other polymers through both hydrogen bonding and electrostatic interactions, multilayer assemblies incorporating PSSMA, PNiPAAm, and intercalated poly(allylamine hydrochloride) (PAH) layers were also prepared. Intercalated PAH layers were included to improve the pH stability of the film by introducing electrostatic linkages into the assembly. Film construction was studied as a function of pH of the deposition solution and the number of inserted PAH layers. Film morphology varied significantly with incorporation of PAH into the film. It was also demonstrated that by intercalating several PAH layers within the PNiPAAm/PSSMA assembly, the pH stability of the films at pH 5.8 could be substantially improved.

A Hydrogen-Bonding Based Approach to Fabricate Polymer/Inorganic Nanoparticle Multilayer Film

2000 ◽  
Vol 648 ◽  
Author(s):  
Encai Hao ◽  
Tianquan Lian
Keyword(s):  
Thin Films ◽  
Hydrogen Bonding ◽  
Functional Groups ◽  
Multilayer Film ◽  
Particle Surface ◽  
Inorganic Nanoparticles ◽  
Multilayer Thin Films ◽  
Layer By Layer ◽  
Inorganic Nanoparticle ◽  
Developed Surface

AbstractA new hydrogen-bonding based route for layer-by-layer fabrication of polymer/inorganic nanoparticle multilayer thin films was developed. Surface modification of inorganic nanoparticles can provide functional groups on the particle surface, e.g. pyridine, carboxyl, and flavin. A polymer/inorganic nanoparticle multilayer film can be fabricated in a layer-by-layer manner using the hydrogen-bonding interaction between the functional groups on the surface of nanoparticles and polymers. The multilayer buildup was monitored by UV-visible spectroscopy, which showed a linear increase of the film absorbance with the number of adsorbed nanoparticle layers. FTIR spectroscopy was used to verify hydrogen bonding between polymer and nanoparticles, which is believed to be the driving force for the formation of polymer/nanoparticle multilayer thin films.

scholarly journals Stiff and Transparent Multilayer Thin Films Prepared Through Hydrogen-Bonding Layer-by-Layer Assembly of Graphene and Polymer

2016 ◽  
Vol 26 (13) ◽  
pp. 2143-2149 ◽  
Author(s):  
Fangming Xiang ◽  
Dorsa Parviz ◽  
Tara M. Givens ◽  
Ping Tzeng ◽  
Eric M. Davis ◽  
...  
Keyword(s):  
Thin Films ◽  
Hydrogen Bonding ◽  
Bonding Layer ◽  
Multilayer Thin Films ◽  
Layer By Layer ◽  
Layer By Layer Assembly ◽  
Layer Assembly

Characterization of reactive phase formation in sputter-deposited Ni/Al multilayer thin films using TEM

1996 ◽  
Vol 54 ◽  
pp. 1000-1001
Author(s):  
G. Lucadamo ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Dark Field ◽  
Nickel Layer ◽  
Multilayer Thin Films ◽  
Cross Sectional ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
Constant Heating

The subject of reactive phase formation in multilayer thin films of varying periodicity has stimulated much research over the past few years. Recent studies have sought to understand the reactions that occur during the annealing of Ni/Al multilayers. Dark field imaging from transmission electron microscopy (TEM) studies in conjunction with in situ x-ray diffraction measurements, and calorimetry experiments (isothermal and constant heating rate), have yielded new insights into the sequence of phases that occur during annealing and the evolution of their microstructure.In this paper we report on reactive phase formation in sputter-deposited lNi:3Al multilayer thin films with a periodicity A (the combined thickness of an aluminum and nickel layer) from 2.5 to 320 nm. A cross-sectional TEM micrograph of an as-deposited film with a periodicity of 10 nm is shown in figure 1. This image shows diffraction contrast from the Ni grains and occasionally from the Al grains in their respective layers.

The use of transmission and analytical electron microscopy in studying reactions and phase transformations in thin film

1993 ◽  
Vol 51 ◽  
pp. 842-843
Author(s):  
K. Barmak
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Phase Transformations ◽  
Analytical Electron Microscopy ◽  
Ex Situ ◽  
Multilayer Thin Films ◽  
Absolute Concentration ◽  
Analytical Electron ◽  
Deposition Step

Generally, processing of thin films involves several annealing steps in addition to the deposition step. During the annealing steps, diffusion, transformations and reactions take place. In this paper, examples of the use of TEM and AEM for ex situ and in situ studies of reactions and phase transformations in thin films will be presented.The ex situ studies were carried out on Nb/Al multilayer thin films annealed to different stages of reaction. Figure 1 shows a multilayer with dNb = 383 and dAl = 117 nm annealed at 750°C for 4 hours. As can be seen in the micrograph, there are four phases, Nb/Nb3-xAl/Nb2-xAl/NbAl3, present in the film at this stage of the reaction. The composition of each of the four regions marked 1-4 was obtained by EDX analysis. The absolute concentration in each region could not be determined due to the lack of thickness and geometry parameters that were required to make the necessary absorption and fluorescence corrections.

TEM studies of solid-state reactions in sputter-deposited Nb/Al multilayer thin films

1996 ◽  
Vol 54 ◽  
pp. 1020-1021
Author(s):  
F. Ma ◽  
S. Vivekanand ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Stoichiometric Composition ◽  
Analytical Electron Microscopy ◽  
Grain Structure ◽  
Solid State Reactions ◽  
Multilayer Thin Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sputter Deposited

Solid state reactions in sputter-deposited Nb/Al multilayer thin films have been studied by transmission and analytical electron microscopy (TEM/AEM), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). The Nb/Al multilayer thin films for TEM studies were sputter-deposited on (1102)sapphire substrates. The periodicity of the films is in the range 10-500 nm. The overall composition of the films are 1/3, 2/1, and 3/1 Nb/Al, corresponding to the stoichiometric composition of the three intermetallic phases in this system.Figure 1 is a TEM micrograph of an as-deposited film with periodicity A = dA1 + dNb = 72 nm, where d's are layer thicknesses. The polycrystalline nature of the Al and Nb layers with their columnar grain structure is evident in the figure. Both Nb and Al layers exhibit crystallographic texture, with the electron diffraction pattern for this film showing stronger diffraction spots in the direction normal to the multilayer. The X-ray diffraction patterns of all films are dominated by the Al(l 11) and Nb(l 10) peaks and show a merging of these two peaks with decreasing periodicity.

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

scholarly journals Structural, Optical and Electrical Properties of Al+MoO3 and Au+MoO3 Thin Films Prepared by Magnetron Codeposition

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 766
Author(s):  
Tihomir Car ◽  
Ivan Jakovac ◽  
Ivana Šarić ◽  
Sigrid Bernstorff ◽  
Maja Micetic
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Au Nanoparticle ◽  
Content Increase ◽  
Optical And Electrical Properties ◽  
Volume Percentage ◽  
Sputtering Deposition ◽  
Nanoparticle Formation ◽  
Al Content ◽  
Sputtering Power

Structural, optical and electrical properties of Al+MoO3 and Au+MoO3 thin films prepared by simultaneous magnetron sputtering deposition were investigated. The influence of MoO3 sputtering power on the Al and Au nanoparticle formation and spatial distribution was explored. We demonstrated the formation of spatially arranged Au nanoparticles in the MoO3 matrix, while Al incorporates in the MoO3 matrix without nanoparticle formation. The dependence of the Au nanoparticle size and arrangement on the MoO3 sputtering power was established. The Al-based films show a decrease of overall absorption with an Al content increase, while the Au-based films have the opposite trend. The transport properties of the investigated films also are completely different. The resistivity of the Al-based films increases with the Al content, while it decreases with the Au content increase. The reason is a different transport mechanism that occurs in the films due to their different structural properties. The choice of the incorporated material (Al or Au) and its volume percentage in the MoO3 matrix enables the design of materials with desirable optical and electrical characteristics for a variety of applications.

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