Bis(perfluorophenyl)azides: efficient crosslinking agents for deep-UV and electron beam lithography

1990 ◽  
Vol 2 (6) ◽  
pp. 631-633 ◽  
Author(s):  
Sui Xiong Cai ◽  
J. C. Nabity ◽  
M. N. Wybourne ◽  
John F. W. Keana
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Deep Uv ◽  
Crosslinking Agents

Highly etch resistant, negative resist for deep-UV and electron beam lithography

1990 ◽  
Author(s):  
Dennis R. McKean ◽  
Nicholas J. Clecak ◽  
Lester A. Pederson, Sr.
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Deep Uv

A Simple Fabrication Process of T-Shaped Gates Using a Deep-UV/Electron-Beam/Deep-UV Tri-Layer Resist System and Electron-Beam Lithography

1996 ◽  
Vol 35 (Part 1, No. 12B) ◽  
pp. 6440-6446 ◽  
Author(s):  
Yeong-Lin Lai ◽  
Edward Y. Chang ◽  
Chun-Yen Chang ◽  
Hung-Pin D. Yang ◽  
K. Nakamura ◽  
...  
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Fabrication Process ◽  
Deep Uv

Chemically amplified deep UV resists for electron-beam lithography applications

2001 ◽  
Author(s):  
Hsuen-Li Chen ◽  
Chien-Kui Hsu ◽  
Ben-Chang Chen ◽  
Fu-Hsiang Ko ◽  
Jung-Yen Yang ◽  
...  
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Chemically Amplified ◽  
Deep Uv

Lithography below 100 nm

1983 ◽  
Vol 41 ◽  
pp. 96-99
Author(s):  
L. D. Jackel
Keyword(s):  
Spatial Distribution ◽  
Electron Beam ◽  
Electron Scattering ◽  
Electron Beam Lithography ◽  
Substrate Material ◽  
Local Electron ◽  
Electron Dose ◽  
Positive Resist ◽  
Exposure Process

Most production electron beam lithography systems can pattern minimum features a few tenths of a micron across. Linewidth in these systems is usually limited by the quality of the exposing beam and by electron scattering in the resist and substrate. By using a smaller spot along with exposure techniques that minimize scattering and its effects, laboratory e-beam lithography systems can now make features hundredths of a micron wide on standard substrate material. This talk will outline sane of these high- resolution e-beam lithography techniques.We first consider parameters of the exposure process that limit resolution in organic resists. For concreteness suppose that we have a “positive” resist in which exposing electrons break bonds in the resist molecules thus increasing the exposed resist's solubility in a developer. Ihe attainable resolution is obviously limited by the overall width of the exposing beam, but the spatial distribution of the beam intensity, the beam “profile” , also contributes to the resolution. Depending on the local electron dose, more or less resist bonds are broken resulting in slower or faster dissolution in the developer.

Fabrication of Si photonic waveguides by electron beam lithography using improved proximity effect correction

2020 ◽  
Vol 59 (12) ◽  
pp. 126502
Author(s):  
Moataz Eissa ◽  
Takuya Mitarai ◽  
Tomohiro Amemiya ◽  
Yasuyuki Miyamoto ◽  
Nobuhiko Nishiyama
Keyword(s):  
Electron Beam ◽  
Proximity Effect ◽  
Electron Beam Lithography ◽  
Photonic Waveguides ◽  
Proximity Effect Correction

Salicidation process for submicrometre gate MOSFET fabrication using a resistless electron beam lithography process

1999 ◽  
Vol 35 (15) ◽  
pp. 1283 ◽  
Author(s):  
S. Michel ◽  
E. Lavallée ◽  
J. Beauvais ◽  
J. Mouine
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Lithography Process

scholarly journals Nanooptical elements for visual verification

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Alexander Goncharsky ◽  
Anton Goncharsky ◽  
Dmitry Melnik ◽  
Svyatoslav Durlevich
Keyword(s):  
Electron Beam ◽  
Electron Beam Lithography ◽  
Mass Production ◽  
Optical Element ◽  
Visual Image ◽  
Zero Order ◽  
Diffractive Optical Elements ◽  
Optical Elements ◽  
Standard Equipment ◽  
Diffractive Element

AbstractThis paper focuses on the development of flat diffractive optical elements (DOEs) for protecting banknotes, documents, plastic cards, and securities against counterfeiting. A DOE is a flat diffractive element whose microrelief, when illuminated by white light, forms a visual image consisting of several symbols (digits or letters), which move across the optical element when tilted. The images formed by these elements are asymmetric with respect to the zero order. To form these images, the microrelief of a DOE must itself be asymmetric. The microrelief has a depth of ~ 0.3 microns and is shaped with an accuracy of ~ 10–15 nm using electron-beam lithography. The DOEs developed in this work are securely protected against counterfeiting and can be replicated hundreds of millions of times using standard equipment meant for the mass production of relief holograms.

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