Low-temperature reaction of buried metal-silicon interfaces: the evolution of interfacial structure

1992 ◽  
Vol 4 (2) ◽  
pp. 473-478 ◽  
Author(s):  
Thomas Novet ◽  
John M. McConnell ◽  
David C. Johnson
2020 ◽  
pp. 146808742096933
Author(s):  
Xiangyu Meng ◽  
Sicheng Liu ◽  
Jingchen Cui ◽  
Jiangping Tian ◽  
Wuqiang Long ◽  
...  

A novel method called high-pressure air (HPA) jet controlled compression ignition (JCCI) based on the compound thermodynamic cycle was investigated in this work. The combustion process of premixed mixture can be controlled flexibly by the high-pressure air jet compression, and it characterizes the intensified low-temperature reaction and two-stage high-temperature reaction. The three-dimensional (3D) computational fluid dynamics (CFD) numerical simulation was employed to study the emission formation process and mechanism, and the effects of high-pressure air jet temperature and duration on emissions were also investigated. The simulation results showed that the NOx formation is mainly affected by the first-stage high-temperature reaction due to the higher reaction temperature. Overall, this combustion mode can obtain ultra-low NOx emission. The second-stage high-temperature reaction plays an important role in the CO and THC formation caused by the mixing effect of the high-pressure air and original in-cylinder mixture. The increasing air jet temperature leads to a larger high-temperature in-cylinder region and more fuel in the first-stage reaction, and therefore resulting in higher NOx emission. However, the increasing air jet temperature can significantly reduce the CO and THC emissions. For the air jet duration comparisons, both too short and too long air jet durations could induce higher NOx emission. A higher air jet duration would result in higher CO emission due to the more high-pressure air jet with relatively low temperature.


1994 ◽  
Vol 89 (5) ◽  
pp. 425-427 ◽  
Author(s):  
Adly H. El Sayed ◽  
V. Calzona ◽  
M.R. Cimberle ◽  
R. Eggenhoffner ◽  
C. Ferdeghini ◽  
...  

2018 ◽  
Vol 20 (40) ◽  
pp. 25951-25958 ◽  
Author(s):  
Octavio Roncero ◽  
Alexandre Zanchet ◽  
Alfredo Aguado

Is the rise of the rate constant measured in laval expansion experiments of OH with organic molecules at low temperatures due to the reaction between the reactants or due to the formation of complexes with the buffer gas?


IUCrJ ◽  
2019 ◽  
Vol 6 (1) ◽  
pp. 128-135 ◽  
Author(s):  
Aroa Morán-Ruiz ◽  
Aritza Wain-Martin ◽  
Alodia Orera ◽  
María Luisa Sanjuán ◽  
Aitor Larrañaga ◽  
...  

The first fluorination of the cuspidine-related phases of Ln4(Al2O7□)O2 (where Ln = Sm, Eu, Gd) is reported. A low-temperature reaction with poly(vinylidene difluoride) lead to the fluorine being substituted in place of oxygen and inserted into the vacant position between the dialuminate groups. X-ray photoelectron spectroscopy shows the presence of the F 1s photoelectron together with an increase in Al 2p and rare-earth 4d binding energies supporting F incorporation. Energy-dispersive X-ray spectroscopy analyses are consistent with the formula Ln4(Al2O6F2)O2, confirming that substitution of one oxygen by two fluoride atoms has been achieved. Rietveld refinements show an expansion in the cell upon fluorination and confirm that the incorporation of fluoride in the Ln4(Al2O7□)O2 structure results in changes in Al coordination from four to five. Thus, the isolated tetrahedral dialuminate Al2O7 groups are converted to chains of distorted square-based pyramids. These structural results are also discussed based on Raman spectra.


1967 ◽  
Vol 23 (3) ◽  
pp. 208-209
Author(s):  
D. B. Millar ◽  
R. F. Steiner

Metals ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 791 ◽  
Author(s):  
Kaipeng Wang ◽  
Fengjiang Wang ◽  
Ying Huang ◽  
Kai Qi

Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag3Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu6Sn5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.


2011 ◽  
Vol 239-242 ◽  
pp. 1118-1122 ◽  
Author(s):  
Ping Ke Yan ◽  
Bin Wang ◽  
Yu Juan Gao

In this paper, nesquehonite whiskers were synthesized by low-temperature aqueous solution method, and the impacts of reaction temperature, reaction time and surfactant dosage and other factors on the maximum whisker length and high aspect ratios of nesquehonite whiskers were also investigated. Results showed that under the conditions that the reaction temperature was 40 – 50 °C the reaction time was 50 – 60min and the amount of surfactant dosage was 1% (by mass), high aspect ratios nesquehonite whisker products can be synthesized. On this basis, growth mechanism of the nesquehonite whiskers was discussed.


ChemInform ◽  
2011 ◽  
Vol 42 (15) ◽  
pp. no-no
Author(s):  
K. G. Sanjaya Ranmohotti ◽  
Elisha Josepha ◽  
Jonglak Choi ◽  
Jianxia Zhang ◽  
John B. Wiley

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